Specific Process Knowledge/Back-end processing/Laser Micromachining Tool

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Laser Micromachining Tool

Lasertool microSTRUCT vario (3D-Micromac AG)

Inside lasertool

The Laser Micromachining Tool is a microSTRUCT vario from the company 3D-Micromac AG.

The machine is located in the basement of building 346 under the cleanroom.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager: [1]

It is equipped with 2 high power lasers :

• a 50W picosecond laser that can emit light at 3 wavelengths: 355nm, 532nm and 1064nm (Time-Bandwidth Products, Fuego/Duetto. See some details in this article: [2] ) with a pulse repetition rate from 200kHz up to 8000kHz.

  and a

• a 100W nanosecond laser with a wavelength of 1064nm (IPG Laser YLP-HP series) with a pulse repetition rate of 100kHz (currently out of use).

The system is able to produce micro structures in different kinds of materials like metals, ceramics, composite materials, etc. It can produce features down to ~10µm size over a large area. It can scan over an area of up to ~15x15cm without moving the sample. By moving the sample on the large x-y-stage this area can be extended by stitching.

The laser can use Autocad DXF files for the pattern design. To create these files we recommend to use Clewin 5. See more info here.

Technical specifications

• Spot size and optics
• Lasers sources

Performances

Purpose	Patterning, milling and dicing substrates	Mainly for patterning, milling, drilling with high aspect ratio and dicing substrate with micrometric shapes and above (> 10µm)
Performances	Resolution	Down to 10µm with the blue laser (355nm). Depending on the depth wished.
	Maximum writing area	Depends of the optics. Max size : Blue (145x145mm) Green ( 165x165mm) Red (165x165mm)
	Max. output power @100%(laser TB width – picosecond)	Values from SAT (Nov. 2012) Current values (Dec. 2018) Repetition rate : 200kHz 355nm, F103mm : 11,93W 532nm, F255mm : 24,62W 1064nm, F255mm : 34,24W Repetition rate : 1000 kHz 355nm, F103mm : 4,28W 532nm, F255mm : 18,40W 1064nm, F255mm: 40,09W Repetition rate : 8000 kHz 355nm, F103mm : 0,26W 532nm, F255mm  : 4,82W 1064nm, F255mm : 42,40W Repetition rate : 200 kHz 355nm, F103mm : 15 W 532nm, F255mm: not measured 1064nm, F255mm: 32 W Repetition rate : 1000 kHz 355nm, F103mm : 5,5 W 532nm : not measured 1064nm : 38 W Repetition rate : 8000 kHz 355nm, F103mm: 0,3 W 532nm, F255mm: not measured 1064nm, F255mm: 41 W Graph 1064nm, F255nm Avg. output power Graph 355nm, F103nm Avg. output power
	Output power@100%(laser IPG – nanosecond)	Repetition rate : 10kHz to 100kHz (Currently non-available) 1064nm : 80W
Substrates	Material allowed	Silicon Silicon + Si3N4 and/or SiO2 Silicon with resist Aluminum Steel Pyrex Fused silicate (quartz) Topas Nickel Tungsten if not in the list ask machine responsible
	Material NOT allowed	PTFE (teflon)
Parameters	Characteristics	Speed up to 2000 mm/s M2 factor : <1.3 Beam shape : Gaussian

Process information

Result from the acceptance test

• Results from Laser Micromachining Tool acceptance test

Results from default process

• Mask making

Laser Processing parameters

The following parameters provide information about the necessary values for machining different materials. However, most parameters can be further optimized in order to reduce the amount of debris and/or reduce the process time.

Material

Optics

Frequency

Intensity

Power measured @10%

Writing speed

Number of burst

Number of Z-offset

Number of iteration

Number of parallel lines

Gap in between line

Parameter file

Comments

Silicon 525µm

Green(532nm/255mm)

200 kHz

100%

0,57 W

50 mm/s

1 burst

none

4

1

N/A

Silicon dicing green parameters

Easily break silicon in cristal plan. Depth of the groove : 25µm

Silicon (525µm) + Si3N4 (150nm up to 1,2µm) OR SiO2 (150nm up to 320nm)

Red (1064nm/255mm)

200 kHz

100%

2,8 W

1000 mm/s

3 bursts

1 (-0,3mm)

350/100

4

50 µm

Silicon nitride cutting parameters

Samples can easily be removed with a soft mechanical pressure. A layer of resist can be deposited on the top without influenced the dicing. Thicker layers (oxyde or nitride) have not been tested.

Nickel (320µm)

Green(532nm/255mm)

200 kHz

100%

0,64 W

300 mm/s

3 burst

none

4320

1

N/A

Cutting Ni 320µm parameters

Cutting through only blue tape left

Pyrex (1000µm)

Red(1064nm/255mm)

200 kHz

100%

2,8 W

1000 mm/s

1 burst

none

99

13

20 µm

Cutting Pyrex 1000µm for microfluidic hole parameters

Increase/decrease the number of iteration to increase/decrease the width of the hole. Microscope view of the chanel

Pyrex/Borosilicate glass (525µm)

Red(1064nm/255mm)

200 kHz

100%

2,96 W

1000 mm/s

1 burst

4 (-0,1/-0,2/-0,3/-0,4mm)

300/500/700/900/1200

4

20 µm

Cutting Pyrex 525µm parameters

Cutting through. Dicing circle. Can probably be optimized: 3 lines may be enough and half the iterations (tried by Azeem)

Steel (50µm)

Green(532nm/255mm)

200 kHz

20%

0,55 W

500 mm/s

1 burst

0

22

Cutting steel 50µm

Cutting shrim for Injection molder.

Steel (100µm)

Green(532nm/255mm)

200 kHz

25%

0,55 W

500 mm/s

1 burst

0

35

Cutting steel 100µm

Cutting shrim for Injection molder.

Steel (200µm)

Green(532nm/255mm)

200 kHz

25%

0,55 W

500 mm/s

1 burst

0

72

Cutting steel 200µm

Cutting shrim for Injection molder.

Aluminum (400µm)

Green(532nm/255mm)

200 kHz

100%

?? W

100 mm/s

3 bursts

0

35-40

4

20

cutting Al 400µm

Cutting shadowmask for Wordentec.

Aluminum (600µm)

Red IPG(1064nm/255mm)

100 kHz

100%

- W

1000 mm/s

1 bursts

0

110

4

40

cutting Al 600µm

Shadowmask.

The parameter filename extension is here set to .xls because of MediaWiki restrictions. The 3DMM laser software uses .par as parameter file extension.
The file should be a pure text-file with no formatting codes etc.