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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/... click here]'''
{{cc-nanolab}}
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== Name of equipment ==
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Development click here]'''


Write a short description of the equipment(s).
[[Category: Equipment|Lithography development]]
[[Category: Lithography|Development]]


'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''
__TOC__
<!-- remember to remove the type of documents that are not present -->


[[image:Cluster1.jpg|200x200px|right|thumb|Image(s) of the equipment(s)]]
=Development Comparison Table=
{| class="wikitable"
|-
!
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
! [[Specific_Process_Knowledge/Lithography/Development/SU8_developer|Developer: SU8 (Wet bench)]]
! [[Specific_Process_Knowledge/Lithography/Development/manualEbeam_developer|Developer: E-beam 02]]
! [[Specific_Process_Knowledge/Lithography/Development/manualTMAH_developer|Developer: TMAH Manual 02]]
! [[Specific_Process_Knowledge/Lithography/Development/UV_developer|Developer: TMAH UV-lithography]]
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer|Developer: TMAH Stepper]]
|-
! scope=row style="text-align: left;" |  Purpose
|
Fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools


<!-- give the link to the equipment info page in LabManager: -->
<span style="color:red">Requires individual risk assessment for TMAH development!</span>
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=316 LabManager]
|
 
Development of:
== Process information ==
*SU-8
 
|
Link to process pages - e.g. one page for each material
Development of:
 
*ZEP 520A
Example:
*AR-P 6200.xx (CSAR)
*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2|Etch of silicon using RIE]]
|
*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|Etch of silicon oxide using RIE]]
Development of:
*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of silicon nitride using RIE]]
*AZ nLOF
*[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE|Etch of photo resist using RIE]]
*AZ MiR 701
 
*AZ 5214E
==Equipment performance and process related parameters==
*AZ 4562
 
*DUV resists
{| border="2" cellspacing="0" cellpadding="2"
|  
 
Development of:
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
*AZ nLOF
|style="background:WhiteSmoke; color:black"|<b>Equipment 1</b>
*AZ MiR 701
|style="background:WhiteSmoke; color:black"|<b>Equipment 2</b>
*AZ 5214E
*AZ 4562
*DUV resists
Post-exposure baking
|
Development of:
*DUV resists
Post-exposure baking
|-
! scope=row style="text-align: left;" | Developer
| Process dependent
| mr-Dev 600 (PGMEA)
|  
*ZED N-50
*AR 600-50
| AZ 726 MIF (2.38% TMAH in water)
| AZ 726 MIF (2.38% TMAH in water)
| AZ 726 MIF (2.38% TMAH in water)
|-
! scope=row style="text-align: left;" | Method
| Submersion
| Submersion
| Puddle
| Puddle
| Puddle
| Puddle
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose
! scope=row style="text-align: left;" | Handling
|style="background:LightGrey; color:black"|  
|
|style="background:WhiteSmoke; color:black"|
Manual handling in beakers
*Purpose 1
*Chip bucket
*Purpose 2
*Single wafer carrier
|style="background:WhiteSmoke; color:black"|
*Carrier for up to 5 wafers
*Purpose 1
|
*Purpose 2
*Chip bucket
*Purpose 3
*Single wafer carrier
*Carrier for up to 6 wafers
|
*Vacuum-free edge-grip chucks for 50 mm, 100 mm & 150 mm, and 200 mm substrates
*Chip chuck for chips & 50 mm substrates
|
*Vacuum-free edge-grip chuck for 100 mm & 150 mm substrates
*Chip chuck for chips & 50 mm substrates
| Vacuum chuck
| Vacuum chuck
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
! scope=row style="text-align: left;" | Process temperature
|style="background:LightGrey; color:black"|Response 1
| Room temperature
|style="background:WhiteSmoke; color:black"|
| Room temperature
*Performance range 1
| Room temperature
*Performance range 2
| Room temperature
|style="background:WhiteSmoke; color:black"|
| Room temperature
*Performance range 1
| Room temperature
*Performance range 2
*Performance range 3
|-
|-
|style="background:LightGrey; color:black"|Response 2
! scope=row style="text-align: left;" | Process agitation
|style="background:WhiteSmoke; color:black"|
| No agitation allowed
*Performance range
| Magnetic stirrer
|style="background:WhiteSmoke; color:black"|
| Rotation
*Performance range
| Rotation
| Rotation
| Rotation
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
! scope=row style="text-align: left;" | Process rinse
|style="background:LightGrey; color:black"|Parameter 1
| Process dependent
|style="background:WhiteSmoke; color:black"|
| IPA
*Range
| IPA
|style="background:WhiteSmoke; color:black"|
| DI water
*Range
| DI water
| DI water
|-
|-
|style="background:LightGrey; color:black"|Parameter 2
! scope=row style="text-align: left;" | Substrate size
|style="background:WhiteSmoke; color:black"|
|
*Range
* Chips
|style="background:WhiteSmoke; color:black"|
* 50 mm wafers
*Range
* 100 mm wafers
* 150 mm wafers
|
* Chips
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers
|
* Chips (5mm to 2")
* 50 mm wafers
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers
|
* Chips (5mm to 50 mm)
* 100 mm wafers
* 150 mm wafers
|
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers (may require tool change)
|
* 100 mm wafers
* 150 mm wafers
* 200 mm wafers (may require tool change)
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
! scope=row style="text-align: left;" | Allowed materials
|style="background:LightGrey; color:black"|Batch size
| All cleanroom approved materials
|style="background:WhiteSmoke; color:black"|
|
*<nowiki>#</nowiki> small samples
*Silicon and glass substrates
*<nowiki>#</nowiki> 50 mm wafers
*Film or pattern of all but Type IV
*<nowiki>#</nowiki> 100 mm wafers
| All cleanroom approved materials
*<nowiki>#</nowiki> 150 mm wafers
|
|style="background:WhiteSmoke; color:black"|
*All cleanroom approved materials
*<nowiki>#</nowiki> small samples
*Film or pattern of all types
*<nowiki>#</nowiki> 50 mm wafers
|
*<nowiki>#</nowiki> 100 mm wafers
*Silicon and glass substrates
*<nowiki>#</nowiki> 150 mm wafers
*Films, or patterned films, of any material except type IV (Pb, Te)
|
*Silicon, III-V, and glass substrates
*Films, or patterned films, of any material except type IV (Pb, Te)
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
! scope=row style="text-align: left;" | Batch size
|style="background:WhiteSmoke; color:black"|
| 1 - 5
*Allowed material 1  
| 1 - 6
*Allowed material 2
| 1
|style="background:WhiteSmoke; color:black"|
| 1
*Allowed material 1  
| 1 - 25
*Allowed material 2
| 1 - 25
*Allowed material 3
|-  
|}
|}
<br clear="all" />
<!--
! [[Specific Process Knowledge/Lithography/Development/beaker_developer|Manual beaker development]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: SU8 (Wet Bench)|Developer: SU8 (Wet bench)]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer: E-beam 02|Developer: E-beam 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual 02|Developer: TMAH Manual 02]]
! [[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]
! [[Specific_Process_Knowledge/Lithography/Development/DUV_developer#Developer:_TMAH_Stepper|Developer: TMAH Stepper]]
-->
<!--
{{:Specific Process Knowledge/Lithography/Development/beaker_developer}}
{{:Specific Process Knowledge/Lithography/Development/SU8_developer}}
{{:Specific Process Knowledge/Lithography/Development/manualEbeam_developer}}
{{:Specific Process Knowledge/Lithography/Development/manualTMAH_developer}}
{{:Specific Process Knowledge/Lithography/Development/UV_developer}}
{{:Specific Process Knowledge/Lithography/Development/DUV_developer}}
-->
=Decommisioned tools=
<span style="color:red">Developer 1 & 2 were decommissioned 2017-01.</span>
[[Specific Process Knowledge/Lithography/Development/1and2_developer|Information about decommissioned tool can be found here.]]
<span style="color:red">Developer 6 inch was decommissioned 2019-12.</span>
[[Specific Process Knowledge/Lithography/Development/6inch_developer|Information about decommissioned tool can be found here.]]
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Lithography/Development"