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'''Feedback to this page''': '''[mailto:photolith@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Baking click here]'''
{{cc-nanolab}}
 
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Baking click here]'''
 
[[Category: Equipment|baking]]
[[Category: Lithography|Baking]]
 
__TOC__


=Comparing baking methods=
=Comparing baking methods=


{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"  
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|-style="background:silver; color:black"
|-style="background:silver; color:black"
!
!
![[Specific_Process_Knowledge/Lithography/Baking#Hotplate:_90-110C|Hotplate: 90-110C]]
![[Specific_Process_Knowledge/Lithography/Baking#Small benchtop hotplates|Spray coater hotplate]]
![[Specific_Process_Knowledge/Lithography/Baking#Hotplate 1 (SU8) and Hotplate 2 (SU8)|Hotplate 1 and 2 (SU8)]]
![[Specific_Process_Knowledge/Lithography/Baking#SU-8 hotplates| SU-8 hotplates<br>(1 & 2 + 3 & 4)]]
![[Specific Process Knowledge/Lithography/Baking#Small_benchtop_hotplates|Small benchtop hotplates]]
![[Specific Process Knowledge/Lithography/Baking#Small_benchtop_hotplates|Small benchtop hotplates]]
![[Specific Process Knowledge/Lithography/Baking#Gamma_hotplates|Gamma hotplates]]
![[Specific Process Knowledge/Lithography/Baking#Gamma_hotplates|Gamma hotplates]]
![[Specific_Process_Knowledge/Lithography/Baking#Oven 90C|Oven 90C]]
![[Specific_Process_Knowledge/Lithography/Baking#Oven: 110C - 250C|Oven: 110C - 250C]]
![[Specific_Process_Knowledge/Lithography/Baking#Oven: 110C - 250C|Oven: 110C - 250C]]
![[Specific Process Knowledge/Lithography/Pretreatment#Oven 250C|Oven 250C]]
![[Specific Process Knowledge/Lithography/Baking#Oven_250C|Oven 250C]]
|-
|-


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!Purpose
!Purpose
|
|
Programmable contact bake
Adjustable temperature, contact bake
*Soft bake
*Soft bake
*PEB
*PEB
*Hard bake
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Programmable, ramped contact bake
Programmable, ramped contact bake
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*PEB of SU-8
*PEB of SU-8
|
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Coming soon.
Hotplate: 90-110C:<br />
|
Programmable, contact bake
Coming soon.
*Soft bake
*PEB
 
 
Labspin hotplates:<br />
Adjustable temperature, contact bake
*Soft bake
*PEB
*Hard bake
|
|
Manual convection bake
Recipe dependent temperature, contact or proximity bake
*Soft bake
*Soft bake
*PEB
*Hard bake
|
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Manual convection bake
Manual convection bake
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Manual convection bake
Manual convection bake
*Dehydration
*Dehydration
*'''NO resist!'''
|-
|-


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!Temperature
!Temperature
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Maximum 120°C
Maximum 180°C
|
 
Maximum 110°C
Temperature with top-plate: Actual surface temperature = 0.9 * display value
|
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Maximum 180°C
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Hotplate: 90-110C:<br />
*Maximum 120°C
*Return to 90°C after use
Labspin hotplates:<br />
*Maximum temperature is hotplate dependent
*Temperature with top-plate: Actual surface temperature = 0.9 * display value
|
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Fixed at 90°C
Fixed at various recipe dependent temperatures
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110 - 250°C
110 - 250°C
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!Substrate size
!Substrate size
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* Pieces
* 50 mm wafer
* 50 mm wafer
* 100 mm wafer
* 100 mm wafer
* 150 mm wafer
* 150 mm wafer
* 200 mm wafer
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* pieces
* pieces
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* 200 mm wafer
* 200 mm wafer
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* pieces (only Labspin hotplates)
* 50 mm wafers
* 100 mm wafers
* 150 mm wafer
* 200 mm wafer
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* 100 mm wafers
* 100 mm wafers
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Film or pattern of all types except type IV
Film or pattern of all types except type IV
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Hotplate dependent.
(All substrates and film or pattern of all types, unless otherwise noted on the hotplate)
|
|
|
Tool dependent. Typically Silicon, III-V, and glass substrates.
Silicon, glass, and polymer substrates
 
Film or pattern of all types
|
|
Silicon, glass, and high Tg polymer substrates
Silicon, glass, and high Tg polymer substrates
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Silicon, glass, and high Tg polymer substrates
Silicon, glass, and high Tg polymer substrates


Film or pattern of all types except resist|
Film or pattern of all types except resist
|-
|-


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Pb, Te films
Pb, Te films
|
|
Hotplate dependent. Any restrictions will be noted on the hotplate.
|
|
Low Tg polymer, copper, steel substrates.


|III-V, copper, steel substrates
Pb, Te films.
|III-V, low Tg polymer, copper, steel substrates
|III-V, low Tg polymer, copper, steel substrates
|III-V, low Tg polymer, copper, steel substrates
|III-V, low Tg polymer, copper, steel substrates
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|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!QC
|- valign="top"
!QC<br>'''- requires login'''
|
|
Comming soon.
https://labmanager.dtu.dk/view_binary.php?type=data&mach=293
 
|
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Comming soon.
Hotplate 1:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=122
 
Hotplate 2:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=124
 
|
|
Comming soon.
Hotplate: 90-110C:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=336
 
Spin coater: Labspin 02:<br />https://labmanager.dtu.dk/view_binary.php?type=data&mach=362
 
Spin coater: Labspin 03:<br />https://labmanager.dtu.dk/view_binary.php?type=data&mach=387
 
|
|
Comming soon.
Spincoater: Gamma ebeam & UV:<br />  http://labmanager.dtu.dk/view_binary.php?fileId=4431
 
Spincoater: Gamma UV:<br />  http://labmanager.dtu.dk/view_binary.php?fileId=4432
 
Developer: TMAH UV-lithography:<br /> http://labmanager.dtu.dk/view_binary.php?fileId=4434
 
Spincoater: Süss stepper:<br /> http://labmanager.dtu.dk/view_binary.php?fileId=4433
 
Developer: Stepper:<br /> http://labmanager.dtu.dk/view_binary.php?fileId=4435
 
 
|
|
Comming soon.
 
|
|
Comming soon.
 
|
Comming soon.
|-
|-
|}
|}
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= Hotplates =
= Hotplates =
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Baking#Hotplates click here]'''


==Hotplate: 90-110C==   
==Hotplate: 90-110C==   
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Hotplate: 90-110C is used for baking of 2" - 6" wafers. Do not exceed 120°C.
Hotplate: 90-110C is used for baking of 2" - 6" wafers. Do not exceed 120°C.


'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=336 Hotplate: 90-110C]'''
 
The user manual, and contact information can be found in LabManager:
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=336 Hotplate: 90-110C] - '''requires login'''


<br clear="all" />
<br clear="all" />


==Hotplate 1 (SU8) and Hotplate 2 (SU8)==
==SU-8 hotplates==
[[Image:SU-8hotplates.jpg|300x300px|thumb|Hotplate 1 (SU8) and Hotplate 2 (SU8) situated in C-1]]
[[Image:SU-8hotplates.jpg|300x300px|thumb|Hotplate 1 (SU8) and Hotplate 2 (SU8) (the old set-up in C-1)]]
We have two dedicated SU-8 hotplates in C-1.
We have four hotplates dedicated to baking of SU-8.
<br>Hotplate 1 (SU8) and Hotplate 2 (SU8) are located in cleanroom E-4.
<br>Hotplate 3 (SU8) and Hotplate 4 (SU8) are located in PolyFabLab in building 347.


Users can control the ramp-time, the baking temperature, and the baking time.
Users can control the ramp-time, the baking temperature, and the baking time.
In order to avoid thermal curing of SU-8 residues on the hotplates, they are temperature limited to 110°C.
<br>The hotplates are temperature limited to 180°C.
 
 
The user manual, and contact information can be found in LabManager:
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=122 Hotplate 1 (SU8)] - '''requires login'''
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=124 Hotplate 2 (SU8)] - '''requires login'''
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=453 Hotplate 3 (SU8)] - '''requires login'''


'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=122 Hotplate 1 (SU8)] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=124 Hotplate 2 (SU8)]'''
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=454 Hotplate 4 (SU8)] - '''requires login'''
<br clear="all" />
<br clear="all" />


==Small benchtop hotplates==   
==Small benchtop hotplates==   
Model: Präzitherm PZ 28-2.
Model: Präzitherm PZ 28-2.
Contact bake only. Do not exceed xxx°C.  
 
Contact bake only. Maximum temperature is hotplate dependent.
 
Most of these hotplates have been fitted with a top-plate in order to protect the original hotplate surface. With the top-plate, the set point of the controller must be adjusted in order to achieve the correct temperature during the bake:
 
'''Actual surface temperature = 0.9 * display value'''


<div align="right">
<div align="right">
<gallery widths="100px" heights="100px">
<gallery widths="320px" heights="240px">
File:Benchtop A5 1.jpg|Benchtop hotplate located in A-5
File:Benchtop C1.jpg|Benchtop hotplate for Spray coater located in Cx1
File:Benchtop A5 2.jpg|Benchtop hotplates located in A-5
File:Labspin_2.JPG|Benchtop hotplates for Labspins in E-5
File:Benchtop C1.jpg|Benchtop hotplate located in C-1
File:Benchtop E5.jpg|Benchtop hotplate located in E-5
</gallery>
</gallery>
</div>
</div>
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==Gamma hotplates==   
==Gamma hotplates==   
[[Image:HMDS gammaUV.jpg|300x300px|thumb|Hotplate modules in Gamma UV spincoater.]]
[[Image:HMDS gammaUV.jpg|300x300px|thumb|Hotplate modules in Spin Coater: Gamma UV.]]
Hotplate temperatures are recipe dependent.


'''Information about the spincoater can be found in labadviser: [http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV Spin Coater: Gamma UV] or labmanager: [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=258 Spin Coater: Gamma UV]'''
'''Information about the Süss MicroTec Gamma tools can be found in labadviser:'''
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV Spin Coater: Gamma UV]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV Spin Coater: Gamma e-beam & UV]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography Developer TMAH UV-lithography]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography#S.C3.9CSS_Spinner-Stepper Spin Coater: Süss Stepper]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer_TMAH_Stepper Developer: TMAH Stepper]


<br clear="all" />
<br clear="all" />


= Ovens =
= Ovens =
'''Feedback to this section''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Baking#Ovens click here]'''
==Oven 90C==
[[Image:Oven_90_degrees_cr3.jpg|300x300px|thumb|Oven 90C situated in C-1]]
The oven is mostly used for baking of several wafers at a time at 90 °C as a soft baking step after a spin coating of photoresist. For 1.5µm resist the baking time is 30 min. For most of the other resist thicknesses it is also 30 min.
'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=118 Oven 90C]'''
<br clear="all" />


==Oven: 110C - 250C==
==Oven: 110C - 250C==
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The set-point can be varied, but should always be returned to 110°C after use.
The set-point can be varied, but should always be returned to 110°C after use.


'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=119 Oven: 110C - 250C]'''
 
The user manual, and contact information can be found in LabManager:
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=119 Oven: 110C - 250C] - '''requires login'''
<br clear="all" />
<br clear="all" />


==Oven 250C for pretreatment==
{{:Specific Process Knowledge/Lithography/Pretreatment/Oven_250C}}
[[Image:Oven_250_degrees_for_pretreatment_cr3.jpg|300x300px|thumb|Oven 250C for pretreatment situated in C-1]]
See [[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|'''Oven 250C''']]
<br clear="all" />
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