Specific Process Knowledge/Etch/Etching of Aluminium: Difference between revisions
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==Etching of Aluminium== | ==Etching of Aluminium== | ||
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|-style="background:silver; color:black" | |-style="background:silver; color:black" | ||
! | ! | ||
![[Specific Process Knowledge/Etch/Wet Aluminium Etch| | ![[Specific Process Knowledge/Etch/Wet Aluminium Etch|Aluminium Etch]] | ||
![[ | ![[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual|Developer TMAH manual]] | ||
![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher|ICP metal]] | ![[Specific_Process_Knowledge/Etch/ICP_Metal_Etcher|ICP metal]] | ||
![[Specific_Process_Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE (Ionfab300+)]] | ![[Specific_Process_Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE (Ionfab300+)]] | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!Generel description | !Generel description | ||
|Wet etch of | |Wet etch of Al | ||
|Wet etch | |Wet etch/removal: TMAH<br> | ||
Mainly used for removing Al on e-beam resist after e-beam exposure, see process flow [[Specific_Process_Knowledge/Lithography/EBeamLithography#Aluminum_coating| here]] | |||
|Dry plasma etch of Al | |Dry plasma etch of Al | ||
|Sputtering of Al - pure physical etch | |Sputtering of Al - pure physical etch. | ||
|- | |- | ||
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!Etch rate range | !Etch rate range | ||
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*~100nm/min | *~60-100nm/min | ||
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*~ | *~30nm/min (pure Al) | ||
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*~350 nm/min (depending on features size and etch load) | *~350 nm/min (depending on features size and etch load) | ||
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!Substrate size | !Substrate size | ||
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* | *100 mm wafers (in bath) | ||
*150 mm wafers (in bath) | |||
*Any size (in beaker) | |||
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* | *Chips (6-60 mm) | ||
*100 mm wafers | |||
*150 mm wafers | |||
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*smaller pieces on a carrier wafer | *smaller pieces on a carrier wafer | ||
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|-style="background:WhiteSmoke; color:black" | |-style="background:WhiteSmoke; color:black" | ||
!'''Allowed materials''' | !'''Allowed materials''' | ||
|In 'Aluminium Etch' bath: | |||
*See Cross Contamination Sheet for [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=381 Aluminium Etch] bath (require login) | |||
In beaker: | |||
*Any material | |||
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* | *Every thing that is allowed in the Developer: TMAH Manual | ||
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*Silicon | *Silicon |
Latest revision as of 09:48, 31 May 2024
Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.
All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.
Feedback to this page: click here
Etching of Aluminium
Etching of aluminium can be done either by wet etch, dry etch or by sputtering with ions.
Comparison of Aluminium Etch Methods
Aluminium Etch | Developer TMAH manual | ICP metal | IBE (Ionfab300+) | |
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Generel description | Wet etch of Al | Wet etch/removal: TMAH Mainly used for removing Al on e-beam resist after e-beam exposure, see process flow here |
Dry plasma etch of Al | Sputtering of Al - pure physical etch. |
Etch rate range |
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Etch profile |
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Substrate size |
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Smaller pieces glued to carrier wafer
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Allowed materials | In 'Aluminium Etch' bath:
In beaker:
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