Specific Process Knowledge/Thin film deposition: Difference between revisions

MVD - Molecular Vapor Deposition
Electroplating of Ni, Cu, Au, etc. - Ask in the department of Mechanical Engineering
MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - Ask DTU Electro if you are interested: Elizaveta Semenova or Kresten Yvind

@@ Line 1: / Line 1: @@
-<center><span style="background:PaleGreen">3rd Level - Material/Methode</span></center>
+'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition click here]'''
-'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/RIE_(Reactive_Ion_Etch) click here]'''
+<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>
 == Choose material to deposit ==
-=== Dielectrica ===
+{| {{table}}
-*[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''Silicon nitride and silicon oxynitride''
+| align="left" valign="top"  style="background:LightGray"|''' Semiconductors'''
-*[[/Deposition of Silicon Oxide|Silicon Oxide]]
+| align="left" valign="top" style="background:#DCDCDC"|''' Oxides'''
-*[[/Deposition of Titanium Oxide|Titanium Oxide]]
+| align="left" valign="top" style="background:LightGray"|''' Nitrides'''
+| align="left" valign="top" style="background:#DCDCDC"|''' Carbon and Carbides'''
+| align="left" valign="top" style="background:LightGray"|''' Metals'''
+| align="left" valign="top" style="background:#DCDCDC"|''' Alloys'''
+| align="left" valign="top" style="background:LightGray"|''' Transparent conductive oxides'''
+| align="left" valign="top" style="background:#DCDCDC"|''' Polymers'''
+| align="left" valign="top" style="background:LightGray"|''' Multilayers'''
+|-valign="top"
+|style="background: LightGray"|
+[[/Deposition of Silicon|Silicon]] <br/>
+[[/Deposition of Germanium|Germanium]] <br/>
+|style="background: #DCDCDC"|
+[[/Deposition of Alumina|Aluminium Oxide (Al<sub>2</sub>O<sub>3</sub>)]]<br/>
+[[/Sputter deposition of oxides and other compounds|Barium titanate (BaTiO<sub>3</sub>)]]<br/>
+[[/Sputter deposition of oxides and other compounds|Chromium Oxide (Cr<sub>2</sub>O<sub>3</sub>)]]<br/>
+[[/Deposition of Hafnium Oxide|Hafnium Oxide (HfO<sub>2</sub>)]]<br/>
+[[/Sputter deposition of oxides and other compounds|Magnesium Oxide (MgO)]]<br/>
+[[/Sputter deposition of oxides and other compounds|Nickel Oxide (NiO)]]<br/>
+[[/Deposition of Silicon Oxide|Silicon Oxide (SiO<sub>2</sub>)]]<br/>
+[[/Deposition of Titanium Oxide|Titanium Oxide (TiO<sub>2</sub>)]]<br/>
+[[/Sputter deposition of oxides and other compounds|Tantalum Oxide (Ta<sub>2</sub>O<sub>5</sub>)]]<br/>
+[[/Sputter deposition of oxides and other compounds|Vanadium Oxide (VO<sub>x</sub>)]]<br/>
+[[/Deposition of ZnO|Zinc Oxide (ZnO)]]<br/>
+|style="background: LightGray"|
+[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/>
+[[/Deposition of Titanium Nitride|Titanium Nitride]] - ''conductive ceramics'' <br/>
+[[/Deposition of Niobium Titanium Nitride| Niobium Titanium Nitride]] - ''superconductors''<br/>
+[[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>
+[[/Deposition of Scandium Nitride| Scandium Nitride (Sc<sub>x</sub>N<sub>y</sub>)]]<br/>
-=== Metals/elements ===
-{| border="2" cellspacing="1" cellpadding="8"
+|style="background: #DCDCDC"|
-|-
+[[/Deposition of Carbon|Carbon]] <br/>
-|
+<!-- [[/Deposition of Titanium Carbide|Titanium Carbide (TiC)]]<br/> -->
-Period/Group
+[[/Deposition of Silicon Carbide|Silicon Carbide (SiC)]]<br/>
-|IVB
+[[/Sputter deposition of metals and alloys|Tantalum carbide (TaC<sub>x</sub>)]]<br/>
-|VB
-|VIB
-|VIIIB
+|style="background: LightGray"|
-|IB
+[[/Deposition of Aluminium|Aluminium]] <br/>
-|IIIA
+[[/Deposition of Chromium|Chromium]]<br/>
-|IVA
+[[/Deposition of Copper|Copper]]<br/>
-|-
+[[/Deposition of Gold|Gold]]<br/>
-|3
+[[/Sputter deposition of metals and alloys|Iron]]<br/>
-|.
+[[/Deposition of Magnesium|Magnesium]]<br/>
-|.
+[[/Deposition of Molybdenum|Molybdenum]]<br/>
-|.
+[[/Deposition of Nickel|Nickel]]<br/>
-|.
+[[/Deposition of Niobium|Niobium]]<br/>
-|.
+[[/Deposition of Palladium|Palladium]]<br/>
-|[[/Deposition of Aluminium|13 Al Aluminium]]
+[[/Deposition of Platinum|Platinum]]<br/>
-|[[/Deposition of Silicon|14 Si Silicon]]
+[[/Deposition of Ruthenium|Ruthenium]]<br/>
-|-
+[[/Deposition of Silver|Silver]]<br/>
-|4
+[[/Deposition of Tantalum|Tantalum]]<br/>
-|[[/Deposition of Titanium|22 Ti Titanium]]
+[[/Deposition of Tin|Tin]]<br/>
-|.
+[[/Deposition of Titanium|Titanium]]<br/>
-|[[/Deposition of Chromium|24 Cr Chromium]]
+[[/Deposition of Tungsten|Tungsten]]<br/>
-|[[/Deposition of Nickel|28 Ni Nickel]]
+[[/Deposition of Zinc|Zinc]]<br/>
-|[[/Deposition of Copper|29 Cu Copper]]
+[[/Deposition of Scandium|Scandium]]<br/>
-|.
-|[[/Deposition of Germanium|32 Ge Germanium]]
-|-
-|5
+|style="background: #DCDCDC"|
-|.
+[[/Sputter deposition of metals and alloys|AlCu]]<br/>
-|.
+[[/Sputter deposition of metals and alloys|CuTi]]<br/>
-|[[/Deposition of Molybdenum|42 Mo Molybdenum]]
+[[/Sputter deposition of metals and alloys|FeMn]]<br/>
-|[[/Deposition of Palladium|46 Pd Palladium]]
+[[/Sputter deposition of metals and alloys|MnIr]]<br/>
-|[[/Deposition of Silver|47 Ag Silver]]
+[[/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information|NbTi]] <br/>
-|.
+[[/Deposition of NiFe|NiFe]]<br/>
-|[[/Deposition of Tin|50 Sn Tin]]
+[[/Deposition of NiV|NiV]] alloy <br/>
-|-
+[[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>
-|6
-|.
+And an electroceramic:
-|[[/Deposition of Tantalum|73 Ta Tantalum]]
-|[[/Deposition of Tungsten|74 W Tungsten]]
+[[/Sputter deposition of oxides and other compounds|YSZ]] (Yttrium stabilized zirconia)<br/>
-|[[/Deposition of Platinum|78 Pt Platinum]]
+[[/Gadolinium Cerium Oxide|Gd<sub>0.2</sub>Ce<sub>0.8</sub>O<sub>2</sub> (GCO)]]
-|[[/Deposition of Gold|79 Au Gold]]
-|.
+|style="background: LightGray"|
-|.
+[[/Deposition of ITO|ITO (Tin doped Indium Oxide)]]<br/>
+[[/Deposition of AZO |AZO (Aluminum doped Zinc Oxide)]]<br/>
+|style="background: #DCDCDC"|
+[[Specific Process Knowledge/Lithography/SU-8|SU-8]]<br/>
+[[Specific Process Knowledge/Thin film deposition/MVD#Processing on the MVD| Antistiction coating]] <br/>
+Topas <br/>
+PMMA
+|style="background: LightGray"|
+[[/Deposition of CrSi|CrSi bilayer]] <br/>
 |-
 |}
-===Alloys===
+Oh no! My material is not on the list! Please contact the [mailto:thinfilm@nanolab.dtu.dk Thin Film group] if you would like to inquire about a material that is not mentioned here.
-*[[/Deposition of TiW|TiW]] alloy (10%/90% by weight)
-*[[/Deposition of NiCr|NiCr]] alloy
-*[[/Deposition of AlTi|AlTi]] alloy
+== Choose deposition equipment ==
+{| {{table}}
+| align="left" valign="top"  style="background:LightGray"|''' PVD - Physical vapor deposition'''
+| align="left" valign="top" style="background:#DCDCDC;"|''' LPCVD - low pressure chemical vapor deposition'''
+| align="left" valign="top" style="background:LightGray"|''' PECVD - plasma enhanced chemical vapor deposition'''
+| align="left" valign="top" style="background:#DCDCDC;"|''' ALD - atomic layer deposition'''
+| align="left" valign="top" style="background:LightGray"|''' Coaters - for polymers'''
+| align="left" valign="top" style="background:#DCDCDC;"|''' Others'''
-=== Polymers ===
-*[[Specific Process Knowledge/Photolithography/SU8|SU8]]
-*Antistiction coating
-*Topas
-*PMMA
-== Choose deposition equipment ==
-*[[/Alcatel|Alcatel]] - ''E-beam evaporator and sputter tool''
+|-valign="top"
+|style="background: LightGray"|
+*[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) ]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system''
 *[[/Lesker|Lesker]] - ''Sputter tool''
-*[[/Multisource_PVD|PVD co-sputter/evaporation]] - ''E-beam evaporator and multiple wafer tool''
 *[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator''
-*[[Specific Process Knowledge/III-V Process/thin film dep/physimeca|Physimeca]] - ''E-beam evaporator (III-V lab)''
+*[[/thermalevaporator|Thermal evaporator]]
-*[[Specific Process Knowledge/Etch/IBE&frasl;IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching''
+*[[/Temescal|E-Beam Evaporator (Temescal)]]
-*[[/Hummer|Hummer]] - ''Gold sputtering system''
+*[[/10-pocket e-beam evaporator|E-Beam Evaporator (10 pockets)]]
+*[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system''
+*[[/Sputter coater#Sputter_coater_04_(Agar Scientific)|Sputter coater 04]] - ''Gold sputtering system''
+<!--*[[/Sputter coater#The_Hummer_Sputter_coater|Sputter coater Hummer]] -<span style="color:Red"> (Decommissioned</span>) ''Gold sputtering system''
+*[[/Sputter coater#The_Balzer_Sputter_coater|Balzer Sputter coater]] -<span style="color:Red"> (Decommissioned</span>) ''Gold sputtering system''
+*[[/III-V Dielectric evaporator|III-V Dielectric evaporator]] -<span style="color:Red"> (Decommissioned</span>) ''E-beam evaporation tool''
+*[[/Alcatel|Alcatel]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and sputter tool''
+*[[/Physimeca|Physimeca]] - ''E-beam evaporator''
+*[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and multiple wafer tool'' -->
+|style="background: #DCDCDC"|
+*[[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Furnace LPCVD Nitride (4" and 6")]] - ''Deposition of silicon nitride''
+*[[/Furnace LPCVD PolySilicon|Furnace LPCVD Polysilicon (4" and 6")]] ''Deposition of polysilicon''
+*[[/Furnace LPCVD TEOS|Furnace LPCVD TEOS (4")]] - ''Deposition of silicon oxide''
+|style="background: LightGray"|
 *[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
-*[[/Furnace LPCVD Nitride|Furnace LPCVD Nitride (4" and 6")]] - ''Deposition of silicon nitride''
+<!--*[[/DiamondCVD|Seki Diamond CVD]] - ''Microwave Plasma CVD for diamond Growth''-->
-*[[/Furnace LPCVD PolySilicon|Furnace LPCVD Polysilicon (4" and 6")]] - ''Deposition of polysilicon''
+|style="background: #DCDCDC"|
-*[[/Furnace LPCVD TEOS|Furnace LPCVD TEOS (4")]] - ''Deposition of silicon oxide''
+*[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal)
+*[[/ALD2 (PEALD)|ALD2 (PEALD)]] - Atomic Layer Deposition (thermal and plasma enhanced)
+|style="background: LightGray"|
+See the [[Specific Process Knowledge/Lithography/Coaters |Lithography/Coaters]] page for coating polymers
+|style="background: #DCDCDC"|
 *[[/MVD|MVD]] - ''Molecular Vapor Deposition''
-*[[/Black Magic PECVD|Black Magic PECVD]] - ''Black Magic PECVD (Carbon)''
+*Electroplating of Ni, Cu, Au, etc. - ''Ask in the department of Mechanical Engineering''
-*[[/Electroplating-Ni|Electroplating-Ni]] - ''Electrochemical deposition of nickel''
+*MOCVD - Epitaxial growth of InP, GaAs and other III-V materials - ''Ask DTU Electro if you are interested: [mailto:esem@dtu.dk Elizaveta Semenova] or [mailto:kryv@dtu.dk Kresten Yvind]''
-=  Section under construction [[Image:section under construction.jpg|70px]] =
-{| {{table}}
-| align="center" style="background:#f0f0f0;"|''' Dielectrica'''
-| align="center" style="background:#f0f0f0;"|''' Semicondutors'''
-| align="center" style="background:#f0f0f0;"|''' Metals'''
-| align="center" style="background:#f0f0f0;"|''' Alloys'''
-| align="center" style="background:#f0f0f0;"|''' Polymers'''
-|-
-|
-*[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''Silicon nitride and silicon oxynitride''
-*[[/Deposition of Silicon Oxide|Silicon Oxide]]
-*[[/Deposition of Titanium Oxide|Titanium Oxide]]
-|
-*[[/Deposition of Silicon|14 Si Silicon]]
-|
-*Flow
-*sccm
-|
-*[[/Deposition of TiW|TiW]] alloy (10%/90% by weight)
-*[[/Deposition of NiCr|NiCr]] alloy
-*[[/Deposition of AlTi|AlTi]] alloy
-|
-*[[Specific Process Knowledge/Photolithography/SU8|SU8]]
-*Antistiction coating
-*Topas
-*PMMA
 |-
 |}