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'''Feedback to this page''': '''[mailto:photolith@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Baking click here]'''
{{cc-nanolab}}
 
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Baking click here]'''
 
[[Category: Equipment|baking]]
[[Category: Lithography|Baking]]
 
__TOC__


=Comparing baking methods=
=Comparing baking methods=


{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"  
|-
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|-style="background:silver; color:black"
|-style="background:silver; color:black"
!
!
![[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
![[Specific_Process_Knowledge/Lithography/Baking#Small benchtop hotplates|Spray coater hotplate]]
![[Specific Process Knowledge/Lithography/Pretreatment#Buffered HF-Clean|Buffered HF-Clean]]
![[Specific_Process_Knowledge/Lithography/Baking#SU-8 hotplates| SU-8 hotplates<br>(1 & 2 + 3 & 4)]]
![[Specific Process Knowledge/Lithography/Pretreatment#Oven 250C|Oven 250C]]
![[Specific Process Knowledge/Lithography/Baking#Small_benchtop_hotplates|Small benchtop hotplates]]
![[Specific Process Knowledge/Lithography/Baking#Gamma_hotplates|Gamma hotplates]]
![[Specific_Process_Knowledge/Lithography/Baking#Oven: 110C - 250C|Oven: 110C - 250C]]
![[Specific Process Knowledge/Lithography/Baking#Oven_250C|Oven 250C]]
|-
|-


|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!Purpose
|
|
Vapor priming
Adjustable temperature, contact bake
*Soft bake
*PEB
*Hard bake
|
|
Native oxide strip
Programmable, ramped contact bake
*Soft bake of SU-8
*PEB of SU-8
|
|
Dehydration
Hotplate: 90-110C:<br />
Programmable, contact bake
*Soft bake
*PEB
 
 
Labspin hotplates:<br />
Adjustable temperature, contact bake
*Soft bake
*PEB
*Hard bake
|
Recipe dependent temperature, contact or proximity bake
*Soft bake
*PEB
*Hard bake
|
Manual convection bake
*Hard bake
*Post-exposure bake
|
Manual convection bake
*Dehydration
*'''NO resist!'''
|-
|-


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!Temperature
!Temperature
|
|
hexamethyldisilazane (HMDS)
Maximum 180°C
 
Temperature with top-plate: Actual surface temperature = 0.9 * display value
|
Maximum 180°C
|
Hotplate: 90-110C:<br />
*Maximum 120°C
*Return to 90°C after use
 
 
Labspin hotplates:<br />
*Maximum temperature is hotplate dependent
*Temperature with top-plate: Actual surface temperature = 0.9 * display value
|
Fixed at various recipe dependent temperatures
|
|
12%HF with Ammoniumflouride
110 - 250°C
 
Return to 110°C after use
|
|
none
Fixed at 250°C
|-
|-


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!Substrate size
!Substrate size
|
|
* Pieces
* 50 mm wafer
* 100 mm wafer
* 150 mm wafer
* 200 mm wafer
|
* pieces
* 50 mm wafers
* 50 mm wafers
* 100 mm wafers
* 150 mm wafer
* 200 mm wafer
|
* pieces (only Labspin hotplates)
* 50 mm wafers
* 100 mm wafers
* 150 mm wafer
* 200 mm wafer
|
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 150 mm wafers
|
|
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
|
|
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers  
* 150 mm wafers
|-
|-


|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Allowed materials
!Allowed materials
|
All substrates
Film or pattern of all types
|
|
Silicon, glass, and polymer substrates
Silicon, glass, and polymer substrates
Film or pattern of all types except type IV
|
Hotplate dependent.
(All substrates and film or pattern of all types, unless otherwise noted on the hotplate)
|
Tool dependent. Typically Silicon, III-V, and glass substrates.
|
Silicon, glass, and high Tg polymer substrates


Film or pattern of all types
Film or pattern of all types
|
|
*Silicon
Silicon, glass, and high Tg polymer substrates
*Poly Silicon
 
*Silicon Oxide
Film or pattern of all types except resist
*Silicon Nitride
|-
*Silicon Oxynitride
 
*Photoresist
 
*Blue film
|-style="background:WhiteSmoke; color:black"
!Restrictions <br> (Not allowed)
|
|III-V, copper, steel substrates
 
Pb, Te films
|
Hotplate dependent. Any restrictions will be noted on the hotplate.
|
|
*Silicon
Low Tg polymer, copper, steel substrates.
*Silicon Oxide
 
*Silicon Nitride
Pb, Te films.
*Glass
|III-V, low Tg polymer, copper, steel substrates
|III-V, low Tg polymer, copper, steel substrates
 
Resist is not allowed
|-
|-
|-style="background:WhiteSmoke; color:black"
 
!Restrictions
 
|Type IV and resist/polymer on polymer substrate
|-style="background:WhiteSmoke; color:black"
|Wafers with metal is not allowed
|- valign="top"
|Resist is not allowed
!QC<br>'''- requires login'''
|
https://labmanager.dtu.dk/view_binary.php?type=data&mach=293
 
|
Hotplate 1:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=122
 
Hotplate 2:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=124
 
|
Hotplate: 90-110C:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=336
 
Spin coater: Labspin 02:<br />https://labmanager.dtu.dk/view_binary.php?type=data&mach=362
 
Spin coater: Labspin 03:<br />https://labmanager.dtu.dk/view_binary.php?type=data&mach=387
 
|
Spincoater: Gamma ebeam & UV:<br />  http://labmanager.dtu.dk/view_binary.php?fileId=4431
 
Spincoater: Gamma UV:<br />  http://labmanager.dtu.dk/view_binary.php?fileId=4432
 
Developer: TMAH UV-lithography:<br /> http://labmanager.dtu.dk/view_binary.php?fileId=4434
 
Spincoater: Süss stepper:<br /> http://labmanager.dtu.dk/view_binary.php?fileId=4433
 
Developer: Stepper:<br /> http://labmanager.dtu.dk/view_binary.php?fileId=4435
 
 
|
 
|
 
|-
|-
|}
|}


<br clear="all" />
<br clear="all" />
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= Hotplates =
= Hotplates =


==Fumehood hotplate==   
==Hotplate: 90-110C==   
[[Image:Hotplates.jpg|300x300px|thumb|Right: Hotplate 90 °C situated in C-1]]
[[Image:Hotplate90-110C in C-1.jpg|300x300px|thumb|Hotplate: 90-110C located in C-1]]
Variable temperature hotplate mostly used for baking of single wafers as a soft baking step after a spin coating of photoresist.
Hotplate: 90-110C is used for baking of 2" - 6" wafers. Do not exceed 120°C.
<br clear="all" />
 


==Hotplate: 90-110C== 
The user manual, and contact information can be found in LabManager:
[[Image:Hotplates.jpg|300x300px|thumb|Location of Hotplate: 90-110C in C-1]]
Hotplate: 90-110C is used for baking of 2" - 6" wafers.


'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=336 Hotplate: 90-110C]'''
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=336 Hotplate: 90-110C] - '''requires login'''


<br clear="all" />
<br clear="all" />


==SU8 hotplates==
==SU-8 hotplates==
[[Image:SU-8hotplates.jpg|300x300px|thumb|Hotplate 1 (SU8) and Hotplate 2 (SU8) situated in C-1]]
[[Image:SU-8hotplates.jpg|300x300px|thumb|Hotplate 1 (SU8) and Hotplate 2 (SU8) (the old set-up in C-1)]]
We have two dedicated SU-8 hotplates in C-1.
We have four hotplates dedicated to baking of SU-8.
<br>Hotplate 1 (SU8) and Hotplate 2 (SU8) are located in cleanroom E-4.
<br>Hotplate 3 (SU8) and Hotplate 4 (SU8) are located in PolyFabLab in building 347.


Users can control the ramp-time, the baking temperature, and the baking time.
Users can control the ramp-time, the baking temperature, and the baking time.
<br>The hotplates are temperature limited to 180°C.


'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=122 Hotplate 1 (SU8)] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=124 Hotplate 2 (SU8)]'''
 
The user manual, and contact information can be found in LabManager:  
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=122 Hotplate 1 (SU8)] - '''requires login'''
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=124 Hotplate 2 (SU8)] - '''requires login'''
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=453 Hotplate 3 (SU8)] - '''requires login'''
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=454 Hotplate 4 (SU8)] - '''requires login'''
<br clear="all" />
<br clear="all" />


= Ovens =
==Small benchtop hotplates== 
Model: Präzitherm PZ 28-2.
 
Contact bake only. Maximum temperature is hotplate dependent.
 
Most of these hotplates have been fitted with a top-plate in order to protect the original hotplate surface. With the top-plate, the set point of the controller must be adjusted in order to achieve the correct temperature during the bake:
 
'''Actual surface temperature = 0.9 * display value'''


==Oven 90C==
<div align="right">
[[Image:Oven_90_degrees_cr3.jpg|300x300px|thumb|Oven 90 °C: positioned in C-1]]
<gallery widths="320px" heights="240px">
The oven is mostly used for baking of several wafers at a time at 90 °C as a soft baking step after a spin coating of photoresist. For 1.5µm resist the baking time is 30 min. For most of the other resist thicknesses it is also 30 min.
File:Benchtop C1.jpg|Benchtop hotplate for Spray coater located in Cx1
File:Labspin_2.JPG|Benchtop hotplates for Labspins in E-5
</gallery>
</div>


'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=118 Oven 90C]'''
<br clear="all" />
<br clear="all" />


==Gamma hotplates== 
[[Image:HMDS gammaUV.jpg|300x300px|thumb|Hotplate modules in Spin Coater: Gamma UV.]]
Hotplate temperatures are recipe dependent.
'''Information about the Süss MicroTec Gamma tools can be found in labadviser:'''
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV Spin Coater: Gamma UV]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV Spin Coater: Gamma e-beam & UV]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography Developer TMAH UV-lithography]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography#S.C3.9CSS_Spinner-Stepper Spin Coater: Süss Stepper]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer_TMAH_Stepper Developer: TMAH Stepper]


==Oven 250C for pretreatment==
[[Image:Oven_250_degrees_for_pretreatment_cr3.jpg|300x300px|thumb|Oven 250C for pretreatment: positioned in C-1]]
[[Specific_Process_Knowledge/Lithography/Pretreatment#Oven_250C|Oven 250C]]
<br clear="all" />
<br clear="all" />


==Oven: 120C - 250C==
= Ovens =
'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=169 Oven: 120C - 250C]'''
 
==Oven: 110C - 250C==
[[Image:Oven120C-250C in C-1.jpg|300x300px|thumb|Oven: 110C - 250C situated in C-1]]
Variable temperature convection oven mostly used for baking of wafers as a hard baking step after development of photoresist.
 
The set-point can be varied, but should always be returned to 110°C after use.
 
 
The user manual, and contact information can be found in LabManager:
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=119 Oven: 110C - 250C] - '''requires login'''
<br clear="all" />
<br clear="all" />
{{:Specific Process Knowledge/Lithography/Pretreatment/Oven_250C}}
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