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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development click here]'''
{{cc-nanolab}}


=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Development click here]'''


[[Category: Equipment|Lithography development]]
[[Category: Lithography|Development]]


==Coaters: Comparison Table==
__TOC__


{| border="2" cellspacing="0" cellpadding="2"
=Development Comparison Table=
 
{| class="wikitable"
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer-1 and Developer-2|Developer 1 and 2]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer-6inch|Developer-6inch]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#SU8-Developer|SU8-Developer]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer-TMAH|Developer-TMAH]]</b>
 
|-
!style="background:silver; width:100px; color:black;" align="center"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Coating and baking of
**AZ5214E resist
**AZ4562 resist
**E-beam resist
|style="background:WhiteSmoke; color:black"|
*Coating and baking of
**AZ5214E resist
**AZ4562 resist
**SU8 resist
|style="background:WhiteSmoke; color:black"|
*Coating and baking of
**SU8 resist
|style="background:WhiteSmoke; color:black"|
*In-line substrate HMDS priming
*Coating and baking of
**AZ MiR 701 (29cps) resist
**AZ nLOF 2020 resist
*Post-exposure baking at 110°C
 
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
|style="background:LightGrey; color:black"|Substrate handling
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
* Edge handling chuck
|style="background:WhiteSmoke; color:black"|
* Single substrate
* Non-vacuum chuck for fragile substrates
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
|-
|-
|style="background:LightGrey; color:black"|Permanent media
!
|style="background:WhiteSmoke; color:black"|
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
* AZ5214E resist
! [[Specific_Process_Knowledge/Lithography/Development/SU8_developer|Developer: SU8 (Wet bench)]]
* AZ4562 resist
! [[Specific_Process_Knowledge/Lithography/Development/manualEbeam_developer|Developer: E-beam 02]]
* Acetone for chuck cleaning
! [[Specific_Process_Knowledge/Lithography/Development/manualTMAH_developer|Developer: TMAH Manual 02]]
* Acetone for drip pan
! [[Specific_Process_Knowledge/Lithography/Development/UV_developer|Developer: TMAH UV-lithography]]
|style="background:WhiteSmoke; color:black"|
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer|Developer: TMAH Stepper]]
* AZ5214E resist
* PGMEA for edge bead removal
* Acetone for chuck cleaning
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701 (29cps) resist
* AZ nLOF 2020 resist
* PGMEA for backside rinse and edge-bead removal
* PGMEA for spinner bowl cleaning and vapor tip bath
|-
|-
|style="background:LightGrey; color:black"|Manual dispense option
! scope=row style="text-align: left;" | Purpose
|style="background:WhiteSmoke; color:black"|
|
* 2 automatic syringes
Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools
|style="background:WhiteSmoke; color:black"|
* yes
* pneumatic dispense for SU8 resist
|style="background:WhiteSmoke; color:black"|
* no


|-
<span style="color:red">Requires individual risk assessment for TMAH development!</span>
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|
|style="background:LightGrey; color:black"|Spindle speed
Development of:
|style="background:WhiteSmoke; color:black"|
*SU-8
*100-5000 rpm
|
|style="background:WhiteSmoke; color:black"|
Development of:
*100-5000 rpm
*ZEP 520A
|style="background:WhiteSmoke; color:black"|
*AR-P 6200.xx (CSAR)
*10 - 9990 rpm
|
|-
Development of:
|style="background:LightGrey; color:black"|Gyrset
*AZ nLOF
|style="background:WhiteSmoke; color:black"|
*AZ MiR 701
*optinal
|style="background:WhiteSmoke; color:black"|
*optinal
|style="background:WhiteSmoke; color:black"|
*no
 
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate  size
|style="background:WhiteSmoke; color:black"|
*50 mm wafers
*100 mm wafers
*150 mm wafers
|style="background:WhiteSmoke; color:black"|
*100 mm wafer
*150 mm wafer
|style="background:WhiteSmoke; color:black"|
*100 mm wafers
*150 mm wafers (tool change required)
|-
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*1-24
|style="background:WhiteSmoke; color:black"|
*1
|style="background:WhiteSmoke; color:black"|
*1-25
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except III-V materials
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except III-V materials
|style="background:WhiteSmoke; color:black"|
*Silicon
*Glass
|-
|}
 
<br clear="all" />
 
==Developer-1 and Developer-2==
[[Image:Developer1&2.jpg|300 × 300px|thumb|right|Developer-1 (right) and Developer-2 (left) are located in C-1]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer-1_and_Developer-2 click here]'''
 
Developer-1 and Developer-2
 
'''The user APV, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=62 Developer-1] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=63 Developer-2]'''
 
===Process information===
 
*Before using one of developer baths, please check the "Litho4_Dev-7up-KOH" logbook to find out when they were last used. A fresh bath can be reused without problems.
*The main rule is a developer made yesterday must be changed.
*Rinse substrates with water for 4-5 min. after development.
*Spin-dry substrates or dry with nitrogen gun after rinsing.
 
'''Standard development time using vigorous agitation:'''
 
'''AZ 5214E:'''
*1.5µm resist: 60 sec
*2.2µm resist: 70 sec
*4.2µm resist: 3 min
'''AZ 4562:'''
*10µm resist: 5 min
 
====Procedure for making a new developer====
 
1. 800ml "Developer AZ 351B" is mixed with 4000ml water in a special container in the fume hood.
 
2. Fill the bath with the developer mixture and heat it to 22 °C before use.
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Development of
*AZ 5214E
*AZ 5214E
*AZ 4562
*AZ 4562
|-
*DUV resists
!style="background:silver; color:black;" align="center" width="60"|Developer
|  
|style="background:LightGrey; color:black"|
Development of:
|style="background:WhiteSmoke; color:black" align="center"|
*AZ nLOF
AZ 351B diluted 1:5 in water
*AZ MiR 701
 
(NaOH and sodium borate salt)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
Submersion
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black" align="center"|
22°C
|-
|style="background:LightGrey; color:black"|Agitation
|style="background:WhiteSmoke; color:black" align="center"|
Manual
|-
|style="background:LightGrey; color:black"|Rinse
|style="background:WhiteSmoke; color:black" align="center"|
DI water
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center"|
* 100 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
Silicon, glass, and polymer substrates
 
Film or pattern of all types
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
1-8
|-
|}
 
<br clear="all" />
 
==Developer-6inch==
 
[[image:6inchDeveloper.jpg|300x300px|right|thumb|The Developer-6inch bench is located in E-5]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Developers#Developer-6inch click here]'''
 
The Developer-6inch bench...
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=189 LabManager]'''
 
===Process information===
 
'''Standard development time:'''
 
'''AZ 5214E:'''
*1.5µm resist: 60 sec
*2.2µm resist: 70 sec
*4.2µm resist: 3 min
'''AZ 4562:'''
*10µm resist: 5 min
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Development of
*AZ 5214E
*AZ 5214E
*AZ 4562
*AZ 4562
*DUV resists
Post-exposure baking
|
Development of:
*DUV resists
Post-exposure baking
|-
! scope=row style="text-align: left;" | Developer
| Process dependent
| mr-Dev 600 (PGMEA)
|
*ZED N-50
*AR 600-50
| AZ 726 MIF (2.38% TMAH in water)
| AZ 726 MIF (2.38% TMAH in water)
| AZ 726 MIF (2.38% TMAH in water)
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Developer
! scope=row style="text-align: left;" | Method
|style="background:LightGrey; color:black"|
| Submersion
|style="background:WhiteSmoke; color:black" align="center"|
| Submersion
AZ 351B diluted 1:5 in water
| Puddle
 
| Puddle
(NaOH and sodium borate salt)
| Puddle
| Puddle
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
! scope=row style="text-align: left;" | Handling
|style="background:LightGrey; color:black"|
|
|style="background:WhiteSmoke; color:black" align="center"|
Manual handling in beakers
Submersion
*Chip bucket
*Single wafer carrier
*Carrier for up to 5 wafers
|
*Chip bucket
*Single wafer carrier
*Carrier for up to 6 wafers
|
*Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
*Chip chuck for chips & 50 mm substrates
|
*Vacuum-free edge-grip chuck for 100 mm & 150 mm substrates
*Chip chuck for chips & 50 mm substrates
| Vacuum chuck
| Vacuum chuck
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
! scope=row style="text-align: left;" | Process temperature
|style="background:LightGrey; color:black"|Temperature
| Room temperature
|style="background:WhiteSmoke; color:black" align="center"|
| Room temperature
22°C
| Room temperature
| Room temperature
| Room temperature
| Room temperature
|-
|-
|style="background:LightGrey; color:black"|Agitation
! scope=row style="text-align: left;" | Process agitation
|style="background:WhiteSmoke; color:black" align="center"|
| No agitation allowed
Circulation and mechanical
| Magnetic stirrer
| Rotation
| Rotation
| Rotation
| Rotation
|-
|-
|style="background:LightGrey; color:black"|Rinse
! scope=row style="text-align: left;" | Process rinse
|style="background:WhiteSmoke; color:black" align="center"|
| Process dependent
DI water
| IPA
| IPA
| DI water
| DI water
| DI water
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
! scope=row style="text-align: left;" | Substrate size
|style="background:LightGrey; color:black"|Substrate size
|
|style="background:WhiteSmoke; color:black" align="center"|
* Chips
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
|
* Chips
* 50 mm wafers
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 150 mm wafers
|-
* 200 mm wafers
| style="background:LightGrey; color:black"|Allowed materials
|
|style="background:WhiteSmoke; color:black" align="center"|
* Chips (5mm to 2")
Silicon, glass, and polymer substrates
* 50 mm wafers
 
* 100 mm wafers
Film or pattern of all types
* 150 mm wafers
|-
* 200 mm wafers
|style="background:LightGrey; color:black"|Batch
|
|style="background:WhiteSmoke; color:black" align="center"|
* Chips (5mm to 50 mm)
1-25
* 100 mm wafers
|-
* 150 mm wafers
|}
|
 
* 100 mm wafers
<br clear="all" />
* 150 mm wafers
 
* 200 mm wafers (may require tool change)
==SU8-Developer==
|
[[Image:SU-8developer.jpg|300×300px|right|thumb|The SU8-Developer bench is located in C-1]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#SU8-Developer click here]'''
 
The SU8-Developer bench is a manually operated chemical bench for submersion development of SU-8 photoresist in PGMEA (supplied in the cleanroom as mr-Dev 600). After development, the substrates are rinsed with IPA and dried in the bench.
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=154 LabManager]'''
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Development of
*SU-8
|-
!style="background:silver; color:black;" align="center" width="60"|Developer
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
mr-Dev 600
 
(PGMEA)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
Submersion
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black" align="center"|
Room temperature
|-
|style="background:LightGrey; color:black"|Agitation
|style="background:WhiteSmoke; color:black" align="center"|
Magnetic stirrer
|-
|style="background:LightGrey; color:black"|Rinse
|style="background:WhiteSmoke; color:black" align="center"|
IPA
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center"|
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers (may require tool change)
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
! scope=row style="text-align: left;" | Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
| All cleanroom approved materials
Silicon and glass substrates
|
 
*Silicon and glass substrates
Film or pattern of all but Type IV
*Film or pattern of all but Type IV
| All cleanroom approved materials
|
*All cleanroom approved materials
*Film or pattern of all types
|
*Silicon and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|
*Silicon, III-V, and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|-
|-
|style="background:LightGrey; color:black"|Batch
! scope=row style="text-align: left;" | Batch size
|style="background:WhiteSmoke; color:black" align="center"|
| 1 - 5
1-8
| 1 - 6
|-  
| 1
| 1
| 1 - 25
| 1 - 25
|}
|}
<br clear="all" />
<br clear="all" />


==Developer-TMAH==
<!--
[[Image:KSspinner.JPG|300×300px|right|thumb|Developer-TMAH is located in C-1]]
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: SU8 (Wet Bench)|Developer: SU8 (Wet bench)]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: E-beam 02|Developer: E-beam 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual 02|Developer: TMAH Manual 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
-->
<!--
{{:Specific Process Knowledge/Lithography/Development/beaker_developer}}


'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer-TMAH click here]'''
{{:Specific Process Knowledge/Lithography/Development/SU8_developer}}


Developer-TMAH is a manually operated, single substrate spray-puddle developer. It uses the TMAH based AZ 726 MIF developer (2.38 % TMAH in  water with a small amount of wetting agent).
{{:Specific Process Knowledge/Lithography/Development/manualEbeam_developer}}


'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 LabManager]'''
{{:Specific Process Knowledge/Lithography/Development/manualTMAH_developer}}


===Process information===
{{:Specific Process Knowledge/Lithography/Development/UV_developer}}


'''Standard recipes'''
{{:Specific Process Knowledge/Lithography/Development/DUV_developer}}
*nLoF_40x2: double puddle, 40s. For development of AZ nLOF 2020 resist.
-->
*MiR701 60s: single puddle, 60s. For development of AZ MiR 701 resist.
*DUV 60s: single puddle, 60s. For development of DUV resists.


*UTIL-BE: For service use only.
=Decommisioned tools=
*UTIL-DR: Dome rinse.
<span style="color:red">Developer 1 & 2 were decommissioned 2017-01.</span>


=== Equipment performance and process related parameters ===
[[Specific Process Knowledge/Lithography/Development/1and2_developer|Information about decommissioned tool can be found here.]]


{| border="2" cellspacing="0" cellpadding="2"


<span style="color:red">Developer 6 inch was decommissioned 2019-12.</span>


!style="background:silver; color:black;" align="center" width="60"|Purpose
[[Specific Process Knowledge/Lithography/Development/6inch_developer|Information about decommissioned tool can be found here.]]
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Development of
*AZ nLOF
*AZ MiR 701
*AZ 5214E
*AZ 4562
*DUV resists
|-
!style="background:silver; color:black;" align="center" width="60"|Developer
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
AZ 726 MIF
 
(2.38% TMAH in water)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
Puddle
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black" align="center"|
Room temperature
|-
|style="background:LightGrey; color:black"|Agitation
|style="background:WhiteSmoke; color:black" align="center"|
none
|-
|style="background:LightGrey; color:black"|Rinse
|style="background:WhiteSmoke; color:black" align="center"|
DI water
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center"|
* 100 mm wafers
* 150 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
Silicon, glass, and polymer substrates
 
Film or pattern of all types
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
1
|-
|}
 
<br clear="all" />
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/Development"