Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope: Difference between revisions
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[[Category: Equipment |Etch DRIE]] | [[Category: Equipment |Etch DRIE]] | ||
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= Process optimization using the Picoscope = | = Process optimization using the Picoscope = | ||
Before going into details on why it makes sense to optimize the processes using the picoscope process monitoring, we need to have a look at how monitoring processes is usually done. | Before going into details on why it makes sense to optimize the processes using the picoscope process monitoring, we need to have a look at how monitoring processes is usually done. | ||
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=== Process D4 === | === Process D4 === | ||
After a few years in its original configuration, we decided to | After a few years in its original configuration, we decided to [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange|'''upgrade Pegasus 1''']] to improve the fast switching performance. As a result, the original recipe Process D was changed to Process D4 with faster cycles. The process parameters are listed in the table below. | ||
{| {{table}} | {| {{table}} | ||
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: https://doi.org/10.1016/j.mee.2018.01.034 | : https://doi.org/10.1016/j.mee.2018.01.034 | ||
; Bingdong Chang et al.: DREM2: | ; Bingdong Chang et al.: DREM2: A facile fabrication strategy for freestanding three dimensional silicon micro- and nanostructures by a modified Bosch etch process | ||
: 2018 J. Micromech. Microeng. 28 105012 | : 2018 J. Micromech. Microeng. 28 105012 | ||
: https://doi.org/10.1088/1361-6439/aad0c4 | : https://doi.org/10.1088/1361-6439/aad0c4 | ||