Specific Process Knowledge/Back-end processing/FlexScribe: Difference between revisions
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The Cleaver: FlexScribe is a scriber designed for cleaving/scribing large wafers into smaller pieces from the frontside. Hence it will leave particles on the frontside of the sample. It works by running a "pizza wheel" over the sample and then breaking it in two by using a pair of pliers. | The Cleaver: FlexScribe is a scriber designed for cleaving/scribing large wafers into smaller pieces from the frontside. Hence it will leave particles on the frontside of the sample. It works by running a "pizza wheel" over the sample and then breaking it in two by using a pair of pliers. | ||
The equipment is placed in the left drawer underneath | The equipment is placed in the left drawer underneath fume hood 5: Special purposes. When operated the the Cleaver: Flex Scribe should always be placed inside Fume hood 5. | ||
[[File:flexscribe.JPG|400px]] | [[File:flexscribe.JPG|400px]] | ||
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The Cleaver: FlexScribe
The Cleaver: FlexScribe is a scriber designed for cleaving/scribing large wafers into smaller pieces from the frontside. Hence it will leave particles on the frontside of the sample. It works by running a "pizza wheel" over the sample and then breaking it in two by using a pair of pliers.
The equipment is placed in the left drawer underneath fume hood 5: Special purposes. When operated the the Cleaver: Flex Scribe should always be placed inside Fume hood 5.
Approved Materials:
- Si
- Quartz
- Pyrex (Borofloat 33)
- GaAs
- InP
- Sapphire
The Flex Scribe can cleave samples from 150mm down to ~10mm, please contact wetchemistry group for more information
DTU-Nanolab has 3 different types of Cleavers see the Labadviser pages for the FlipScribe and the LatticeAxe for more information.