Specific Process Knowledge/Lithography/Baking: Difference between revisions

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VisualWikitext

@@ Line 1: / Line 1: @@
-{{:Specific Process Knowledge/Lithography/authors_generic}}
+{{cc-nanolab}}
 '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Baking click here]'''
@@ Line 10: / Line 10: @@
 =Comparing baking methods=
-{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
+{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"
 |-
@@ Line 17: / Line 17: @@
 !
 ![[Specific_Process_Knowledge/Lithography/Baking#Small benchtop hotplates|Spray coater hotplate]]
-![[Specific_Process_Knowledge/Lithography/Baking#Hotplate_1_.28SU8.29.2C_Hotplate_2_.28SU8.29.2C_Hoplate_3.28SU8.29_and_Hotplate_4.28SU8.29|SU8 hotplates 1, 2 and 3]]
+![[Specific_Process_Knowledge/Lithography/Baking#SU-8 hotplates| SU-8 hotplates<br>(1 & 2 + 3 & 4)]]
 ![[Specific Process Knowledge/Lithography/Baking#Small_benchtop_hotplates|Small benchtop hotplates]]
 ![[Specific Process Knowledge/Lithography/Baking#Gamma_hotplates|Gamma hotplates]]
 ![[Specific_Process_Knowledge/Lithography/Baking#Oven: 110C - 250C|Oven: 110C - 250C]]
-![[Specific Process Knowledge/Lithography/Pretreatment#Oven 250C|Oven 250C]]
+![[Specific Process Knowledge/Lithography/Baking#Oven_250C|Oven 250C]]
 |-
@@ Line 71: / Line 71: @@
 Temperature with top-plate: Actual surface temperature = 0.9 * display value
 |
-Maximum 110°C
+Maximum 180°C
 |
 Hotplate: 90-110C:<br />
@@ Line 138: / Line 138: @@
 (All substrates and film or pattern of all types, unless otherwise noted on the hotplate)
 |
-Silicon and glass substrates
+Tool dependent. Typically Silicon, III-V, and glass substrates.
 |
 Silicon, glass, and high Tg polymer substrates
@@ Line 146: / Line 146: @@
 Silicon, glass, and high Tg polymer substrates
-Film or pattern of all types except resist|
+Film or pattern of all types except resist
 |-
@@ Line 159: / Line 159: @@
 Hotplate dependent. Any restrictions will be noted on the hotplate.
 |
+Low Tg polymer, copper, steel substrates.
+Pb, Te films.
 |III-V, low Tg polymer, copper, steel substrates
 |III-V, low Tg polymer, copper, steel substrates
@@ Line 168: / Line 171: @@
 |-style="background:WhiteSmoke; color:black"
 |- valign="top"
-!QC
+!QC<br>'''- requires login'''
 |
 https://labmanager.dtu.dk/view_binary.php?type=data&mach=293
@@ Line 176: / Line 179: @@
 Hotplate 2:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=124
-Hotplate 3:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=453
 |
@@ Line 209: / Line 211: @@
 = Hotplates =
-'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Baking#Hotplates click here]'''
 ==Hotplate: 90-110C==
@@ Line 215: / Line 216: @@
 Hotplate: 90-110C is used for baking of 2" - 6" wafers. Do not exceed 120°C.
-'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=336 Hotplate: 90-110C]'''
+The user manual, and contact information can be found in LabManager:
+[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=336 Hotplate: 90-110C] - '''requires login'''
 <br clear="all" />
-==Hotplate 1 (SU8), Hotplate 2 (SU8) and Hotplate 3(SU8)==
+==SU-8 hotplates==
-[[Image:SU-8hotplates.jpg|300x300px|thumb|Hotplate 1 (SU8) and Hotplate 2 (SU8) situated in C-1]]
+[[Image:SU-8hotplates.jpg|300x300px|thumb|Hotplate 1 (SU8) and Hotplate 2 (SU8) (the old set-up in C-1)]]
-We have three dedicated SU-8 hotplates in C-1 and E-4.
+We have four hotplates dedicated to baking of SU-8.
+<br>Hotplate 1 (SU8) and Hotplate 2 (SU8) are located in cleanroom E-4.
+<br>Hotplate 3 (SU8) and Hotplate 4 (SU8) are located in PolyFabLab in building 347.
 Users can control the ramp-time, the baking temperature, and the baking time.
-In order to avoid thermal curing of SU-8 residues on the hotplates, they are temperature limited to 180°C.
+<br>The hotplates are temperature limited to 180°C.
-'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=122 Hotplate 1 (SU8)] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=124 Hotplate 2 (SU8)] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=453 Hotplate 3 (SU8)]'''
+The user manual, and contact information can be found in LabManager:
+[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=122 Hotplate 1 (SU8)] - '''requires login'''
+[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=124 Hotplate 2 (SU8)] - '''requires login'''
+[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=453 Hotplate 3 (SU8)] - '''requires login'''
+[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=454 Hotplate 4 (SU8)] - '''requires login'''
 <br clear="all" />
@@ Line 238: / Line 253: @@
 '''Actual surface temperature = 0.9 * display value'''
-<div align="left">
+<div align="right">
 <gallery widths="320px" heights="240px">
-File:Benchtop C1.jpg|Benchtop hotplate for Spray coater located in C-1
+File:Benchtop C1.jpg|Benchtop hotplate for Spray coater located in Cx1
 File:Labspin_2.JPG|Benchtop hotplates for Labspins in E-5
 </gallery>
@@ Line 252: / Line 267: @@
 '''Information about the Süss MicroTec Gamma tools can be found in labadviser:'''
+*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV Spin Coater: Gamma UV]
+*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV Spin Coater: Gamma e-beam & UV]
+*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography Developer TMAH UV-lithography]
 *[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography#S.C3.9CSS_Spinner-Stepper Spin Coater: Süss Stepper]
 *[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer_TMAH_Stepper Developer: TMAH Stepper]
-*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography Developer TMAH UV-lithography]
-*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV Spin Coater: Gamma UV]
-*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV Spin Coater: Gamma e-beam & UV]
 <br clear="all" />
 = Ovens =
-'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Baking#Ovens click here]'''
 ==Oven: 110C - 250C==
@@ Line 269: / Line 283: @@
 The set-point can be varied, but should always be returned to 110°C after use.
-'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=119 Oven: 110C - 250C]'''
+The user manual, and contact information can be found in LabManager:
+[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=119 Oven: 110C - 250C] - '''requires login'''
 <br clear="all" />
-==Oven 250C for pretreatment==
+{{:Specific Process Knowledge/Lithography/Pretreatment/Oven_250C}}
-[[Image:Oven_250_degrees_for_pretreatment_cr3.jpg|300x300px|thumb|Oven 250C for pretreatment situated in C-1]]
-See [[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|'''Oven 250C''']]
-<br clear="all" />