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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development click here]'''
{{cc-nanolab}}


=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Development click here]'''


[[Category: Equipment|Lithography development]]
[[Category: Lithography|Development]]


==Coaters: Comparison Table==
__TOC__
 
{| border="2" cellspacing="0" cellpadding="2"
 
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer-1 and Developer-2|Developer 1 and 2]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer-6inch|Developer-6inch]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#SU8-Developer|SU8-Developer]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer-TMAH|Developer-TMAH]]</b>
 
|-
!style="background:silver; width:100px; color:black;" align="center"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
*Coating and baking of
**AZ5214E resist
**AZ4562 resist
**E-beam resist
|style="background:WhiteSmoke; color:black"|
*Coating and baking of
**AZ5214E resist
**AZ4562 resist
**SU8 resist
|style="background:WhiteSmoke; color:black"|
*Coating and baking of
**SU8 resist
|style="background:WhiteSmoke; color:black"|
*In-line substrate HMDS priming
*Coating and baking of
**AZ MiR 701 (29cps) resist
**AZ nLOF 2020 resist
*Post-exposure baking at 110°C


=Development Comparison Table=
{| class="wikitable"
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Performance
!
|style="background:LightGrey; color:black"|Substrate handling
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
|style="background:WhiteSmoke; color:black"|
! [[Specific_Process_Knowledge/Lithography/Development/SU8_developer|Developer: SU8 (Wet bench)]]
* Cassette-to-cassette
! [[Specific_Process_Knowledge/Lithography/Development/manualEbeam_developer|Developer: E-beam 02]]
* Edge handling chuck
! [[Specific_Process_Knowledge/Lithography/Development/manualTMAH_developer|Developer: TMAH Manual 02]]
|style="background:WhiteSmoke; color:black"|
! [[Specific_Process_Knowledge/Lithography/Development/UV_developer|Developer: TMAH UV-lithography]]
* Single substrate
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer|Developer: TMAH Stepper]]
* Non-vacuum chuck for fragile substrates
|style="background:WhiteSmoke; color:black"|
* Cassette-to-cassette
|-
|-
|style="background:LightGrey; color:black"|Permanent media
! scope=row style="text-align: left;" | Purpose
|style="background:WhiteSmoke; color:black"|
|
* AZ5214E resist
Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools
* AZ4562 resist
* Acetone for chuck cleaning
* Acetone for drip pan
|style="background:WhiteSmoke; color:black"|
* AZ5214E resist
* PGMEA for edge bead removal
* Acetone for chuck cleaning
|style="background:WhiteSmoke; color:black"|
* AZ MiR 701 (29cps) resist
* AZ nLOF 2020 resist
* PGMEA for backside rinse and edge-bead removal
* PGMEA for spinner bowl cleaning and vapor tip bath
|-
|style="background:LightGrey; color:black"|Manual dispense option
|style="background:WhiteSmoke; color:black"|
* 2 automatic syringes
|style="background:WhiteSmoke; color:black"|
* yes
* pneumatic dispense for SU8 resist
|style="background:WhiteSmoke; color:black"|
* no


|-
<span style="color:red">Requires individual risk assessment for TMAH development!</span>
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
|
|style="background:LightGrey; color:black"|Spindle speed
Development of:
|style="background:WhiteSmoke; color:black"|
*SU-8
*100-5000 rpm
|
|style="background:WhiteSmoke; color:black"|
Development of:
*100-5000 rpm
*ZEP 520A
|style="background:WhiteSmoke; color:black"|
*AR-P 6200.xx (CSAR)
*10 - 9990 rpm
|  
|-
Development of:
|style="background:LightGrey; color:black"|Gyrset
*AZ nLOF
|style="background:WhiteSmoke; color:black"|
*AZ MiR 701
*optinal
*AZ 5214E
|style="background:WhiteSmoke; color:black"|
*AZ 4562
*optinal
*DUV resists
|style="background:WhiteSmoke; color:black"|
|  
*no
Development of:
 
*AZ nLOF
|-
*AZ MiR 701
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate  size
|style="background:WhiteSmoke; color:black"|
*50 mm wafers
*100 mm wafers
*150 mm wafers
|style="background:WhiteSmoke; color:black"|
*100 mm wafer
*150 mm wafer
|style="background:WhiteSmoke; color:black"|
*100 mm wafers
*150 mm wafers (tool change required)
|-
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
*1-24
|style="background:WhiteSmoke; color:black"|
*1
|style="background:WhiteSmoke; color:black"|
*1-25
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except III-V materials
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials except III-V materials
|style="background:WhiteSmoke; color:black"|
*Silicon
*Glass
|-
|}
 
<br clear="all" />
 
==Developer-1 and Developer-2==
[[Image:Developer1&2.jpg|300 × 300px|thumb|right|Developer-1 (right) and Developer-2 (left) located in C-1]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer-1_and_Developer-2 click here]'''
 
Developer-1 and Developer-2
 
'''The user APV, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=62 Developer-1] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=63 Developer-2]'''
 
===Process information===
 
*Before using one of developer baths, please check the "Litho4_Dev-7up-KOH" logbook to find out when they were last used. A fresh bath can be reused without problems.
*The main rule is a developer made yesterday must be changed.
*Rinse substrates with water for 4-5 min. after development.
*Spin-dry substrates or dry with nitrogen gun after rinsing.
 
'''Standard development time using vigorous agitation:'''
 
'''AZ 5214E:'''
*1.5µm resist: 60 sec
*2.2µm resist: 70 sec
*4.2µm resist: 3 min
'''AZ 4562:'''
*10µm resist: 5 min
 
====Procedure for making a new developer====
 
1. 800ml "Developer AZ 351B" is mixed with 4000ml water in a special container in the fume hood.
 
2. Fill the bath with the developer mixture and heat it to 22 °C before use.
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Development of
*AZ 5214E
*AZ 5214E
*AZ 4562
*AZ 4562
*DUV resists
Post-exposure baking
|
Development of:
*DUV resists
Post-exposure baking
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Developer  
! scope=row style="text-align: left;" | Developer
|style="background:LightGrey; color:black"|
| Process dependent
|style="background:WhiteSmoke; color:black" align="center"|
| mr-Dev 600 (PGMEA)
AZ 351B diluted 1:5 in water
|  
 
*ZED N-50
(NaOH and sodium borate salt)
*AR 600-50
| AZ 726 MIF (2.38% TMAH in water)
| AZ 726 MIF (2.38% TMAH in water)
| AZ 726 MIF (2.38% TMAH in water)
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
! scope=row style="text-align: left;" | Method
|style="background:LightGrey; color:black"|
| Submersion
|style="background:WhiteSmoke; color:black" align="center"|
| Submersion
Submersion
| Puddle
| Puddle
| Puddle
| Puddle
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
! scope=row style="text-align: left;" | Handling
|style="background:LightGrey; color:black"|Temperature
|
|style="background:WhiteSmoke; color:black" align="center"|
Manual handling in beakers
22°C
*Chip bucket
*Single wafer carrier
*Carrier for up to 5 wafers
|
*Chip bucket
*Single wafer carrier
*Carrier for up to 6 wafers
|
*Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
*Chip chuck for chips & 50 mm substrates
|
*Vacuum-free edge-grip chuck for 100 mm & 150 mm substrates
*Chip chuck for chips & 50 mm substrates
| Vacuum chuck
| Vacuum chuck
|-
|-
|style="background:LightGrey; color:black"|Agitation
! scope=row style="text-align: left;" | Process temperature
|style="background:WhiteSmoke; color:black" align="center"|
| Room temperature
Manual
| Room temperature
| Room temperature
| Room temperature
| Room temperature
| Room temperature
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
! scope=row style="text-align: left;" | Process agitation
|style="background:LightGrey; color:black"|Substrate size
| No agitation allowed
|style="background:WhiteSmoke; color:black" align="center"|
| Magnetic stirrer
* 100 mm wafers
| Rotation
| Rotation
| Rotation
| Rotation
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
! scope=row style="text-align: left;" | Process rinse
|style="background:WhiteSmoke; color:black" align="center"|
| Process dependent
Silicon, glass, and polymer substrates
| IPA
 
| IPA
Film or pattern of all types
| DI water
| DI water
| DI water
|-
|-
|style="background:LightGrey; color:black"|Batch
! scope=row style="text-align: left;" | Substrate size
|style="background:WhiteSmoke; color:black" align="center"|
|
1-8
* Chips
|-
* 50 mm wafers
|}
* 100 mm wafers
 
* 150 mm wafers
<br clear="all" />
|
 
* Chips
==Developer-6inch==
* 50 mm wafers
 
* 100 mm wafers
[[image:6inchDeveloper.jpg|300x300px|right|thumb|The Developer-6inch bench situated in E-5]]
* 150 mm wafers
 
* 200 mm wafers
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Developers#Developer-6inch click here]'''
|
 
* Chips (5mm to 2")
Spin Track 1 + 2 is an SVG 88 series track system from Rite Track. Each track consists of a HMDS priming module, a spin coating module, and a baking module. In fact, the only difference between the two tracks is the resist used in the spin coating module. Spin Track 1 + 2 is capable of handling 150 mm wafers, as well as 100 mm wafers, but is currently set up for 100 mm wafer processing.
* 50 mm wafers
 
* 100 mm wafers
The Spin Track 1 + 2 is controlled using the Recipe Manager software via the touchscreen on the arm attached to the lefthand end of the track. Recipes for the individual modules are developed by Danchip and combined into flows. The user selects a flow (specific to track 1 or 2), and the appropriate recipes will be downloaded and executed on the appropriate track. The other track runs an empty process (no wafers needed), and can unfortunately not be used by a second user while the first user is processing.
* 150 mm wafers
 
* 200 mm wafers
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=189 LabManager]'''
|
 
* Chips (5mm to 50 mm)
===Process information===
* 100 mm wafers
 
* 150 mm wafers
'''Standard development time:'''
|
 
'''AZ 5214E:'''
*1.5µm resist: 60 sec
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Development of
*AZ 5214E
*AZ 4562
|-
!style="background:silver; color:black;" align="center" width="60"|Developer
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
AZ 351B diluted 1:5 in water
 
(NaOH and sodium borate salt)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
Submersion
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black" align="center"|
22°C
|-
|style="background:LightGrey; color:black"|Agitation
|style="background:WhiteSmoke; color:black" align="center"|
Circulation and mechanical
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center"|
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 150 mm wafers
|-
* 200 mm wafers (may require tool change)
| style="background:LightGrey; color:black"|Allowed materials
|
|style="background:WhiteSmoke; color:black" align="center"|
Silicon, glass, and polymer substrates
 
Film or pattern of all types
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
1-25
|-
|}
 
<br clear="all" />
 
==SU8-Developer==
[[Image:SU-8developer.jpg|300×300px|right|thumb|The SU8-Developer bench is located in C-1]]
 
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#SU8-Developer click here]'''
 
The SU8-Developer bench is a manually operated chemical bench for submersion development of SU-8 photoresist in PGMEA (supplied in the cleanroom as mr-Dev 600). After development, the substrates are rinsed with IPA and dried in the bench.
 
'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=154 LabManager]'''
 
=== Equipment performance and process related parameters ===
 
{| border="2" cellspacing="0" cellpadding="2"
 
 
!style="background:silver; color:black;" align="center" width="60"|Purpose
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Development of
*SU-8
|-
!style="background:silver; color:black;" align="center" width="60"|Developer
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
mr-Dev 600
 
(PGMEA)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
Submersion
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black" align="center"|
Room temperature
|-
|style="background:LightGrey; color:black"|Agitation
|style="background:WhiteSmoke; color:black" align="center"|
Magnetic stirrer
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center"|
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers (may require tool change)
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
! scope=row style="text-align: left;" | Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
| All cleanroom approved materials
Silicon and glass substrates
|
 
*Silicon and glass substrates
Film or pattern of all but Type IV
*Film or pattern of all but Type IV
| All cleanroom approved materials
|
*All cleanroom approved materials
*Film or pattern of all types
|
*Silicon and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|
*Silicon, III-V, and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|-
|-
|style="background:LightGrey; color:black"|Batch
! scope=row style="text-align: left;" | Batch size
|style="background:WhiteSmoke; color:black" align="center"|
| 1 - 5
1-8
| 1 - 6
|-  
| 1
| 1
| 1 - 25
| 1 - 25
|}
|}
<br clear="all" />
<br clear="all" />


==Developer-TMAH==
<!--
[[Image:KSspinner.JPG|300×300px|right|thumb|Developer-TMAH is located in C-1]]
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: SU8 (Wet Bench)|Developer: SU8 (Wet bench)]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: E-beam 02|Developer: E-beam 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual 02|Developer: TMAH Manual 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
-->
<!--
{{:Specific Process Knowledge/Lithography/Development/beaker_developer}}


'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer-TMAH click here]'''
{{:Specific Process Knowledge/Lithography/Development/SU8_developer}}


Developer-TMAH is a manually operated, single substrate spray-puddle developer. It uses the TMAH based AZ 726 MIF developer (2.38 % TMAH in  water with a small amount of wetting agent).
{{:Specific Process Knowledge/Lithography/Development/manualEbeam_developer}}


'''The user manual, user APV, and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=324 LabManager]'''
{{:Specific Process Knowledge/Lithography/Development/manualTMAH_developer}}


=== Equipment performance and process related parameters ===
{{:Specific Process Knowledge/Lithography/Development/UV_developer}}


{| border="2" cellspacing="0" cellpadding="2"
{{:Specific Process Knowledge/Lithography/Development/DUV_developer}}
-->


=Decommisioned tools=
<span style="color:red">Developer 1 & 2 were decommissioned 2017-01.</span>


!style="background:silver; color:black;" align="center" width="60"|Purpose
[[Specific Process Knowledge/Lithography/Development/1and2_developer|Information about decommissioned tool can be found here.]]
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Development of
*AZ nLOF
*AZ MiR 701
*AZ 5214E
*AZ 4562
|-
!style="background:silver; color:black;" align="center" width="60"|Developer
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
AZ 726 MIF


(2.38% TMAH in water)
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Method
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" align="center"|
Puddle
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Temperature
|style="background:WhiteSmoke; color:black" align="center"|
Room temperature
|-
|style="background:LightGrey; color:black"|Agitation
|style="background:WhiteSmoke; color:black" align="center"|
none
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black"|Substrate size
|style="background:WhiteSmoke; color:black" align="center"|
* 100 mm wafers
* 150 mm wafers
|-
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
Silicon, glass, and polymer substrates


Film or pattern of all types
<span style="color:red">Developer 6 inch was decommissioned 2019-12.</span>
|-
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
1
|-  
|}


<br clear="all" />
[[Specific Process Knowledge/Lithography/Development/6inch_developer|Information about decommissioned tool can be found here.]]
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/Development"