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'''Feedback to this page''': '''[mailto:photolith@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Baking click here]'''
{{cc-nanolab}}
 
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography/Baking click here]'''
 
[[Category: Equipment|baking]]
[[Category: Lithography|Baking]]
 
__TOC__


=Comparing baking methods=
=Comparing baking methods=


{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"  
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|-


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|-style="background:silver; color:black"
|-style="background:silver; color:black"
!
!
![[Specific Process Knowledge/Lithography/Pretreatment#HMDS|HMDS]]
![[Specific_Process_Knowledge/Lithography/Baking#Small benchtop hotplates|Spray coater hotplate]]
![[Specific Process Knowledge/Lithography/Pretreatment#Buffered HF-Clean|Buffered HF-Clean]]
![[Specific_Process_Knowledge/Lithography/Baking#SU-8 hotplates| SU-8 hotplates<br>(1 & 2 + 3 & 4)]]
![[Specific Process Knowledge/Lithography/Pretreatment#Oven 250C|Oven 250C]]
![[Specific Process Knowledge/Lithography/Baking#Small_benchtop_hotplates|Small benchtop hotplates]]
![[Specific Process Knowledge/Lithography/Baking#Gamma_hotplates|Gamma hotplates]]
![[Specific_Process_Knowledge/Lithography/Baking#Oven: 110C - 250C|Oven: 110C - 250C]]
![[Specific Process Knowledge/Lithography/Baking#Oven_250C|Oven 250C]]
|-
|-


|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!Purpose
|
|
Vapor priming
Adjustable temperature, contact bake
*Soft bake
*PEB
*Hard bake
|
|
Native oxide strip
Programmable, ramped contact bake
*Soft bake of SU-8
*PEB of SU-8
|
|
Dehydration
Hotplate: 90-110C:<br />
Programmable, contact bake
*Soft bake
*PEB
 
 
Labspin hotplates:<br />
Adjustable temperature, contact bake
*Soft bake
*PEB
*Hard bake
|
Recipe dependent temperature, contact or proximity bake
*Soft bake
*PEB
*Hard bake
|
Manual convection bake
*Hard bake
*Post-exposure bake
|
Manual convection bake
*Dehydration
*'''NO resist!'''
|-
|-


|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Chemical
!Temperature
|
Maximum 180°C
 
Temperature with top-plate: Actual surface temperature = 0.9 * display value
|
Maximum 180°C
|
Hotplate: 90-110C:<br />
*Maximum 120°C
*Return to 90°C after use
 
 
Labspin hotplates:<br />
*Maximum temperature is hotplate dependent
*Temperature with top-plate: Actual surface temperature = 0.9 * display value
|
|
hexamethyldisilazane (HMDS)
Fixed at various recipe dependent temperatures
|
|
12%HF with Ammoniumflouride
110 - 250°C
 
Return to 110°C after use
|
|
none
Fixed at 250°C
|-
|-


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!Substrate size
!Substrate size
|
|
* Pieces
* 50 mm wafer
* 100 mm wafer
* 150 mm wafer
* 200 mm wafer
|
* pieces
* 50 mm wafers
* 50 mm wafers
* 100 mm wafers
* 150 mm wafer
* 200 mm wafer
|
* pieces (only Labspin hotplates)
* 50 mm wafers
* 100 mm wafers
* 150 mm wafer
* 200 mm wafer
|
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
* 150 mm wafers
|
|
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers
|
|
* 100 mm wafers
* 100 mm wafers
* 150 mm wafers  
* 150 mm wafers
|-
|-


|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Allowed materials
!Allowed materials
|
All substrates
Film or pattern of all types
|
|
Silicon, glass, and polymer substrates
Silicon, glass, and polymer substrates
Film or pattern of all types except type IV
|
Hotplate dependent.
(All substrates and film or pattern of all types, unless otherwise noted on the hotplate)
|
Tool dependent. Typically Silicon, III-V, and glass substrates.
|
Silicon, glass, and high Tg polymer substrates


Film or pattern of all types
Film or pattern of all types
|
|
*Silicon
Silicon, glass, and high Tg polymer substrates
*Poly Silicon
 
*Silicon Oxide
Film or pattern of all types except resist
*Silicon Nitride
|-
*Silicon Oxynitride
 
*Photoresist
 
*Blue film
|-style="background:WhiteSmoke; color:black"
!Restrictions <br> (Not allowed)
|
|III-V, copper, steel substrates
 
Pb, Te films
|
Hotplate dependent. Any restrictions will be noted on the hotplate.
|
|
*Silicon
Low Tg polymer, copper, steel substrates.
*Silicon Oxide
 
*Silicon Nitride
Pb, Te films.
*Glass
|III-V, low Tg polymer, copper, steel substrates
|III-V, low Tg polymer, copper, steel substrates
 
Resist is not allowed
|-
|-
|-style="background:WhiteSmoke; color:black"
 
!Restrictions
 
|Type IV and resist/polymer on polymer substrate
|-style="background:WhiteSmoke; color:black"
|Wafers with metal is not allowed
|- valign="top"
|Resist is not allowed
!QC<br>'''- requires login'''
|
https://labmanager.dtu.dk/view_binary.php?type=data&mach=293
 
|
Hotplate 1:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=122
 
Hotplate 2:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=124
 
|
Hotplate: 90-110C:<br /> https://labmanager.dtu.dk/view_binary.php?type=data&mach=336
 
Spin coater: Labspin 02:<br />https://labmanager.dtu.dk/view_binary.php?type=data&mach=362
 
Spin coater: Labspin 03:<br />https://labmanager.dtu.dk/view_binary.php?type=data&mach=387
 
|
Spincoater: Gamma ebeam & UV:<br />  http://labmanager.dtu.dk/view_binary.php?fileId=4431
 
Spincoater: Gamma UV:<br />  http://labmanager.dtu.dk/view_binary.php?fileId=4432
 
Developer: TMAH UV-lithography:<br /> http://labmanager.dtu.dk/view_binary.php?fileId=4434
 
Spincoater: Süss stepper:<br /> http://labmanager.dtu.dk/view_binary.php?fileId=4433
 
Developer: Stepper:<br /> http://labmanager.dtu.dk/view_binary.php?fileId=4435
 
 
|
 
|
 
|-
|-
|}
|}


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= Hotplates =
= Hotplates =


==90 C 4" hotplate==   
==Hotplate: 90-110C==   
[[Image:Hotplates.jpg|300x300px|thumb|Right: Hotplate 90 °C situated in C-1]]
[[Image:Hotplate90-110C in C-1.jpg|300x300px|thumb|Hotplate: 90-110C located in C-1]]
This hotplate is mostly used for baking of single wafers at 90 °C as a soft baking step after a spin coating of photoresist.
Hotplate: 90-110C is used for baking of 2" - 6" wafers. Do not exceed 120°C.
 
 
The user manual, and contact information can be found in LabManager:
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=336 Hotplate: 90-110C] - '''requires login'''
 
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<br clear="all" />


==110 C 4" hotplate==  
==SU-8 hotplates==
[[Image:Hotplates.jpg|300x300px|thumb|Left: Hotplate 110 °C situated in C-1]]
[[Image:SU-8hotplates.jpg|300x300px|thumb|Hotplate 1 (SU8) and Hotplate 2 (SU8) (the old set-up in C-1)]]
The 110 °C hotplate is used for 2 different things; hard bake of resist, and image reversal baking between two exposures. It is recommended to hard bake for 2 min. For image reversal it is recommended to bake at least 100 sec., some bake for 120 sec.
We have four hotplates dedicated to baking of SU-8.
<br>Hotplate 1 (SU8) and Hotplate 2 (SU8) are located in cleanroom E-4.
<br>Hotplate 3 (SU8) and Hotplate 4 (SU8) are located in PolyFabLab in building 347.
 
Users can control the ramp-time, the baking temperature, and the baking time.
<br>The hotplates are temperature limited to 180°C.
 
 
The user manual, and contact information can be found in LabManager:
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=122 Hotplate 1 (SU8)] - '''requires login'''
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=124 Hotplate 2 (SU8)] - '''requires login'''
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=453 Hotplate 3 (SU8)] - '''requires login'''
 
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=454 Hotplate 4 (SU8)] - '''requires login'''
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==Hotplate: 90-110C==   
==Small benchtop hotplates==   
[[Image:Hotplates.jpg|300x300px|thumb|Location of Hotplate: 90-110C in C-1]]
Model: Präzitherm PZ 28-2.
Hotplate: 90-110C is used for baking of 2" - 6" wafers.
 
Contact bake only. Maximum temperature is hotplate dependent.
 
Most of these hotplates have been fitted with a top-plate in order to protect the original hotplate surface. With the top-plate, the set point of the controller must be adjusted in order to achieve the correct temperature during the bake:
 
'''Actual surface temperature = 0.9 * display value'''


'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=336 Hotplate: 90-110C]'''
<div align="right">
<gallery widths="320px" heights="240px">
File:Benchtop C1.jpg|Benchtop hotplate for Spray coater located in Cx1
File:Labspin_2.JPG|Benchtop hotplates for Labspins in E-5
</gallery>
</div>


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<br clear="all" />


==SU8 hotplates==
==Gamma hotplates==
[[Image:SU-8hotplates.jpg|300x300px|thumb|Hotplate 1 (SU8) and Hotplate 2 (SU8) situated in C-1]]
[[Image:HMDS gammaUV.jpg|300x300px|thumb|Hotplate modules in Spin Coater: Gamma UV.]]
We have two dedicated SU-8 hotplates in C-1.
Hotplate temperatures are recipe dependent.


Users can control the ramp-time, the baking temperature, and the baking time.
'''Information about the Süss MicroTec Gamma tools can be found in labadviser:'''
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_UV Spin Coater: Gamma UV]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Coaters#Spin_Coater:_Gamma_E-beam_and_UV Spin Coater: Gamma e-beam & UV]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography Developer TMAH UV-lithography]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography#S.C3.9CSS_Spinner-Stepper Spin Coater: Süss Stepper]
*[http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer_TMAH_Stepper Developer: TMAH Stepper]


'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=122 Hotplate 1 (SU8)] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=124 Hotplate 2 (SU8)]'''
<br clear="all" />
<br clear="all" />


= Ovens =
= Ovens =


==90 C oven==
==Oven: 110C - 250C==
[[Image:Oven_90_degrees_cr3.jpg|300x300px|thumb|Oven 90 °C: positioned in C-1]]
[[Image:Oven120C-250C in C-1.jpg|300x300px|thumb|Oven: 110C - 250C situated in C-1]]
The oven is mostly used for baking of several wafers at a time at 90 °C as a soft baking step after a spin coating of photoresist. For 1.5µm resist the baking time is 30 min. For most of the other resist thicknesses it is also 30 min.
Variable temperature convection oven mostly used for baking of wafers as a hard baking step after development of photoresist.  


'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=118 Oven 90C]'''
The set-point can be varied, but should always be returned to 110°C after use.
<br clear="all" />


==120 C oven==
[[Image:Oven_120_degrees_cr3.jpg|300x300px|thumb|Oven 120 °C: positioned in C-1]]
120 °C oven is used to hard bake of resist on several wafers at time. It is recommended to hard bake for 30 min.
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==250 C oven for pretreatment==
The user manual, and contact information can be found in LabManager:
[[Image:Oven_250_degrees_for_pretreatment_cr3.jpg|300x300px|thumb|Oven 250C for pretreatment: positioned in C-1]]
[[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]


[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=119 Oven: 110C - 250C] - '''requires login'''
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==250 C oven for burning resist==
{{:Specific Process Knowledge/Lithography/Pretreatment/Oven_250C}}
[[Image:Oven_250_degrees_for_burning_resist_cr3.jpg|300x300px|thumb|Oven 250 °C for burning resist: positioned in C-1]]
This oven is used for "burning" the resist, therefore not considered clean.
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