Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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-==Manual Spinner( Polymers)==
+{{cc-nanolab}}
-[[Image:Opticoat.jpg|200×200px|right|thumb|The Manual Spinner(Polymers) is placed in fumehood in Cleanroom 3.]]
-The Manual Spinner(Polymers), Opticoat SB20+, from SSE Sister Semiconductor Equipment, are dedicated for spinning of imprint polymers, e-beam resist in small batches, SU8 resist and other polymers with extra addictive like color, nano particles etc.
+[[Category: Equipment|Lithography exposure]]
+[[Category: Lithography|Exposure]]
-There are 2 hotplates with temperature range up to 250C, placed in the same fumehood, which can be used for baking before/after spinning.
+__TOC__
+=UV Exposure Comparison Table=
+{| class="wikitable"
+|-
+!
+! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MA6-1|Aligner: MA6-1]]
+! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MA6-2|Aligner: MA6-2]]
+! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA1|Aligner: Maskless 01]]
+! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA2|Aligner: Maskless 02]]
+! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA3|Aligner: Maskless 03]]
+! [[Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA4|Aligner: Maskless 04]]
+|-
+! scope=row| Purpose
+|
+*Top side alignment
+*Back side alignment
+*UV exposure
+NB: this tool is in PolyFabLab
+|
+*Top side alignment
+*Back side alignment
+*UV exposure
+*Bond alignment
+|
+*Top side alignment
+*Maskless UV exposure
+|
+*Top side alignment
+*Back side alignment
+*Maskless UV exposure
+|
+*Top side alignment
+*Back side alignment
+*Maskless UV exposure
+|
+*Top side alignment
+*Maskless UV exposure
+*Direct laser writing
+NB: this tool is in PolyFabLab
+|-
+! scope=row| Minimum feature size
+| ~1 µm || ~1 µm || ~1 µm || ~1 µm || ~1 µm || ~1 µm
+|-
+! scope=row| Alignment accuracy
+|
+*TSA: ±2 µm
+*BSA: ±5 µm
+|
+*TSA: ±1 µm
+*BSA: ±2 µm
+|
+±2 µm<br>(±1 µm possible)
+|
+*TSA: ± 0.5 µm
+*BSA: ± 1 µm
+|
+*TSA: ± 0.5 µm
+*BSA: ± 1 µm
+|
+±1 µm
+|-
+! scope=row| Exposure light source
+|
+*350 W Hg lamp
+*i-line filter (365nm band pass filter)
+|
+*500 W Hg-Xe lamp
+*i-line filter (365nm band pass filter)
+|
+nm LED
+|
+nm laser diode array
+|
+nm laser diode array
+|
+*365 nm LED
+*405 nm laser diode
+|-
+! scope=row| Exposure mode
+|
+*Flood exposure
+*Proximity
+*Contact:
+**Soft contact
+**Hard contact
+**Vacuum contact
+|
+*Flood exposure
+*Proximity
+*Contact:
+**Soft contact
+**Hard contact
+**Vacuum contact
+|
+*Projection:
+**Pneumatic auto-focus
+|
+*Projection:
+**Optical auto-focus
+**Pneumatic auto-focus
+|
+*Projection:
+**Pneumatic auto-focus
+|
+*Projection:
+**Optical auto-focus
+**Pneumatic auto-focus
+*Direct laser writing:
+**Optical auto-focus
+**Pneumatic auto-focus
+|-
+! scope=row| Batch size
+| 1 || 1 || 1 || 1 || 1 || 1
+|-
+! scope=row| Allowed materials
+| All PolyFabLab materials
+|
+*All cleanroom materials except copper and steel
+*Dedicated chuck for III-V materials
+| All cleanroom materials
+| All cleanroom materials
+| All cleanroom materials
+| All PolyFabLab materials
+|-
+|}
-'''The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager:'''
+=Mask vs Maskless aligners=
-Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=251 LabManager]
+Comparison study between mask aligners and maskless aligners can be found [[Specific_Process_Knowledge/Lithography/Aligners/MAvsMLA|here]].
+=Decommisioned tools=
+<span style="color:red">Inclined UV lamp was decommissioned 2023.</span>
+[[Specific Process Knowledge/Lithography/UVExposure/aligner_inclinedUV|Information about decommissioned tool can be found here.]]