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'''Feedback to this page''': '''[mailto:thinfilm@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Sputter_coater click here]'''
'''Feedback to this page''': '''[mailto:thinfilm@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Sputter_coater click here]'''


[[Category: Equipment|Thin film]]
[[Category: Equipment|Thin film]]
[[Category: Thin Film Deposition]]
[[Category: Thin Film Deposition]]


<!-- = The Hummer Sputter coater =
[[image:Hummer.jpg|300x300px|right|thumb|The Hummer sputter coater located in service area Cx1]]
The Hummer sputter coater is used to sputter a thin gold layer on different small samples (up to 100 mm wafers).
One of the most effective ways to counter the problems with charging on non-conducting samples during SEM investigations is to apply a conducting coating to the surface. The Hummer sputter coater is an instrument that allows you to coat small samples with a gold layer. When securely grounded, i.e. connected electrically with a sample holder using aluminium tape or clamps the gold layer will effectively eliminate all charging problems in the SEM.
The Hummer sputter coater is located in servie area Cx1 in the clearoom.
'''The user manual and contact information can be found in LabManager:'''
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=143  Hummer sputter coater]
==Process knowledge==
*[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold|Deposition of gold]]
==Overview of the performance of the Hummer sputter coater and some process related parameters==
{| border="2" cellspacing="0" cellpadding="10"
|-
!style="background:silver; color:black;" align="left"|Purpose
|style="background:LightGrey; color:black"| ||style="background:WhiteSmoke; color:black"|
*Gold sputter coating of different samples mainly before SEM characterization (see purpose)
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Film thickness||style="background:WhiteSmoke; color:black"|
*10 Å - ? 
|-
|style="background:LightGrey; color:black"|Deposition rate
|style="background:WhiteSmoke; color:black"|
*Not measured
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Process Temperature
|style="background:WhiteSmoke; color:black"|
*Room temperature
|-
|style="background:LightGrey; color:black"|Process pressure
|style="background:WhiteSmoke; color:black"|
*150 mTorr
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*One 100 mm wafer
*Several smaller samples
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*All materials allowed in the cleanroom
|-
|-
|}
= The Balzer Sputter coater =
[[image:20140117_145654.jpg|300x300px|right|thumb|The Hummer sputter located coater in the 346 basement]]
The Balzer sputter coater is used to sputter a thin gold layer on different small samples (smaller than 100 mm wafers).
One of the most effective ways to counter the problems with charging on non-conducting samples during SEM investigations is to apply a conducting coating to the surface. The Hummer sputter coater is an instrument that allows you to coat small samples with a gold layer. When securely grounded, i.e. connected electrically with a sample holder using aluminium tape or clamps the gold layer will effectively eliminate all charging problems in the SEM.
The Balzer sputter coater is located in the 346 basement, room 907 (next to the SEM Jeol) .
'''The user manual and contact information can be found in LabManager:'''
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=303  Balzer sputter coater]
==Process knowledge==
*[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold|Deposition of gold]]
==Overview of the performance of the Hummer sputter coater and some process related parameters==
{| border="2" cellspacing="0" cellpadding="10"
|-
!style="background:silver; color:black;" align="left"|Purpose
|style="background:LightGrey; color:black"| ||style="background:WhiteSmoke; color:black"|
*Gold sputter coating of different samples mainly before SEM characterization (see purpose)
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Performance
|style="background:LightGrey; color:black"|Film thickness||style="background:WhiteSmoke; color:black"|
*10 Å - > 25 nm 
|-
|style="background:LightGrey; color:black"|Deposition rate
|style="background:WhiteSmoke; color:black"|
*Not measured
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Process Temperature
|style="background:WhiteSmoke; color:black"|
*Room temperature
|-
|style="background:LightGrey; color:black"|Process pressure
|style="background:WhiteSmoke; color:black"|
*5*10<sup> -2</sup> mbar
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*One sample smaller than a 100 mm wafer
*Several smaller samples
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*All materials allowed in the cleanroom
*Samples from outside the cleanroom, including biological samples
|-
|-
|}
-->


= The Sputter coater 03 (Cressington) =
= The Sputter coater 03 (Cressington) =
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==Process knowledge==
==Process knowledge==


*[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold|Deposition of go ld]]
*[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold|Deposition of Au]]
 
*[[Specific_Process_Knowledge/Thin film deposition/Deposition of Tungsten/Sputtering of W in Sputter Coater 3|Deposition of W]]


==Overview of the performance of the Sputter coater 03 (Cressington) and some process related parameters==
==Overview of the performance of the Sputter coater 03 (Cressington) and some process related parameters==
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|-  
|-  
|}
|}
 
<br>
<br>
= The Sputter coater 04 (Agar Scientific) =
= The Sputter coater 04 (Agar Scientific) =


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Argon is used as a sputter gas to generate a plasma in the sputter chamber and to vent the chamber.  
Argon is used as a sputter gas to generate a plasma in the sputter chamber and to vent the chamber.  


The Sputter coater 04 (Agar Scientific) is located in the cleanroom Cx1.
The Sputter coater 04 (Agar Scientific) is located in the cleanroom Cx1  




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==Process knowledge==
==Process knowledge==


*[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold|Deposition of go ld]]
*[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold|Deposition of gold ]]


==Overview of the performance of the Sputter coater 04 (Agar Scientific) and some process related parameters==
==Overview of the performance of the Sputter coater 04 (Agar Scientific) and some process related parameters==