Jump to content

Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3: Difference between revisions

← Older edit
VisualWikitext
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,579 edits
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,579 edits
No edit summary
 
(8 intermediate revisions by 2 users not shown)
Line 5: Line 5:


<!--Checked for updates on 2/10-2020 - ok/jmli -->
<!--Checked for updates on 2/10-2020 - ok/jmli -->
<!--Checked for updates on 5/2-2026 - ok/jmli -->


==Pegasus 3 - 150mm silicon etching==
==Pegasus 3 - 150mm silicon etching==
 
{{Contentbydryetch}}
 
[[Image:05x.jpg |frame|left|x300px|The Pegasus 3 cassette station (left), operator station (center) and support computer with Picoscope process monitoring.{{photo1}} ]]
 
<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|300px]]
 
'''The tool is ready for user training. '''
 
[[Image:05x.jpg |frame|left|x300px|The Pegasus 3 cassette station (left), operator station (center) and support computer with Picoscope process monitoring. ]]




Line 25: Line 20:


'''Standard recipes'''
'''Standard recipes'''
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3/DREM | The DREM recipes 0.5 kW and 0.2 kW ]]


*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3/DREM0.2kW ]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3/DREM0.5kWv2.3 |DREM 0.5kW v2.3]]




Line 53: Line 47:


  <!-- *[[Specific Process Knowledge/Etch/DRIE-Pegasus/VeeryDeeep| Very deep etching]] -->
  <!-- *[[Specific Process Knowledge/Etch/DRIE-Pegasus/VeeryDeeep| Very deep etching]] -->
*[[/SiO2 etch|Etch of very thin layers of SiO2]]


=== Wafer bonding ===
=== Wafer bonding ===
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-3"