Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3: Difference between revisions
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<!--Checked for updates on 2/10-2020 - ok/jmli --> | <!--Checked for updates on 2/10-2020 - ok/jmli --> | ||
<!--Checked for updates on 5/2-2026 - ok/jmli --> | |||
==Pegasus 3 - 150mm silicon etching== | ==Pegasus 3 - 150mm silicon etching== | ||
{{Contentbydryetch}} | |||
[[Image:05x.jpg |frame|left|x300px|The Pegasus 3 cassette station (left), operator station (center) and support computer with Picoscope process monitoring.{{photo1}} ]] | |||
[[Image:05x.jpg |frame|left|x300px|The Pegasus 3 cassette station (left), operator station (center) and support computer with Picoscope process monitoring. ]] | |||
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'''Standard recipes''' | '''Standard recipes''' | ||
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-3/DREM | The DREM recipes 0.5 kW and 0.2 kW ]] | |||
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=== Other etch processes === | === Other etch processes === | ||
More processes, such as for DUV resist, are currently being developed, but they are not quite 'ready for publication' at LabAdviser so please contact Jonas (mailto:jmli@dtu.dk) for more information. | More processes, such as for DUV resist, are currently being developed, but they are not quite 'ready for publication' at LabAdviser so please contact Jonas (mailto:jmli@dtu.dk) for more information. | ||
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<!-- *[[Specific Process Knowledge/Etch/DRIE-Pegasus/VeeryDeeep| Very deep etching]] --> | <!-- *[[Specific Process Knowledge/Etch/DRIE-Pegasus/VeeryDeeep| Very deep etching]] --> | ||
*[[/SiO2 etch|Etch of very thin layers of SiO2]] | |||
=== Wafer bonding === | === Wafer bonding === | ||