Specific Process Knowledge/Thermal Process/D4 III-V Oven: Difference between revisions

Latest revision as of 13:00, 17 April 2023

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EXPIRED. The D4 III-V Oven has been removed from the cleanroom August 2019. At the moment there is not replacement for it.

III-V Oven (D4)

The III-V Oven (D4) is used for wet thermal oxidation of III-V devices, for instance for lateral oxidation of thin AlGaAs layers to defined apertures in light-limiting diodes.

The furnace is an old Tempress horizontal furnace. The quartz boat is loaded manually into the furnace by use of a push rod. The furnace is cooled down to room temperature when it is not being used.

Before use, devices have to be cleaned. A short BHF dip can be used to remove any native oxide which can be difficult to penetrate by a wet thermal oxidation.

Please check the cross contamination information in LabManager before you use the furnace.

The user manual and contact information can be found in LabManager:

III-V Oven (D4)

Process knowledge

Standard wet oxidation recipe on the III-V furnace

Overview of the performance of the III-V Oven and some process related parameters

Purpose		Wet oxidation of III-V dvices
Performance	Lateral oxidation rate	Very sample dependent
Process parameter range	Process temperature	420 ^oC
	Process pressure	1 atm
	Gasses on the system	N₂ (bobler) N₂
Substrates	Batch size	Several smaller samples (placed vertically on a quartz plate)
Substrates	Substrate materials allowed	III-V devices Silicon

@@ Line 1: / Line 1: @@
-'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/III-V_Process/III_V_thermal_processes/III_V_Oven click here]'''
+'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thermal_Process/D4_III-V_Oven click here]'''
+''This page is written by DTU Nanolab  internal''
+===<span style="color:Red">EXPIRED. The D4 III-V Oven has been removed from the cleanroom August 2019. At the moment there is not replacement for it.</span>===
+[[Category: Equipment |Thermal III-V ]]
+[[Category: Thermal process|III-V]]
+[[Category: Furnaces|III-V]]
 ==III-V Oven (D4)==
-[[Image:IIIV_Oven.jpg|thumb|450x450px|III-V Oven (D4). Positioned in cleanroom area F-3.]]
+[[Image:IIIV_Oven.jpg|thumb|450x450px|III-V Oven (D4). Positioned in cleanroom area F-3/ Photo: DTU Nanolab internal.]]
 The III-V Oven (D4) is used for wet thermal oxidation of III-V devices, for instance for lateral oxidation of thin AlGaAs layers to defined apertures in light-limiting diodes.
 The furnace is an old Tempress horizontal furnace. The quartz boat is loaded manually into the furnace by use of a push rod. The furnace is cooled down to room temperature when it is not being used.
 Before use, devices have to be cleaned. A short BHF dip can be used to remove any native oxide which can be difficult to penetrate by a wet thermal oxidation.
@@ Line 15: / Line 23: @@
 '''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=187 III-V Oven (D4)]'''
 ==Process knowledge==
-*[[Specific_Process_Knowledge/III-V_Process/III_V_thermal_processes/III_V_Oven/|Standard wet oxidation recipe on the III-V furnace]]
+*[[Specific_Process_Knowledge/Thermal_Process/Oxidation/Oxidation_on_III-V_furnace_(D4)|Standard wet oxidation recipe on the III-V furnace]]