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== UV Exposure Comparison Table ==
{{cc-nanolab}}


'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/UVExposure click here]'''


{| border="2" cellspacing="0" cellpadding="2"  
[[Category: Equipment|Lithography exposure]]
[[Category: Lithography|Exposure]]
 
__TOC__
 
=UV Exposure Comparison Table=
 
 
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"  


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#KS Aligner|KS Aligner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner: MA6-1|Aligner: MA6-1]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#EVG Aligner|EVG Aligner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6-2|Aligner: MA6-2]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#III-V Aligner|III-V Aligner]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner: Maskless 01|Aligner: Maskless 01]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Inclined UV Lamp|Inclined UV Lamp]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner: Maskless 02|Aligner: Maskless 02]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner: Maskless 03|Aligner: Maskless 03]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner: Maskless 04|Aligner: Maskless 04]]</b>
<!--|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Inclined UV Lamp|Inclined UV Lamp]]</b>-->


|-
|-
Line 14: Line 26:
|style="background:LightGrey; color:black"|  
|style="background:LightGrey; color:black"|  
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spinning and baking of AZ5214E resist
*Top Side Alignment
*Spinning and baking of AZ4562 resist
*Back Side Alignment
*Spinning and baking of e-beam resist
*UV exposure
OBS: this tool is in PolyFabLab
|style="background:WhiteSmoke; color:black"|
*Top Side Alignment
*Back Side Alignment
*UV exposure
*(DUV exposure)
*Bond alignment
|style="background:WhiteSmoke; color:black"|
*Top Side Alignment
*Maskless UV exposure
|style="background:WhiteSmoke; color:black"|
*Top Side Alignment
*Back Side Alignment
*Maskless UV exposure
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Spinning and baking of AZ5214E resist
*Top Side Alignment
*Spinning and baking of AZ4562 resist
*Back Side Alignment
*Spinning and baking of SU8 resist
*Maskless UV exposure
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*In-line substrate HMDS priming
*Top Side Alignment
*Coating and baking of AZ MiR 701 (29cps) resist
*Maskless UV exposure
*Coating and baking of AZ nLOF 2020 resist
*Direct laser writing
*Post-exposure baking at 110°C
OBS: this tool is in PolyFabLab
|
<!--|style="background:WhiteSmoke; color:black"|
*UV exposure
*DUV exposure-->


|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Performance
|style="background:LightGrey; color:black"|Substrate handling
|style="background:LightGrey; color:black"|Minimum feature size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
~1 µm
* Edge handling chuck
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Single substrate
~1 µm
* Non-vacuum chuck for fragile substrates
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
~1 µm
|Single substrate
|-
|style="background:LightGrey; color:black"|Permanent media
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* AZ5214E resist
~1 µm
* AZ4562 resist
* Acetone for chuck cleaning
* Acetone for drip pan
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* AZ5214E resist
~1 µm
* PGMEA for edge bead removal
* Acetone for chuck cleaning
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701 (29cps) resist
~1 µm
* AZ nLOF 2020 resist
<!--|style="background:WhiteSmoke; color:black"|-->
* PGMEA for backside rinse and edge-bead removal
* PGMEA for spinner bowl cleaning and vapor tip bath
|


|-
|-
|style="background:LightGrey; color:black"|Manual dispense option
|style="background:LightGrey; color:black"|Alignment accuracy
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* 2 automatic syringes
*TSA: ±2 µm
*BSA: ±5 µm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* yes
*TSA: ±1 µm
* pneumatic dispense for SU8 resist
*BSA: ±2 µm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
* no
±2 µm<br>(±1 µm possible)
|style="background:WhiteSmoke; color:black"|
*TSA: ± 0.5 µm
*BSA: ± 1 µm
|style="background:WhiteSmoke; color:black"|
*TSA: ± 0.5 µm
*BSA: ± 1 µm
|style="background:WhiteSmoke; color:black"|
±1 µm
<!--|style="background:WhiteSmoke; color:black"|-->


|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|style="background:LightGrey; color:black"|Exposure light
|style="background:LightGrey; color:black"|Spindle speed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Range
*350W Hg lamp
*i-line filter (365nm bandpass filter)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Range
*500W Hg-Xe lamp
*i-line filter (365nm bandpass filter)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*10 - 9990 rpm
365nm LED
|
|style="background:WhiteSmoke; color:black"|
375nm laser diode array
|style="background:WhiteSmoke; color:black"|
405nm laser diode array
|style="background:WhiteSmoke; color:black"|
*365nm LED
*405nm laser diode
<!--|style="background:WhiteSmoke; color:black"|
*1000 W Hg-Xe lamp
*Dichroic mirror:
**Near UV (350-450nm)
**Mid UV (260-320nm)
**Deep UV (220-260nm)-->


*10-5000 rpm
|-
|-
|style="background:LightGrey; color:black"|Parameter 2
|style="background:LightGrey; color:black"|Exposure mode
|style="background:WhiteSmoke; color:black"|
*Flood exposure
*Proximity
*Contact:
**Soft contact
**Hard contact
**Vacuum contact
|style="background:WhiteSmoke; color:black"|
*Flood exposure
*Proximity
*Contact:
**Soft contact
**Hard contact
**Vacuum contact
|style="background:WhiteSmoke; color:black"|
*Projection:
**Pneumatic auto-focus
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Range
*Projection:
**Optical auto-focus
**Pneumatic auto-focus
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Range
*Projection:
**Pneumatic auto-focus
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Range
*Projection:
|
**Optical auto-focus
**Pneumatic auto-focus
*Direct laser writing:
**Optical auto-focus
**Pneumatic auto-focus
<!--|style="background:WhiteSmoke; color:black"|
*Flood exposure
*Proximity exposure with home-made chuck and maskholder
*Inclined exposure
*Rotating exposure-->


|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*<nowiki>24</nowiki> 50 mm wafers
*1 100 mm wafer
*<nowiki>24</nowiki> 100 mm wafers
|style="background:WhiteSmoke; color:black"|
*<nowiki>24</nowiki> 150 mm wafers
*1 small sample, down to 10x10 mm<sup>2</sup>
*1 50 mm wafer
*1 100 mm wafer
*1 150 mm wafer
|style="background:WhiteSmoke; color:black"|
*1 small sample, down to 5x5 mm<sup>2</sup>
*1 50 mm wafer
*1 100 mm wafer
*1 150 mm wafer (exposure area only 125x125 mm<sup>2</sup>)
|style="background:WhiteSmoke; color:black"|
*1 small sample, down to 3x3 mm<sup>2</sup>
*1 50 mm wafer
*1 100 mm wafer
*1 150 mm wafer
*1 200 mm wafer
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*<nowiki>1</nowiki> 100 mm wafer
*1 small sample, down to 5x5 mm<sup>2</sup>
*<nowiki>1</nowiki> 150 mm wafer  
*1 50 mm wafer
*1 100 mm wafer
*1 150 mm wafer
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*<nowiki>25</nowiki> 100 mm wafers
*1 small sample, down to 3x3 mm<sup>2</sup>
|
*1 50 mm wafer
*1 100 mm wafer
*1 150 mm wafer
<!--|style="background:WhiteSmoke; color:black"|
*all sizes up to 8inch-->


* Maximum substrate size: 6"
* Minimum substrate size: 3*3 mm2
* maximum substrate thickness: 4 mm
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
*All PolyFabLab materials
*Allowed material 2
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except copper and steel
*Dedicated chuck for III-V materials
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Allowed material 1
*All cleanroom materials
*Allowed material 2
*Allowed material 3
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon
*All cleanroom materials
*Glass
|style="background:WhiteSmoke; color:black"|
|
*All PolyFabLab materials
 
<!--|style="background:WhiteSmoke; color:black"|
*III-V compound semiconductors
*All cleanroom materials-->
*Si, SiO2, SOI
|-  
|-  
|}
|}


<br clear="all" />
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MA6-1}}
 
== KS Aligner ==
 
[[Image:KSaligner.jpg|300x300px|thumb|The KSaligner MA6 is placed in Cleanroom 3.]]
SUSS Mask Aligner MA6 is designed for high resolution photolithography.
The 365nm exposure wavelength version is capable of 1.25 (1.0) um resolution in vacuum contact. All contact exposure programs (vacuum, hard, soft, proximity) are supplied.
Two alignment options are available: top side alignment (TSA) with a split field or a video microscope and back side alignment (BSA) with BSA microscope. It is also possible to make IR- light alignment.
 
'''The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager:'''
Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=44 LabManager]
 
== EVG Aligner ==
 
== III-V Aligner ==
 


{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MA6-2}}


==Inclined UV lamp==
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MLA1}}
[[Image:Inclined UV lamp_1.jpg|200×200px|right|thumb|Inclined UV lamp is placed in Cleanroom 13.]]


The Inclined UV lamp is 1000 W Hg(Xe)lamp source designed for near UV, 350-450nm, mid UV, 260-320nm, and deep UV, 220-260nm exposures of resists and polymers. The exposure source can be also used to make an inclined exposure in air or in the media tank.
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MLA2}}


The toll was purchased in February 2009 from Newport company. The exposure lamp has a official name: Oriel Flood Exposure Source, unit 92540. All other parts of equipment: substrate and mask holder with media tank, exhaust box around the tool, timer controller, were designed and build at Danchip workshop.
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MLA3}}


The substrate and mask holder with a media tank was designed as part of Master Thesis of DTU Nanotech, Andres Kristensen group. The exhaust box was made as part of safety and the timer controller was build to control exposure time.
{{:Specific Process Knowledge/Lithography/UVExposure/aligner_MLA4}}


The technical specification and the general outline of the equipment can be found in LabManager.  
=Decommisioned tools=
<span style="color:red">Inclined UV lamp was decommissioned 2023.</span>


'''The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager:'''
[[Specific Process Knowledge/Lithography/UVExposure/aligner_inclinedUV|Information about decommissioned tool can be found here.]]
Equipment info in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&page_id=169 LabManager]
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/UVExposure"