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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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'''Feedback to this page''': '''[mailto:photolith@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Baking click here]'''
{{cc-nanolab}}
 
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Baking click here]'''
 
[[Category: Equipment|baking]]
[[Category: Lithography|Baking]]
 
__TOC__


=Comparing baking methods=
=Comparing baking methods=


{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"  
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|-style="background:silver; color:black"
|-style="background:silver; color:black"
!
!
![[Specific_Process_Knowledge/Lithography/Baking#Hotplate:_90-110C|Hotplate: 90-110C]]
![[Specific_Process_Knowledge/Lithography/Baking#Small benchtop hotplates|Spray coater hotplate]]
![[Specific_Process_Knowledge/Lithography/Baking#Hotplate_1_.28SU8.29.2C_Hotplate_2_.28SU8.29.2C_Hoplate_3.28SU8.29_and_Hotplate_4.28SU8.29|Hotplate 1, 2, 3 and 4 (SU8)]]
![[Specific_Process_Knowledge/Lithography/Baking#SU-8 hotplates| SU-8 hotplates<br>(1 & 2 + 3 & 4)]]
![[Specific Process Knowledge/Lithography/Baking#Small_benchtop_hotplates|Small benchtop hotplates]]
![[Specific Process Knowledge/Lithography/Baking#Small_benchtop_hotplates|Small benchtop hotplates]]
![[Specific Process Knowledge/Lithography/Baking#Gamma_hotplates|Gamma hotplates]]
![[Specific Process Knowledge/Lithography/Baking#Gamma_hotplates|Gamma hotplates]]
![[Specific_Process_Knowledge/Lithography/Baking#Oven 90C|Oven 90C]]
![[Specific_Process_Knowledge/Lithography/Baking#Oven: 110C - 250C|Oven: 110C - 250C]]
![[Specific_Process_Knowledge/Lithography/Baking#Oven: 110C - 250C|Oven: 110C - 250C]]
![[Specific Process Knowledge/Lithography/Pretreatment#Oven 250C|Oven 250C]]
![[Specific Process Knowledge/Lithography/Baking#Oven_250C|Oven 250C]]
|-
|-


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!Purpose
!Purpose
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Programmable, contact bake
Adjustable temperature, contact bake
*Soft bake
*Soft bake
*PEB
*PEB
*Hard bake
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Programmable, ramped contact bake
Programmable, ramped contact bake
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*PEB of SU-8
*PEB of SU-8
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Hotplate: 90-110C:<br />
Programmable, contact bake
*Soft bake
*PEB
Labspin hotplates:<br />
Adjustable temperature, contact bake
Adjustable temperature, contact bake
*Soft bake
*Soft bake
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*PEB
*PEB
*Hard bake
*Hard bake
|
Manual convection bake
*Soft bake
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|
Manual convection bake
Manual convection bake
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!Temperature
!Temperature
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Maximum 120°C
Maximum 180°C


Return to 90°C after use
Temperature with top-plate: Actual surface temperature = 0.9 * display value
|
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Maximum 110°C
Maximum 180°C
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Maximum temperature is hotplate dependent
Hotplate: 90-110C:<br />
|
*Maximum 120°C
Fixed at various recipe dependent temperatures.
*Return to 90°C after use
 
 
Labspin hotplates:<br />
*Maximum temperature is hotplate dependent
*Temperature with top-plate: Actual surface temperature = 0.9 * display value
|
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Fixed at 90°C
Fixed at various recipe dependent temperatures
|
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110 - 250°C
110 - 250°C
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!Substrate size
!Substrate size
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* Pieces
* 50 mm wafer
* 50 mm wafer
* 100 mm wafer
* 100 mm wafer
* 150 mm wafer
* 150 mm wafer
* 200 mm wafer
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* pieces
* pieces
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* 200 mm wafer
* 200 mm wafer
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* pieces
* pieces (only Labspin hotplates)
* 50 mm wafers
* 50 mm wafers
* 100 mm wafers
* 100 mm wafers
* 150 mm wafer
* 150 mm wafer
* 200 mm wafer
* 200 mm wafer
|
* 100 mm wafers
* 150 mm wafers
|
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* 100 mm wafers
* 100 mm wafers
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(All substrates and film or pattern of all types, unless otherwise noted on the hotplate)
(All substrates and film or pattern of all types, unless otherwise noted on the hotplate)
|
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Silicon and glass substrates
Tool dependent. Typically Silicon, III-V, and glass substrates.
|
Silicon, glass, and polymer substrates
 
Film or pattern of all types
|
|
Silicon, glass, and high Tg polymer substrates
Silicon, glass, and high Tg polymer substrates
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Silicon, glass, and high Tg polymer substrates
Silicon, glass, and high Tg polymer substrates


Film or pattern of all types except resist|
Film or pattern of all types except resist
|-
|-


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Hotplate dependent. Any restrictions will be noted on the hotplate.
Hotplate dependent. Any restrictions will be noted on the hotplate.
|
|
Low Tg polymer, copper, steel substrates.


|III-V, copper, steel substrates
Pb, Te films.
|III-V, low Tg polymer, copper, steel substrates
|III-V, low Tg polymer, copper, steel substrates
|III-V, low Tg polymer, copper, steel substrates
|III-V, low Tg polymer, copper, steel substrates
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|-style="background:WhiteSmoke; color:black"  
|-style="background:WhiteSmoke; color:black"  
|- valign="top"
|- valign="top"
!QC
!QC<br>'''- requires login'''
|
|
https://labmanager.dtu.dk/view_binary.php?type=data&mach=336
https://labmanager.dtu.dk/view_binary.php?type=data&mach=293


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Hotplate 2:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=124  
Hotplate 2:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=124  


Hotplate 3:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=453
|
Hotplate: 90-110C:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=336


Hotplate 4:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=454
Spin coater: Labspin 02:<br />https://labmanager.dtu.dk/view_binary.php?type=data&mach=362


|
Spin coater: Labspin 03:<br />https://labmanager.dtu.dk/view_binary.php?type=data&mach=387


|
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Spincoater: Gamma UV:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=417
Spincoater: Gamma ebeam & UV:<br /> http://labmanager.dtu.dk/view_binary.php?fileId=4431


Developer: TMAH UV-lithography:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=417
Spincoater: Gamma UV:<br /> http://labmanager.dtu.dk/view_binary.php?fileId=4432


Spincoater: Süss stepper:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=417
Developer: TMAH UV-lithography:<br /> http://labmanager.dtu.dk/view_binary.php?fileId=4434


Developer: Stepper:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=417
Spincoater: Süss stepper:<br /> http://labmanager.dtu.dk/view_binary.php?fileId=4433


Developer: Stepper:<br /> http://labmanager.dtu.dk/view_binary.php?fileId=4435


|


|
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= Hotplates =
= Hotplates =
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Baking#Hotplates click here]'''


==Hotplate: 90-110C==   
==Hotplate: 90-110C==   
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Hotplate: 90-110C is used for baking of 2" - 6" wafers. Do not exceed 120°C.
Hotplate: 90-110C is used for baking of 2" - 6" wafers. Do not exceed 120°C.


'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=336 Hotplate: 90-110C]'''
 
The user manual, and contact information can be found in LabManager:
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=336 Hotplate: 90-110C] - '''requires login'''


<br clear="all" />
<br clear="all" />


==Hotplate 1 (SU8), Hotplate 2 (SU8), Hoplate 3(SU8) and Hotplate 4(SU8)==
==SU-8 hotplates==
[[Image:SU-8hotplates.jpg|300x300px|thumb|Hotplate 1 (SU8) and Hotplate 2 (SU8) situated in C-1]]
[[Image:SU-8hotplates.jpg|300x300px|thumb|Hotplate 1 (SU8) and Hotplate 2 (SU8) (the old set-up in C-1)]]
We have four dedicated SU-8 hotplates in C-1.
We have four hotplates dedicated to baking of SU-8.
<br>Hotplate 1 (SU8) and Hotplate 2 (SU8) are located in cleanroom E-4.
<br>Hotplate 3 (SU8) and Hotplate 4 (SU8) are located in PolyFabLab in building 347.


Users can control the ramp-time, the baking temperature, and the baking time.
Users can control the ramp-time, the baking temperature, and the baking time.
In order to avoid thermal curing of SU-8 residues on the hotplates, they are temperature limited to 110°C.
<br>The hotplates are temperature limited to 180°C.
 
 
The user manual, and contact information can be found in LabManager:
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=122 Hotplate 1 (SU8)] - '''requires login'''
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=124 Hotplate 2 (SU8)] - '''requires login'''
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=453 Hotplate 3 (SU8)] - '''requires login'''


'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=122 Hotplate 1 (SU8)] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=124 Hotplate 2 (SU8)] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=543 Hotplate 3 (SU8)] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=454 Hotplate 4 (SU8)]'''
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=454 Hotplate 4 (SU8)] - '''requires login'''
<br clear="all" />
<br clear="all" />


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'''Actual surface temperature = 0.9 * display value'''
'''Actual surface temperature = 0.9 * display value'''


<div align="left">
<div align="right">
<gallery widths="320px" heights="240px">
<gallery widths="320px" heights="240px">
File:Benchtop C1.jpg|Benchtop hotplate located in C-1
File:Benchtop C1.jpg|Benchtop hotplate for Spray coater located in Cx1
File:Labspin_2.JPG|Benchtop hotplates next to spin coater in E-5
File:Labspin_2.JPG|Benchtop hotplates for Labspins in E-5
</gallery>
</gallery>
</div>
</div>
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==Gamma hotplates==   
==Gamma hotplates==   
[[Image:HMDS gammaUV.jpg|300x300px|thumb|Hotplate modules in Gamma UV spincoater.]]
[[Image:HMDS gammaUV.jpg|300x300px|thumb|Hotplate modules in Spin Coater: Gamma UV.]]
Hotplate temperatures are recipe dependent.
Hotplate temperatures are recipe dependent.


'''Information about the Süss MicroTec Gamma tools can be found in labadviser:'''  
'''Information about the Süss MicroTec Gamma tools can be found in labadviser:'''  
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV Spin Coater: Gamma UV]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV Spin Coater: Gamma e-beam & UV]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography Developer TMAH UV-lithography]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography#S.C3.9CSS_Spinner-Stepper Spin Coater: Süss Stepper]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography#S.C3.9CSS_Spinner-Stepper Spin Coater: Süss Stepper]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer_TMAH_Stepper Developer: TMAH Stepper]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer_TMAH_Stepper Developer: TMAH Stepper]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography Developer TMAH UV-lithography]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV Spin Coater: Gamma UV]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV Spin Coater: Gamma e-beam & UV]


<br clear="all" />
<br clear="all" />


= Ovens =
= Ovens =
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Baking#Ovens click here]'''
==Oven 90C==
[[Image:Oven_90_degrees_cr3.jpg|300x300px|thumb|Oven 90C situated in C-1]]
The oven is mostly used for baking of several wafers at a time at 90 °C as a soft baking step after a spin coating of photoresist. For 1.5µm resist the baking time is 30 min. For most of the other resist thicknesses it is also 30 min.
'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=118 Oven 90C]'''
<br clear="all" />


==Oven: 110C - 250C==
==Oven: 110C - 250C==
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The set-point can be varied, but should always be returned to 110°C after use.
The set-point can be varied, but should always be returned to 110°C after use.


'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=119 Oven: 110C - 250C]'''
 
The user manual, and contact information can be found in LabManager:
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=119 Oven: 110C - 250C] - '''requires login'''
<br clear="all" />
<br clear="all" />


==Oven 250C for pretreatment==
{{:Specific Process Knowledge/Lithography/Pretreatment/Oven_250C}}
[[Image:Oven_250_degrees_for_pretreatment_cr3.jpg|300x300px|thumb|Oven 250C for pretreatment situated in C-1]]
See [[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|'''Oven 250C''']]
<br clear="all" />
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