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''This page is written by DTU Nanolab  internal''
[[Category: Equipment |Thermal BCB]]
[[Category: Equipment |Thermal BCB]]
[[Category: Thermal process|BCB]]
[[Category: Thermal process|BCB]]


== BCB Curing Oven ==
== BCB Curing Oven ==
[[image:BCB oven.jpeg|350x350px|right|thumb|The BCB Curing Oven. Positioned in the A-4 room]]
[[image:BCB oven.jpeg|350x350px|right|thumb|The BCB Curing Oven. Positioned in room Cx1/ Photo: DTU Nanolab internal]]


The BCB Curing Oven is mainly used for curing of BCB (bisbenzocyclobutene) and for alloying of metals in a nitrogen atmosphere.
The BCB Curing Oven is mainly used for curing of BCB (bisbenzocyclobutene, cyclotene®) and for alloying of some metals in a nitrogen atmosphere.


During processing the furnace is rapidly heated by use of eight halogen lamps situated below the sample.  
During processing the oven is rapidly heated by use of eight halogen lamps situated below the sample. The maximum allowed temperature is 450 <sup>o</sup>C.
The furnace is purged with a nitrogen flow (high or low flow). Samples are processed at atmospheric pressure or at vacuum.
 
The oven is purged with a nitrogen flow (high or low flow). Samples are processed at atmospheric pressure or at vacuum.




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Here are some of the standard processes used in the BCB Curing Oven.
Here are some of the standard processes used in the BCB Curing Oven.


=== BCB curing:===
=== BCB curing===


* Long curing at 210°C: BCB210AL.PDF/[[Media:BCB210BL.PDF|BCB210BL.PDF]]
An example of a curing recipe (BCB250BL.PDF) for a long curing process at 250°C is shown below.
* Long curing at 250°C: BCB250AL.PDF/[[Media:BCB250BL.PDF|BCB250BL.PDF]]


Content of BCB250BL.PDF: (the file BCB210BL.PDF is identical except that the max temperature is 210 instead of 250°C)
Content of BCB250BL.PDF:  
<pre>
<pre>
;
;
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</pre>
</pre>


The AL/BL processes are (should be) identical except for a (2x) pump/purge cycle in the beginning of the BL processes.


===General processes===
===General processes===


There are a number of general processes named DxxxCyyy.PDF.  
There are a number of general processes on the oven named DxxxCyyy.PDF.  


The Dxxx is the set temperature (in °C) and the Cyyy is the time (in minutes) at the set temperature.
The "Dxxx" in the recipe is the set temperature (in °C) and the "Cyyy" is the time (in minutes) at the set temperature.


The oven heats to the set temperature (xxx) in 5 mins and then stays at the temperature (xxx) for a time (yyy) after which it cools to room temperature as fast as possible.
The oven heats to the set temperature (xxx) in 5 mins and then stays at the temperature (xxx) for a time (yyy), after which it cools to room temperature as fast as possible.


The program sequence looks like this for the file D200C060.PDF:
The program sequence looks like this for the file D200C060.PDF:
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|style="background:LightGrey; color:black"|Temperature
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*22 - 450<sup>o</sup>C
*Room temperature - 450<sup>o</sup>C
|-
|-
|style="background:LightGrey; color:black"|Nitrogen flows
|style="background:LightGrey; color:black"|Nitrogen flows
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*Quartz
*Quartz
*Resist (prebaked)
*Resist (prebaked)
*Metal (only Al, Ni, Ge and Au)
*Metals on Material list 1, 2 and 3 (see the cross contamination information in LabManager)
|-  
|-  
|}
|}
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