Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions

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 !style="background:silver; color:black;" align="left"|Purpose
 |style="background:LightGrey; color:black"|Deposition of various materials ||style="background:WhiteSmoke; color:black"|
-* Sputtering of metals including:
+* Metals including alloys and magnetic materials
-* alloys and magnetic metals
+* Dielectrica including silica and alumina.
-* semiconductors including silicon
+* Semiconductors including silicon
-* dielectrica including silica and alumina.
 * See tables above and ask staff if there is a material you would like to deposit which you do not see listed.
 |-
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 |-
 |}
+==Maximum Power Calculation==
+* <math>PD</math> - Power density (fundamental constant given by a supplier)
+* <math>P(W)</math> - Power (W) from power supply
+* <math>A(inch^2)</math> - Area of the target
+------------------------------------------------------------------------------------------------------------
+<math> PD=\frac{P(W)}{A(inch^2)}</math>   &#8658;    <math>P(W)=PD\cdot A(inch^2)=PD\cdot\frac{\pi d^2}{4}</math>
+<ul>
+<li><p> <b><span style="color: green">d=2" (2-inch target)</span></b> <math>P(W)=3.14\cdot PD</math>   </p></li>
+<li><p> <b><span style="color: green">d=3" (3-inch target)</span></b> <math>P(W)=7.065\cdot PD</math>   </p></li>
+<li><p> <b><span style="color: green">d=4" (4-inch target)</span></b> <math>P(W)=12.56\cdot PD</math>   </p></li>
+<li><p> <b><span style="color: green">d=6" (6-inch target)</span></b> <math>P(W)=28.26\cdot PD</math>   </p></li>
+</ul>
+--------------------------------------------------
+Value of the <math>PD</math> is material dependent and can be found on KJLC homepage