Specific Process Knowledge/Thin film deposition: Difference between revisions

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<center><span style="background:PaleGreen">3rd Level - Material/Methode</span></center>
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition click here]'''
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''
 
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>




== Choose material to deposit ==
== Choose material to deposit ==


=== Dielectrica ===
{| {{table}}
*[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''Silicon nitride and silicon oxynitride''
| align="left" valign="top"  style="background:LightGray"|''' Semiconductors'''
*[[/Deposition of Silicon Oxide|Silicon Oxide]]
| align="left" valign="top" style="background:#DCDCDC"|''' Oxides'''
*[[/Deposition of Titanium Oxide|Titanium Oxide]]
| align="left" valign="top" style="background:LightGray"|''' Nitrides'''
| align="left" valign="top" style="background:#DCDCDC"|''' Carbon and Carbides'''
| align="left" valign="top" style="background:LightGray"|''' Metals'''
| align="left" valign="top" style="background:#DCDCDC"|''' Alloys'''
| align="left" valign="top" style="background:LightGray"|''' Transparent conductive oxides'''
| align="left" valign="top" style="background:#DCDCDC"|''' Polymers'''
| align="left" valign="top" style="background:LightGray"|''' Multilayers'''
|-valign="top"
 
|style="background: LightGray"|
[[/Deposition of Silicon|Silicon]] <br/>
[[/Deposition of Germanium|Germanium]] <br/>
 
|style="background: #DCDCDC"|
[[/Deposition of Alumina|Aluminium Oxide (Al<sub>2</sub>O<sub>3</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Barium titanate (BaTiO<sub>3</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Chromium Oxide (Cr<sub>2</sub>O<sub>3</sub>)]]<br/>
[[/Deposition of Hafnium Oxide|Hafnium Oxide (HfO<sub>2</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Magnesium Oxide (MgO)]]<br/>
[[/Sputter deposition of oxides and other compounds|Nickel Oxide (NiO)]]<br/>
[[/Deposition of Silicon Oxide|Silicon Oxide (SiO<sub>2</sub>)]]<br/>
[[/Deposition of Titanium Oxide|Titanium Oxide (TiO<sub>2</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Tantalum Oxide (Ta<sub>2</sub>O<sub>5</sub>)]]<br/>
[[/Sputter deposition of oxides and other compounds|Vanadium Oxide (VO<sub>x</sub>)]]<br/>
[[/Deposition of ZnO|Zinc Oxide (ZnO)]]<br/>
 
 
|style="background: LightGray"|
[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/>
[[/Deposition of Titanium Nitride|Titanium Nitride]] - ''conductive ceramics'' <br/>
[[/Deposition of Niobium Titanium Nitride| Niobium Titanium Nitride]] - ''superconductors''<br/>
[[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>
[[/Deposition of Scandium Nitride| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>
 
 
|style="background: #DCDCDC"|
[[/Deposition of Carbon|Carbon]] <br/>
<!-- [[/Deposition of Titanium Carbide|Titanium Carbide (TiC)]]<br/> -->
[[/Deposition of Silicon Carbide|Silicon Carbide (SiC)]]<br/>
[[/Sputter deposition of metals and alloys|Tantalum carbide (TaC<sub>x</sub>)]]<br/>
 
 
|style="background: LightGray"|
[[/Deposition of Aluminium|Aluminium]] <br/>
[[/Deposition of Chromium|Chromium]]<br/>
[[/Deposition of Copper|Copper]]<br/>
[[/Deposition of Gold|Gold]]<br/>
[[/Sputter deposition of metals and alloys|Iron]]<br/>
[[/Deposition of Magnesium|Magnesium]]<br/>
[[/Deposition of Molybdenum|Molybdenum]]<br/>
[[/Deposition of Nickel|Nickel]]<br/>
[[/Deposition of Niobium|Niobium]]<br/>
[[/Deposition of Palladium|Palladium]]<br/>
[[/Deposition of Platinum|Platinum]]<br/>
[[/Deposition of Ruthenium|Ruthenium]]<br/>
[[/Deposition of Silver|Silver]]<br/>
[[/Deposition of Tantalum|Tantalum]]<br/>
[[/Deposition of Tin|Tin]]<br/>
[[/Deposition of Titanium|Titanium]]<br/>
[[/Deposition of Tungsten|Tungsten]]<br/>
[[/Deposition of Zinc|Zinc]]<br/>
[[/Deposition of Scandium|Scandium]]<br/>
 
 
 
|style="background: #DCDCDC"|
[[/Sputter deposition of metals and alloys|AlCu]]<br/>
[[/Sputter deposition of metals and alloys|CuTi]]<br/>
[[/Sputter deposition of metals and alloys|FeMn]]<br/>
[[/Sputter deposition of metals and alloys|MnIr]]<br/>
[[/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information|NbTi]] <br/>
[[/Deposition of NiFe|NiFe]]<br/>
[[/Deposition of NiV|NiV]] alloy <br/>
[[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>
 
And an electroceramic:
 
[[/Sputter deposition of oxides and other compounds|YSZ]] (Yttrium stabilized zirconia)<br/>
[[/Gadolinium Cerium Oxide|Gd<sub>0.2</sub>Ce<sub>0.8</sub>O<sub>2</sub> (GCO)]]


=== Metals/elements ===
|style="background: LightGray"|
{| border="2" cellspacing="1" cellpadding="8"
[[/Deposition of ITO|ITO (Tin doped Indium Oxide)]]<br/>
|-
[[/Deposition of AZO |AZO (Aluminum doped Zinc Oxide)]]<br/>
|
 
Period/Group
|style="background: #DCDCDC"|
|IVB
[[Specific Process Knowledge/Lithography/SU-8|SU-8]]<br/>
|VB
[[Specific Process Knowledge/Thin film deposition/MVD#Processing on the MVD| Antistiction coating]] <br/>
|VIB
Topas <br/>
|VIIIB
PMMA
|IB
 
|IIIA
|style="background: LightGray"|
|IVA
[[/Deposition of CrSi|CrSi bilayer]] <br/>
|-
|3
|.
|.
|.
|.
|.
|[[/Deposition of Aluminium|13 Al Aluminium]]
|[[/Deposition of Silicon|14 Si Silicon]]
|-
|4
|[[/Deposition of Titanium|22 Ti Titanium]]
|.
|[[/Deposition of Chromium|24 Cr Chromium]]
|[[/Deposition of Nickel|28 Ni Nickel]]
|[[/Deposition of Copper|29 Cu Copper]]
|.
|[[/Deposition of Germanium|32 Ge Germanium]]
|-
|5
|.
|.
|[[/Deposition of Molybdenum|42 Mo Molybdenum]]
|[[/Deposition of Palladium|46 Pd Palladium]]
|[[/Deposition of Silver|47 Ag Silver]]
|.
|[[/Deposition of Tin|50 Sn Tin]]
|-
|6
|.
|[[/Deposition of Tantalum|73 Ta Tantalum]]
|[[/Deposition of Tungsten|74 W Tungsten]]
|[[/Deposition of Platinum|78 Pt Platinum]]
|[[/Deposition of Gold|79 Au Gold]]
|.
|.
|-
|-
|}
|}


===Alloys===
Oh no! My material is not on the list! Please contact the [mailto:thinfilm@nanolab.dtu.dk Thin Film group] if you would like to inquire about a material that is not mentioned here.
*[[/Deposition of TiW|TiW]] alloy (10%/90% by weight)
 
*[[/Deposition of NiCr|NiCr]] alloy
== Choose deposition equipment ==
*[[/Deposition of AlTi|AlTi]] alloy
 


{| {{table}}
| align="left" valign="top"  style="background:LightGray"|''' PVD - Physical vapor deposition'''
| align="left" valign="top" style="background:#DCDCDC;"|''' LPCVD - low pressure chemical vapor deposition'''
| align="left" valign="top" style="background:LightGray"|''' PECVD - plasma enhanced chemical vapor deposition'''
| align="left" valign="top" style="background:#DCDCDC;"|''' ALD - atomic layer deposition'''
| align="left" valign="top" style="background:LightGray"|''' Coaters - for polymers'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Others'''


=== Polymers ===
*[[Specific Process Knowledge/Photolithography/SU8|SU8]]
*Antistiction coating
*Topas
*PMMA


== Choose deposition equipment ==


*[[/Alcatel|Alcatel]] - ''E-beam evaporator and sputter tool''
|-valign="top"
|style="background: LightGray"|
*[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) ]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system''  
*[[/Lesker|Lesker]] - ''Sputter tool''
*[[/Lesker|Lesker]] - ''Sputter tool''
*[[/Multisource_PVD|PVD co-sputter/evaporation]] - ''E-beam evaporator and multiple wafer tool''
*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator''
*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator''
*[[Specific Process Knowledge/III-V Process/thin film dep/physimeca|Physimeca]] - ''E-beam evaporator (III-V lab)''
*[[/thermalevaporator|Thermal evaporator]]
*[[Specific Process Knowledge/Etch/IBE&frasl;IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching''
*[[/Temescal|E-Beam Evaporator (Temescal)]]
*[[/Hummer|Hummer]] - ''Gold sputtering system''
*[[/10-pocket e-beam evaporator|E-Beam Evaporator (10 pockets)]]
*[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system''
*[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system''
 
<!--*[[/Sputter coater#The_Hummer_Sputter_coater|Sputter coater Hummer]] -<span style="color:Red"> (Decommissioned</span>) ''Gold sputtering system''
*[[/Sputter coater#The_Balzer_Sputter_coater|Balzer Sputter coater]] -<span style="color:Red"> (Decommissioned</span>) ''Gold sputtering system''
*[[/III-V Dielectric evaporator|III-V Dielectric evaporator]] -<span style="color:Red"> (Decommissioned</span>) ''E-beam evaporation tool''
*[[/Alcatel|Alcatel]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and sputter tool''
*[[/Physimeca|Physimeca]] - ''E-beam evaporator''
*[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and multiple wafer tool'' -->
 
|style="background: #DCDCDC"|
*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Furnace LPCVD Nitride (4" and 6")]] - ''Deposition of silicon nitride''
*[[/Furnace LPCVD PolySilicon|Furnace LPCVD Polysilicon (4" and 6")]] ''Deposition of polysilicon''
*[[/Furnace LPCVD TEOS|Furnace LPCVD TEOS (4")]] - ''Deposition of silicon oxide''
|style="background: LightGray"|
*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
*[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
*[[/Furnace LPCVD Nitride|Furnace LPCVD Nitride (4" and 6")]] - ''Deposition of silicon nitride''
<!--*[[/DiamondCVD|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth''-->
*[[/Furnace LPCVD PolySilicon|Furnace LPCVD Polysilicon (4" and 6")]] - ''Deposition of polysilicon''
|style="background: #DCDCDC"|
*[[/Furnace LPCVD TEOS|Furnace LPCVD TEOS (4")]] - ''Deposition of silicon oxide''
*[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal)
*[[/ALD2 (PEALD)|ALD2 (PEALD)]] - Atomic Layer Deposition (thermal and plasma enhanced)
|style="background: LightGray"|
See the [[Specific Process Knowledge/Lithography/Coaters |Lithography/Coaters]] page for coating polymers
|style="background: #DCDCDC"|
*[[/MVD|MVD]] - ''Molecular Vapor Deposition''
*[[/MVD|MVD]] - ''Molecular Vapor Deposition''
*[[/Black Magic PECVD|Black Magic PECVD]] - ''Black Magic PECVD (Carbon)''
*Electroplating of Ni, Cu, Au, etc. - ''Ask in the department of Mechanical Engineering''
*[[/Electroplating-Ni|Electroplating-Ni]] - ''Electrochemical deposition of nickel''
*MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - ''Ask DTU Electro if you are interested: [mailto:esem@dtu.dk Elizaveta Semenova] or [mailto:kryv@dtu.dk Kresten Yvind]''
 
 
 
=  Section under construction [[Image:section under construction.jpg|70px]] =
 
{| {{table}}
| align="left" valign="top"  style="background:#f0f0f0;"|''' Dielectrica'''
| align="left" valign="top" style="background:#f0f0f0;"|''' Semicondutors'''
| align="left" valign="top" style="background:#f0f0f0;"|''' Metals'''
| align="left" valign="top" style="background:#f0f0f0;"|''' Alloys'''
| align="left" valign="top" style="background:#f0f0f0;"|''' Polymers'''
|-valign="top"
|
*[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride''
*[[/Deposition of Silicon Oxide|Silicon Oxide]]
*[[/Deposition of Titanium Oxide|Titanium Oxide]]
|
*[[/Deposition of Silicon|14 Si Silicon]]
|
*[[/Deposition of Aluminium|13 Al Aluminium]]
*[[/Deposition of Titanium|22 Ti Titanium]]
*[[/Deposition of Chromium|24 Cr Chromium]]
*[[/Deposition of Nickel|28 Ni Nickel]]
*[[/Deposition of Copper|29 Cu Copper]]
*[[/Deposition of Germanium|32 Ge Germanium]]
*[[/Deposition of Molybdenum|42 Mo Molybdenum]]
*[[/Deposition of Palladium|46 Pd Palladium]]
*[[/Deposition of Silver|47 Ag Silver]]
*[[/Deposition of Tin|50 Sn Tin]]
*[[/Deposition of Tantalum|73 Ta Tantalum]]
*[[/Deposition of Tungsten|74 W Tungsten]]
*[[/Deposition of Platinum|78 Pt Platinum]]
*[[/Deposition of Gold|79 Au Gold]]
|
*[[/Deposition of TiW|TiW]] alloy (10%/90% by weight)
*[[/Deposition of NiCr|NiCr]] alloy
*[[/Deposition of AlTi|AlTi]] alloy
|
*[[Specific Process Knowledge/Photolithography/SU8|SU8]]
*Antistiction coating
*Topas
*PMMA
|-
|-
|}
|}

Latest revision as of 09:43, 29 August 2024

Feedback to this page: click here

Unless otherwise stated, this page is written by DTU Nanolab internal


Choose material to deposit

Semiconductors Oxides Nitrides Carbon and Carbides Metals Alloys Transparent conductive oxides Polymers Multilayers

Silicon
Germanium

Aluminium Oxide (Al2O3)
Barium titanate (BaTiO3)
Chromium Oxide (Cr2O3)
Hafnium Oxide (HfO2)
Magnesium Oxide (MgO)
Nickel Oxide (NiO)
Silicon Oxide (SiO2)
Titanium Oxide (TiO2)
Tantalum Oxide (Ta2O5)
Vanadium Oxide (VOx)
Zinc Oxide (ZnO)

Silicon Nitride - and oxynitride
Titanium Nitride - conductive ceramics
Niobium Titanium Nitride - superconductors
Aluminum Nitride (AlxNy)
Scandium Nitride (ScxNy)

Carbon
Silicon Carbide (SiC)
Tantalum carbide (TaCx)

Aluminium
Chromium
Copper
Gold
Iron
Magnesium
Molybdenum
Nickel
Niobium
Palladium
Platinum
Ruthenium
Silver
Tantalum
Tin
Titanium
Tungsten
Zinc
Scandium

AlCu
CuTi
FeMn
MnIr
NbTi
NiFe
NiV alloy
TiW alloy (10%/90% by weight)

And an electroceramic:

YSZ (Yttrium stabilized zirconia)
Gd0.2Ce0.8O2 (GCO)

ITO (Tin doped Indium Oxide)
AZO (Aluminum doped Zinc Oxide)

SU-8
Antistiction coating
Topas
PMMA

CrSi bilayer

Oh no! My material is not on the list! Please contact the Thin Film group if you would like to inquire about a material that is not mentioned here.

Choose deposition equipment

PVD - Physical vapor deposition LPCVD - low pressure chemical vapor deposition PECVD - plasma enhanced chemical vapor deposition ALD - atomic layer deposition Coaters - for polymers Others



  • PECVD - Plasma Enhanced Chemical Vapor deposition
  • ALD1 - Atomic Layer Deposition (thermal)
  • ALD2 (PEALD) - Atomic Layer Deposition (thermal and plasma enhanced)

See the Lithography/Coaters page for coating polymers

  • MVD - Molecular Vapor Deposition
  • Electroplating of Ni, Cu, Au, etc. - Ask in the department of Mechanical Engineering
  • MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - Ask DTU Electro if you are interested: Elizaveta Semenova or Kresten Yvind
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