Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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[[Category: Equipment |Etch DRIE]] | [[Category: Equipment |Etch DRIE]] | ||
[[Category: Etch (Dry) Equipment|DRIE]] | [[Category: Etch (Dry) Equipment|DRIE]] | ||
= The DRIE Pegasus tools at DTU Nanolab = | = The DRIE Pegasus tools at DTU Nanolab = | ||
{{Template:Author-jmli1}} | {{Template:Author-jmli1}} | ||
<!--Checked for updates on 2/02-2023 - ok/jmli --> | <!--Checked for updates on 2/02-2023 - ok/jmli --> | ||
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In 2010 DTU Nanolab acquired DRIE-Pegasus 1 | In 2010 DTU Nanolab acquired DRIE-Pegasus 1. As a state-of-the-art etch tool with excellent performance and great flexibility, it grew immensely popular and by 2015 it was apparent that we needed yet another tool to cope with the demand. Therefore, in 2016 Pegasus 2 was acquired from a closed-down lab and installed next to Pegasus 1. | ||
Looking to expand our dry etching capabilities in 2017 we got an irresistible offer on a twin Pegasus system with cassette to cassette vacuum robot from a | Looking to expand our dry etching capabilities in 2017 we got an irresistible offer on a twin Pegasus system with cassette to cassette vacuum robot from a commercial fab. The twin Pegasus system (called Pegasus 3 and 4) is installed at the old cluster 2 location in cleanroom C1 and will run only 6" wafers. Pegasus 3 is the 6" silicon etch work horse and Pegasus 4 is converted (adding extra process gases) into a 6" dielectric etch tool that will supplement/replace the AOE. | ||
This page was originally intended as a regular one-machine page (the Pegasus 1 page). However, as of 2018 with several tools, the page will serve as common page for all of our Pegasi with subpages for each tool. | This page was originally intended as a regular one-machine page (the Pegasus 1 page). However, as of 2018 with several tools, the page will serve as common page for all of our Pegasi with subpages for each tool. | ||
{| | {| | ||
| [[ | |width="100"| [[file:DRIE-Pegasus.jpg |100px|frameless]] | ||
| [[ | | width="200"| [[file:Pegasus 2 operator.jpg |204px|frameless]] | ||
| [[ | | width="275"|[[file:Peg3and4 front 2.JPG |292px|frameless]] | ||
|- | |- | ||
| align="center" | DRIE-Pegasus 1 | | align="center" | The DRIE-Pegasus 1 load lock and cassette loader in the DTU Nanolab cleanroom A-1. {{photo1}} | ||
| align="center" | DRIE-Pegasus 2 | | align="center" | The DRIE-Pegasus 2 operator station and load lock in the DTU Nanolab cleanroom A-1. {{photo1}} | ||
| align="center" | DRIE | | align="center" | The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations. {{photo1}} | ||
|- | |- | ||
|} | |} | ||
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* Ar: 0 to 283 sccm | * Ar: 0 to 283 sccm | ||
|style="background:lightgrey; color:black"| | |style="background:lightgrey; color:black"| | ||
* SF<sub>6</sub>: 0 to 1200 sccm | * SF<sub>6</sub>-1: 0 to 1200 sccm | ||
* SF<sub>6</sub>-2: 0 to 100 sccm | |||
* O<sub>2</sub>: 0 to 50 sccm | |||
* N<sub>2</sub>: 0 to 500 sccm | |||
* Ar: 0 to 283 sccm | |||
* He: 0 to 11 sccm | |||
|style="background:lightgrey; color:black"| | |||
* SF<sub>6</sub>-1: 0 to 1200 sccm | |||
* SF<sub>6</sub>-2: 0 to 100 sccm | |||
* O<sub>2</sub>: 0 to 200 sccm | * O<sub>2</sub>: 0 to 200 sccm | ||
* C<sub>4</sub>F<sub>8</sub>: 0 to 400 sccm | * C<sub>4</sub>F<sub>8</sub>: 0 to 400 sccm | ||
* Ar: 0 to 283 sccm | * Ar: 0 to 283 sccm | ||
|style="background:lightgrey; color:black"| | |style="background:lightgrey; color:black"| | ||
{| | {| | ||
*SF<sub>6</sub>: | *SF<sub>6</sub>: ?(<20) sccm | ||
*O<sub>2</sub>: 200 sccm | *O<sub>2</sub>: 200 sccm | ||
*C<sub>4</sub>F<sub>8</sub>: 400 sccm | *C<sub>4</sub>F<sub>8</sub>: 400 sccm | ||
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== Process information == | == Process information == | ||
=== | ===Process notation=== | ||
Describing a process recipe on the Pegasus may sometimes be difficult because of the great flexibility of the instrument. A compact and precise notation is therefore required for the recipes. Click [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Notation|'''HERE''']] to find a short description. | |||
===Hardware changes=== | ===Hardware changes=== | ||
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|- valign="top" | |- valign="top" | ||
! style="background:Whitesmoke; color:black" | Serial | ! style="background:Whitesmoke; color:black" | Serial | ||
| style="background:WhiteSmoke; color:black" | MP0636 | |||
| style="background:WhiteSmoke; color:black"| MP0641 | | style="background:WhiteSmoke; color:black"| MP0641 | ||
| style="background:WhiteSmoke; color:black"| CP0170 | | style="background:WhiteSmoke; color:black"| CP0170 | ||
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The trenches in deep silicon trenches can be characterized in many ways. Being able to compare processes requires that a set of common measurements and calculations must be established. Click '''HERE''' to find more information about the parameters used on the DRIE-Pegasus process developme[[Specific Process Knowledge/Etch/DRIE-Pegasus/TrenchCharacterisation|nt]]. | The trenches in deep silicon trenches can be characterized in many ways. Being able to compare processes requires that a set of common measurements and calculations must be established. Click '''HERE''' to find more information about the parameters used on the DRIE-Pegasus process developme[[Specific Process Knowledge/Etch/DRIE-Pegasus/TrenchCharacterisation|nt]]. | ||