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==Aligner: Maskless 03==
=Aligner: Maskless 03=
[[File:Aligner MLA 3.jpg|400px|thumb|Aligner: Maskless 03 is located in E-5.]]
[[File:Aligner MLA 3.jpg|400px|thumb|Aligner: Maskless 03 is located in E-5.]]
MLA150 WMII maskless aligner from Heidelberg Instruments GmbH, installed 2020.


'''Tool description'''<br>
The MLA3 is a UV exposure tool, which can be used for direct writing of digital mask designs, on photosensitive resists on chips, 50 mm, 100 mm and 150 mm substrates. It is possible to load a 200 mm wafer, but the writable area is only 150 mm x 150 mm.


'''Special features:'''
{| class="wikitable"
*Backside Alignment
! style="text-align:left" | Product:
| style="padding-left: 10px" | Heidelberg Instruments MLA150 WM II Maskless Aligner
|-
! style="text-align:left" | Year of purchase:   
| style="padding-left: 10px" | 2019
|-
! style="text-align:left" | Location:
| style="padding-left: 10px" | Cleanroom E-5
|}
 
'''Features'''
*Pneumatic Autofocus
*Top side Alignment
*Back side Alignment
*Advanced Field Alignment Mode for alignment to individual chips/devices on the substrate
*Advanced Field Alignment Mode for alignment to individual chips/devices on the substrate
*Separate conversion PC (Power PC)


Link to information about [[Specific_Process_Knowledge/Pattern_Design#Alignment_marks|alignment mark design]].
'''User manual'''<br>
The user manual and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=464 LabManager] - '''requires login'''


'''[https://www.youtube.com/playlist?list=PLjWVU97LayHAiCabstMfAUeeWyQoQI_cV Training videos]'''
'''Tool training'''<br>
Training on the tool requires users to complete the [https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography#Lithography_Tool_Package_Training lithography TPT] followed by the online tool training and a hands-on authorization training.<br>
<br clear="all" />


Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=464 LabManager] - '''requires login'''
=Equipment performance and process related parameters=
 
{| class="wikitable"
===Exposure dose and defocus===
[[Specific Process Knowledge/Lithography/Resist/UVresist/exposureDoseMasklessAligners#Aligner:_Maskless_03|Information on UV exposure dose]]
 
===[[Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 03 processing|Process information]]===
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Exposure_technology|Exposure technology]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Process_Parameters|Process Parameters]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Features|Features]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Alignment|Alignment]]
 
===Quality Control (QC)===
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for Aligner: Maskless 03 (MLA3) - Dose and Defoc'''
|-
|-
|
! scope=row style="text-align: left;" | Purpose
*[http://labmanager.dtu.dk/d4Show.php?id=5644&mach=464 The QC procedure for Aligner: Maskless 03 (MLA3)] - '''requires login'''<br>
| Alignment and UV exposure
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=464 The newest QC data for Aligner: Maskless 03 (MLA3)] - '''requires login'''
{| {{table}}
| align="center" |  
{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:300px"
 
! QC Recipe:
! Dose and defocus test on 1.5µm AZ5214E
|-
|Dose test
|Last QC value ± 20 mJ/cm<sup>2</sup> (9 steps total)
|-
|Defoc test
|Last QC value ± 8 (9 steps total)
|-
|-
|}
! scope=row style="text-align: left;" | Exposure modes
| align="center" valign="top"|
| Projection
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
!QC limits
!Aligner: Maskless 03 (MLA3)
|-
|-
|Dose
! scope=row style="text-align: left;" | Exposure light/filters
|none
| 405 nm (laser diode array)
|-
|-
|Defoc
! scope=row style="text-align: left;" | Dynamic focusing method
|none
| Pneumatic
|-
|-
|}
! scope=row style="text-align: left;" | Minimum resolution
| ~1 µm
|-
|-
|}
! scope=row style="text-align: left;" | Design file formats
Dose and defoc values are reported in the QC data sheet.
|  
|}
*GDS-II
<br/>
*CIF
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
*DXF
|bgcolor="#98FB98" |'''Quality Control (QC) for Aligner: Maskless 03 (MLA3) - Alignment'''
*Gerber
|-
*HIMT format
|
*[http://labmanager.dtu.dk/d4Show.php?id=5644&mach=464 The QC procedure for Aligner: Maskless 03 (MLA3)] - '''requires login'''<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=464 The newest QC data for Aligner: Maskless 03 (MLA3)] - '''requires login'''
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:300px"
 
! QC Recipe:
! Alignment accuracy test
|-
|Topside alignment
|Expose an overlay design after automatic alignment to 4 alignment marks using the High Res camera and applying scaling and shearing.
 
Alignment accuracy in 9 points across a 100mm wafer is measured, the average alignment error is reported.
|-  
|Backside alignment
|Expose an overlay design after automatic alignment to 4 backside alignment marks and applying scaling and shearing. Rotate the wafer 180° and repeat.
 
Alignment accuracy in 9 points across a 100mm wafer is measured, half the average alignment error is reported.
|-
|}
| align="center" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:400px"
!QC limits
!Aligner: Maskless 03 (MLA3)
|-
|-
|Topside alignment error
! scope=row style="text-align: left;" | Alignment modes
|>0.5µm
|  
*Top side (TSA): ±0.5 µm
*Back side (TSA): ±1 µm
*Advanced field alignment (chip-by-chip TSA): ±0.25 µm
|-
|-
|Backside alignment error
! scope=row style="text-align: left;" | Substrate size
|>1µm
|  
*Maximum writing area: 150 mm x 150 mm
*Small pieces: 5 mm x 5 mm
*50 mm wafers
*100 mm wafers
*150 mm wafers
|-
|-
|}
! scope=row style="text-align: left;" | Allowed materials
|
*All cleanroom allowed materials
*Total height variation across the substrate must be less than ±90 µm - including wafer bow
|-
|-
! scope=row style="text-align: left;" | Substrate batch
| 1
|}
|}
Camera offsets will be adjusted if alignment error is outside the limit.
|}
<br/>


=== Equipment performance and process related parameters ===
=[[Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 03 processing|Process information]]=
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Exposure_technology|Exposure technology]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Process_Parameters|Process Parameters]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Features|Features]]
*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_03_processing#Alignment|Alignment]]


{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"
==Exposure dose==
[[Specific Process Knowledge/Lithography/Resist/UVresist/exposureDoseMasklessAligners#Aligner:_Maskless_03|Information on UV exposure dose]]


==Alignment mark design and locations==
[[Specific_Process_Knowledge/Pattern_Design#Alignment_marks|Alignment mark design and locations]].


!style="background:silver; color:black;" align="center" width="60"|Purpose
==Quality Control (QC)==
|style="background:LightGrey; color:black"|
The purpose of the QC process is to check the optical performance and alignment accuracy of the maskless aligners. The optical performance is checked by making a dose/defocus test. The alignment accuracy is checked by making a global alignment test for both topside alignment and back side alignment.
|style="background:WhiteSmoke; color:black" colspan="2"|
Alignment and UV exposure
|-


!style="background:silver; color:black" align="left" valign="center" rowspan="6"|Performance
'''Dose/defoc limit:'''<br>
Deviations in the optical performance are not easily corrected, and is likely due to contaminated or damaged writehead. If either the dose or defoc changes, the tool is investigated for writehead contamination and/or damage.


|style="background:LightGrey; color:black"|Exposure mode
'''Alignment accuracy accept limit:'''<br>
|style="background:WhiteSmoke; color:black" colspan="2"|
Must be within machine specifications, and should be adjusted if necessary. The top side alignment accuracy for MLA3 is ±0.5 µm. The backside alignment accuracy for MLA3 is ±1 µm.
Projection
|-
| style="background:LightGrey; color:black"|Exposure light
|style="background:WhiteSmoke; color:black" colspan="2"|
405nm<br>(laser diode array)
|-
|style="background:LightGrey; color:black"|Focusing method
|style="background:WhiteSmoke; color:black" colspan="2"|
Pneumatic
|-
|style="background:LightGrey; color:black"|Minimum structure size
|style="background:WhiteSmoke; color:black" colspan="2"|
down to 1 µm
|-
|style="background:LightGrey; color:black"|Design formats
|style="background:WhiteSmoke; color:black" colspan="2"|
*'''GDS-II'''
*CIF
*DXF
*Gerber
*HIMT format
|-
|style="background:LightGrey; color:black"|Alignment modes
|style="background:WhiteSmoke; color:black" colspan="2"|
*Top side alignment, ±0.5µm
*Backside alignment, ±1.0µm
*Field alignment (chip-by-chip TSA), ±0.25µm (within 5x5mm<sup>2</sup> area)


|-
'''Documentation:'''<br>
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
*[https://labmanager.dtu.dk/d4mb/show.php?dokId=11637&mach=464 The QC procedure for Aligner: MLA3] - '''requires login'''<br>
|style="background:LightGrey; color:black"|Substrate size
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=464 The newest QC data for Aligner: MLA3] - '''requires login'''
|style="background:WhiteSmoke; color:black" colspan="2"|
* maximum writing area: 150x150 mm<sup>2</sup>
* 150 mm wafer
* 100 mm wafer
* 50 mm wafer
* pieces down to 5x5 mm<sup>2</sup>
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" colspan="2"|
All cleanroom materials
<br>Total height variation across the substrate must be less than ±90 µm - including wafer bow
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" colspan="2"|
1
|-  
|}
<br clear="all" />

Latest revision as of 13:59, 26 June 2026

Aligner: Maskless 03

Aligner: Maskless 03 is located in E-5.

Tool description
The MLA3 is a UV exposure tool, which can be used for direct writing of digital mask designs, on photosensitive resists on chips, 50 mm, 100 mm and 150 mm substrates. It is possible to load a 200 mm wafer, but the writable area is only 150 mm x 150 mm.

Product: Heidelberg Instruments MLA150 WM II Maskless Aligner
Year of purchase: 2019
Location: Cleanroom E-5

Features

  • Pneumatic Autofocus
  • Top side Alignment
  • Back side Alignment
  • Advanced Field Alignment Mode for alignment to individual chips/devices on the substrate

User manual
The user manual and contact information can be found in LabManager - requires login

Tool training
Training on the tool requires users to complete the lithography TPT followed by the online tool training and a hands-on authorization training.

Equipment performance and process related parameters

Purpose Alignment and UV exposure
Exposure modes Projection
Exposure light/filters 405 nm (laser diode array)
Dynamic focusing method Pneumatic
Minimum resolution ~1 µm
Design file formats
  • GDS-II
  • CIF
  • DXF
  • Gerber
  • HIMT format
Alignment modes
  • Top side (TSA): ±0.5 µm
  • Back side (TSA): ±1 µm
  • Advanced field alignment (chip-by-chip TSA): ±0.25 µm
Substrate size
  • Maximum writing area: 150 mm x 150 mm
  • Small pieces: 5 mm x 5 mm
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials
  • All cleanroom allowed materials
  • Total height variation across the substrate must be less than ±90 µm - including wafer bow
Substrate batch 1

Process information

Exposure dose

Information on UV exposure dose

Alignment mark design and locations

Alignment mark design and locations.

Quality Control (QC)

The purpose of the QC process is to check the optical performance and alignment accuracy of the maskless aligners. The optical performance is checked by making a dose/defocus test. The alignment accuracy is checked by making a global alignment test for both topside alignment and back side alignment.

Dose/defoc limit:
Deviations in the optical performance are not easily corrected, and is likely due to contaminated or damaged writehead. If either the dose or defoc changes, the tool is investigated for writehead contamination and/or damage.

Alignment accuracy accept limit:
Must be within machine specifications, and should be adjusted if necessary. The top side alignment accuracy for MLA3 is ±0.5 µm. The backside alignment accuracy for MLA3 is ±1 µm.

Documentation:

Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/UVExposure/aligner_MLA3&oldid=55879"