Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4: Difference between revisions

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+{{cc-nanolab}}
 '''Feedback to this page:
-[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus click here]'''
+[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-4 click here]'''
 [[Category: Equipment |Etch DRIE]]
 [[Category: Etch (Dry) Equipment|DRIE]]
+<br>
+==Pegasus 4 - 150mm silicon oxide and silicon nitride etching==
+[[Image:Peg3and4 front 2.JPG |frame|right|x250px|The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, {{photo1}}]]
+DRIE-Pegasus 4 is dedicated Silicon oxide and Silicon nitride etching. It is originally designed for silicon etching but gas mass flow controllers has been changed to optimize silicon oxide and silicon nitride etching. The system is setup for 6" wafers. Sampler samples has to be bonded to a 6" carrier to be etched in the system.
+'''The user manual and contact information can be found in LabManager:'''
+<!-- give the link to the equipment info page in LabManager: -->
+[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=456  DRIE Pegasus 4 in LabManager - requires login]
+== Process information ==
+'''Standard recipes'''
+*[[/Barc Etch|Barc Etch]]
+*[[/SiO2 Etch|SiO2 Etch]]
+*[[/Silicon Nitride Etch|Silicon Nitride Etch]]
+*[[/Nitride Etch|Nitride etch with SiO2 etch recipes]]
+*[[/Slow etch|Slow etch of silicon nitride and silicon oxide]]
+=== Wafer bonding ===
-'''The tool is currently being installed - we hope that it will be available by early 2019.
+To find information on how to bond wafers or chips to a carrier wafer, click [[Specific Process Knowledge/Etch/DryEtchProcessing/Bonding| here]].
-'''