Jump to content

Specific Process Knowledge/Lithography/Development: Difference between revisions

From LabAdviser
← Older edit
VisualWikitext
Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,526 edits
Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,871 edits
 
(302 intermediate revisions by 7 users not shown)
Line 1: Line 1:
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development click here]'''
{{cc-nanolab}}


=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Development click here]'''


[[Category: Equipment|Lithography development]]
[[Category: Lithography|Development]]


==Coaters: Comparison Table==
__TOC__
 
{| border="2" cellspacing="0" cellpadding="2"
 
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer-1 and Developer-2|Developer 1 and 2]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer-6inch|Developer-6inch]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer-TMAH|Developer-TMAH]]</b>
 
|-
!style="background:silver; width:100px; color:black;" align="center"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Coating and baking of
**AZ5214E resist
**AZ4562 resist
**E-beam resist
|style="background:WhiteSmoke; color:black"|
*Coating and baking of
**AZ5214E resist
**AZ4562 resist
**SU8 resist
|style="background:WhiteSmoke; color:black"|
*In-line substrate HMDS priming
*Coating and baking of
**AZ MiR 701 (29cps) resist
**AZ nLOF 2020 resist
*Post-exposure baking at 110°C


=Development Comparison Table=
{| class="wikitable"
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
!
|style="background:LightGrey; color:black"|Substrate handling
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
|style="background:WhiteSmoke; color:black"|
! [[Specific_Process_Knowledge/Lithography/Development/SU8_developer|Developer: SU8 (Wet bench)]]
* Cassette-to-cassette
! [[Specific_Process_Knowledge/Lithography/Development/manualEbeam_developer|Developer: E-beam 02]]
* Edge handling chuck
! [[Specific_Process_Knowledge/Lithography/Development/manualTMAH_developer|Developer: TMAH Manual 02]]
|style="background:WhiteSmoke; color:black"|
! [[Specific_Process_Knowledge/Lithography/Development/UV_developer|Developer: TMAH UV-lithography]]
* Single substrate
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer|Developer: TMAH Stepper]]
* Non-vacuum chuck for fragile substrates
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
|-
|-
|style="background:LightGrey; color:black"|Permanent media
! scope=row style="text-align: left;" | Purpose
|style="background:WhiteSmoke; color:black"|
|
* AZ5214E resist
Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools
* AZ4562 resist
* Acetone for chuck cleaning
* Acetone for drip pan
|style="background:WhiteSmoke; color:black"|
* AZ5214E resist
* PGMEA for edge bead removal
* Acetone for chuck cleaning
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701 (29cps) resist
* AZ nLOF 2020 resist
* PGMEA for backside rinse and edge-bead removal
* PGMEA for spinner bowl cleaning and vapor tip bath
|-
|style="background:LightGrey; color:black"|Manual dispense option
|style="background:WhiteSmoke; color:black"|
* 2 automatic syringes
|style="background:WhiteSmoke; color:black"|
* yes
* pneumatic dispense for SU8 resist
|style="background:WhiteSmoke; color:black"|
* no
 
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Spindle speed
|style="background:WhiteSmoke; color:black"|
*100-5000 rpm
|style="background:WhiteSmoke; color:black"|
*100-5000 rpm
|style="background:WhiteSmoke; color:black"|
*10 - 9990 rpm
|-
|style="background:LightGrey; color:black"|Gyrset
|style="background:WhiteSmoke; color:black"|
*optinal
|style="background:WhiteSmoke; color:black"|
*optinal
|style="background:WhiteSmoke; color:black"|
*no


<span style="color:red">Requires individual risk assessment for TMAH development!</span>
|
Development of:
*SU-8
|
Development of:
*ZEP 520A
*AR-P 6200.xx (CSAR)
|
Development of:
*AZ nLOF
*AZ MiR 701
*AZ 5214E
*AZ 4562
*DUV resists
|
Development of:
*AZ nLOF
*AZ MiR 701
*AZ 5214E
*AZ 4562
*DUV resists
Post-exposure baking
|
Development of:
*DUV resists
Post-exposure baking
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
! scope=row style="text-align: left;" | Developer
|style="background:LightGrey; color:black"|Substrate  size
| Process dependent
|style="background:WhiteSmoke; color:black"|
| mr-Dev 600 (PGMEA)
*50 mm wafers
|  
*100 mm wafers
*ZED N-50
*150 mm wafers
*AR 600-50
|style="background:WhiteSmoke; color:black"|
| AZ 726 MIF (2.38% TMAH in water)
*100 mm wafer
| AZ 726 MIF (2.38% TMAH in water)
*150 mm wafer
| AZ 726 MIF (2.38% TMAH in water)
|style="background:WhiteSmoke; color:black"|
*100 mm wafers
*150 mm wafers (tool change required)
|-
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*1-24
|style="background:WhiteSmoke; color:black"|
*1
|style="background:WhiteSmoke; color:black"|
*1-25
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except III-V materials
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except III-V materials
|style="background:WhiteSmoke; color:black"|
*Silicon
*Glass
|-
|}
 
<br clear="all" />
 
==Developer-1 and Developer-2==
[[Image:SSEspinner2.jpg|200 × 200px|thumb|right|Developer-1 and Developer-2 located in C-1]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer-1_and_Developer-2 click here]'''
 
Developer-1 and Developer-2
 
'''The user APV, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=62 Developer-1] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=63 Developer-2]'''
 
===Process information===
 
*Before using a one of developer batch's please check the "Litho4_Dev-7up-KOH" logbook to find out when they were used last time. A fresh bath can be reused without problems.
 
*The main rule is the develop from yesterday must be changed.
 
*Substrates rinses with with water for 4-5 min. after developing.
 
*Substrates can been spin-dried or dried with nitrogen gun after the rinse.
 
The standard developing time AZ resist:
*1.5µm resist is 60 sec
*2.2µm resist is 70 sec
*4.2µm resist is 3 min
*10µm resist is 5 min
 
====Procedure for making a new developer====
 
1. 800ml "Developer AZ 351B" is mixed with 4000ml water in a special container in the fume hood.
 
2. Fill the bath with the developer mixture and heat it to 22 °C before use.
 
<br clear="all" />
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spin coating and soft baking UV sensative resists
*Spin coating and soft baking E-beam resists
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Resist
! scope=row style="text-align: left;" | Method
|style="background:LightGrey; color:black"|
| Submersion
|style="background:WhiteSmoke; color:black" align="center"|
| Submersion
* AZ5214E
| Puddle
* AZ4562
| Puddle
* E-beam resists
| Puddle
| Puddle
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Performance
! scope=row style="text-align: left;" | Handling
|style="background:LightGrey; color:black"|Coating thickness
|
|style="background:WhiteSmoke; color:black" align="center"|
Manual handling in beakers
* AZ5214E 1-4,2 µm
*Chip bucket
* AZ4526 6,2-25 µm
*Single wafer carrier
* E-beam resits 0,1-1 µm
*Carrier for up to 5 wafers
|
*Chip bucket
*Single wafer carrier
*Carrier for up to 6 wafers
|
*Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
*Chip chuck for chips & 50 mm substrates
|
*Vacuum-free edge-grip chuck for 100 mm & 150 mm substrates
*Chip chuck for chips & 50 mm substrates
| Vacuum chuck
| Vacuum chuck
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
! scope=row style="text-align: left;" | Process temperature
|style="background:LightGrey; color:black"|Spin speed
| Room temperature
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| Room temperature
100 - 5000 rpm
| Room temperature
| Room temperature
| Room temperature
| Room temperature
|-
|-
|style="background:LightGrey; color:black"|Spin acceleration
! scope=row style="text-align: left;" | Process agitation
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
| No agitation allowed
100 - 10000 rpm/s
| Magnetic stirrer
| Rotation
| Rotation
| Rotation
| Rotation
|-
|-
|style="background:LightGrey; color:black"|Hotplate temperature
! scope=row style="text-align: left;" | Process rinse
|style="background:WhiteSmoke; color:black" align="center"|
| Process dependent
* 90°C for softbaking of AZ5214E resist
| IPA
* 100°C for softbaking of AZ4562 resist
| IPA
* 110°C for reverse baking of AZ5214E resits
| DI water
* 180°C for softbaking of e-beam resits
| DI water
| DI water
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
! scope=row style="text-align: left;" | Substrate size
|style="background:LightGrey; color:black"|Substrate size
|
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
* Chips
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
|
* Chips
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers
|
* Chips (5mm to 2")
* 50 mm wafers
* 50 mm wafers
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 150 mm wafers
|-
* 200 mm wafers
| style="background:LightGrey; color:black"|Allowed materials
|
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
* Chips (5mm to 50 mm)
All cleanroom materials except III-V materials
* 100 mm wafers
|-
* 150 mm wafers
|style="background:LightGrey; color:black"|Batch
|
|style="background:WhiteSmoke; color:black" align="center" colspan="2"|
* 100 mm wafers
1 - 24
* 150 mm wafers
|-
* 200 mm wafers (may require tool change)
|}
|
 
<br clear="all" />
 
==Developer-6inch==
 
[[image:SpinTrack.jpg|300x257px|right|thumb|Spin Track 1 + 2 in C-1]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Developers#Developer-6inch click here]'''
 
Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Each track consists of a HMDS priming module, a spin coating module, and a baking module. In fact, the only difference between the two tracks is the resist used in the spin coating module. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafers, but is currently set up for 100 mm wafer processing.
 
The Spin Track 1 + 2 is controlled using the Recipe Manager software via the touchscreen on the arm attached to the lefthand end of the track. Recipes for the individual modules are developed by Danchip and combined into flows. The user selects a flow (specific to track 1 or 2), and the appropriate recipes will be downloaded and executed on the appropriate track. The other track runs an empty process (no wafers needed), and can unfortunately not be used by a second user while the first user is processing.
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=189 LabManager]'''
 
===Process information===
*[[Specific Process Knowledge/Lithography/Coaters/Spin Track 1 + 2 processing|General Spin Track 1 + 2 process information]]
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Development of
*AZ nLOF
*AZ MiR 701
*AZ 5214E
*AZ 4562
|-
!style="background:silver; color:black;" align="center" width="60"|Developer
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
AZ 726 MIF (2.38% TMAH in water)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
Puddle
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black" align="center"|
Room temperature
|-
|style="background:LightGrey; color:black"|Agitation
|style="background:WhiteSmoke; color:black" align="center"|
none
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center"|
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 150 mm wafers
* 200 mm wafers (may require tool change)
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
! scope=row style="text-align: left;" | Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
| All cleanroom approved materials
All Silicon, glass and polymer substrates
|
*Silicon and glass substrates
*Film or pattern of all but Type IV
| All cleanroom approved materials
|
*All cleanroom approved materials
*Film or pattern of all types
|
*Silicon and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|
*Silicon, III-V, and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|-
|-
|style="background:LightGrey; color:black"|Batch
! scope=row style="text-align: left;" | Batch size
|style="background:WhiteSmoke; color:black" align="center"|
| 1 - 5
1  
| 1 - 6
|-  
| 1
| 1
| 1 - 25
| 1 - 25
|}
|}
<br clear="all" />


<br clear="all" />
<!--
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: SU8 (Wet Bench)|Developer: SU8 (Wet bench)]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: E-beam 02|Developer: E-beam 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual 02|Developer: TMAH Manual 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
-->
<!--
{{:Specific Process Knowledge/Lithography/Development/beaker_developer}}


==Developer-TMAH==
{{:Specific Process Knowledge/Lithography/Development/SU8_developer}}
[[Image:KSspinner.JPG|300×300px|right|thumb|Developer-TMAH is placed in C-1]]


'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer-TMAH click here]'''
{{:Specific Process Knowledge/Lithography/Development/manualEbeam_developer}}


Developer-TMAH is a manually operated, single substrate spray-puddle developer. It uses the TMAH based AZ 726 MIF developer (2.38 % TMAH in  water with a small amount of wetting agent).
{{:Specific Process Knowledge/Lithography/Development/manualTMAH_developer}}


'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 LabManager]'''
{{:Specific Process Knowledge/Lithography/Development/UV_developer}}


<br clear="all" />
{{:Specific Process Knowledge/Lithography/Development/DUV_developer}}
-->


=== Equipment performance and process related parameters ===
=Decommisioned tools=
<span style="color:red">Developer 1 & 2 were decommissioned 2017-01.</span>


{| border="2" cellspacing="0" cellpadding="2"
[[Specific Process Knowledge/Lithography/Development/1and2_developer|Information about decommissioned tool can be found here.]]




!style="background:silver; color:black;" align="center" width="60"|Purpose
<span style="color:red">Developer 6 inch was decommissioned 2019-12.</span>
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Development of
*AZ nLOF
*AZ MiR 701
*AZ 5214E
*AZ 4562
|-
!style="background:silver; color:black;" align="center" width="60"|Developer
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
AZ 726 MIF (2.38% TMAH in water)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
Puddle
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black" align="center"|
Room temperature
|-
|style="background:LightGrey; color:black"|Agitation
|style="background:WhiteSmoke; color:black" align="center"|
none
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center"|
* 100 mm wafers
* 150 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
All Silicon, glass and polymer substrates
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
1
|-
|}


<br clear="all" />
[[Specific Process Knowledge/Lithography/Development/6inch_developer|Information about decommissioned tool can be found here.]]

Latest revision as of 12:25, 13 January 2026

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

Feedback to this page: click here

Development Comparison Table

Manual beaker development Developer: SU8 (Wet bench) Developer: E-beam 02 Developer: TMAH Manual 02 Developer: TMAH UV-lithography Developer: TMAH Stepper
Purpose

Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools

Requires individual risk assessment for TMAH development!

Development of:

  • SU-8

Development of:

  • ZEP 520A
  • AR-P 6200.xx (CSAR)

Development of:

  • AZ nLOF
  • AZ MiR 701
  • AZ 5214E
  • AZ 4562
  • DUV resists

Development of:

  • AZ nLOF
  • AZ MiR 701
  • AZ 5214E
  • AZ 4562
  • DUV resists

Post-exposure baking

Development of:

  • DUV resists

Post-exposure baking

Developer Process dependent mr-Dev 600 (PGMEA)
  • ZED N-50
  • AR 600-50
 AZ 726 MIF (2.38% TMAH in water) AZ 726 MIF (2.38% TMAH in water) AZ 726 MIF (2.38% TMAH in water)
Method Submersion Submersion Puddle Puddle Puddle Puddle
Handling

Manual handling in beakers

  • Chip bucket
  • Single wafer carrier
  • Carrier for up to 5 wafers
  • Chip bucket
  • Single wafer carrier
  • Carrier for up to 6 wafers
  • Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
  • Chip chuck for chips & 50 mm substrates
  • Vacuum-free edge-grip chuck for 100 mm & 150 mm substrates
  • Chip chuck for chips & 50 mm substrates
 Vacuum chuck Vacuum chuck
Process temperature Room temperature Room temperature Room temperature Room temperature Room temperature Room temperature
Process agitation No agitation allowed Magnetic stirrer Rotation Rotation Rotation Rotation
Process rinse Process dependent IPA IPA DI water DI water DI water
Substrate size
  • Chips
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • Chips
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
  • Chips (5mm to 2")
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
  • Chips (5mm to 50 mm)
  • 100 mm wafers
  • 150 mm wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers (may require tool change)
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers (may require tool change)
Allowed materials All cleanroom approved materials
  • Silicon and glass substrates
  • Film or pattern of all but Type IV
 All cleanroom approved materials
  • All cleanroom approved materials
  • Film or pattern of all types
  • Silicon and glass substrates
  • Films, or patterned films, of any material except type IV (Pb, Te)
  • Silicon, III-V, and glass substrates
  • Films, or patterned films, of any material except type IV (Pb, Te)
Batch size 1 - 5 1 - 6 1 1 1 - 25 1 - 25



Decommisioned tools

Developer 1 & 2 were decommissioned 2017-01.

Information about decommissioned tool can be found here.


Developer 6 inch was decommissioned 2019-12.

Information about decommissioned tool can be found here.

Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/Development&oldid=55108"