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{{cc-nanolab}}
'''Feedback to this page:  
'''Feedback to this page:  
[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-4 click here]'''
[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-4 click here]'''
[[Category: Equipment |Etch DRIE]]
[[Category: Equipment |Etch DRIE]]
[[Category: Etch (Dry) Equipment|DRIE]]
[[Category: Etch (Dry) Equipment|DRIE]]
<br>


==Pegasus 4 - 150mm silicon oxide and silicon nitride etching==
==Pegasus 4 - 150mm silicon oxide and silicon nitride etching==
[[Image:Peg3and4 front 2.JPG |frame|right|x250px|The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, {{photo1}}]]


'''The tool is already installed and ready to process. You still have to make manual alignment in the cassette.
DRIE-Pegasus 4 is dedicated Silicon oxide and Silicon nitride etching. It is originally designed for silicon etching but gas mass flow controllers has been changed to optimize silicon oxide and silicon nitride etching. The system is setup for 6" wafers. Sampler samples has to be bonded to a 6" carrier to be etched in the system.
'''
 
[[Image:Twinx.jpg |frame|left|x300px|The twin Pegasi (3 and 4) have just been rolled into the lab on July 3rd 2018. ]]
 


The user manual(s), quality control procedure(s) and results, user APV(s) '''are not available''', technical information and contact information can be found in LabManager:
'''The user manual and contact information can be found in LabManager:'''


Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=456| LabManager]
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=456 DRIE Pegasus 4 in LabManager - requires login]


== Process information ==
== Process information ==
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*[[/Barc Etch|Barc Etch]]
*[[/Barc Etch|Barc Etch]]
*[[/SiO2 Etch|SiO2 Etch]]
*[[/SiO2 Etch|SiO2 Etch]]
*[[/SiN Etch|Silicon Nitride Etch]]  
*[[/Silicon Nitride Etch|Silicon Nitride Etch]]
*[[/Nitride Etch|Nitride etch with SiO2 etch recipes]]
*[[/Slow etch|Slow etch of silicon nitride and silicon oxide]]


'''Hardware changes'''


A few hardware modifications have been made on the Pegasus 3/4 since it was installed in 2019. The changes are listed below.
*[[Specific Process Knowledge/Etch/DRIE-Pegasus 4/showerheadchange|Change of showerhead in 2019]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus 4/picoscope|Addition of Picoscope oscilloscope system for process monitoring in February 2019]]




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To find information on how to bond wafers or chips to a carrier wafer, click [[Specific Process Knowledge/Etch/DryEtchProcessing/Bonding| here]].
To find information on how to bond wafers or chips to a carrier wafer, click [[Specific Process Knowledge/Etch/DryEtchProcessing/Bonding| here]].
'''Internal Nanolab Process log for Pegasus 4'''
Process log at Nanolab [http://labintra.nanolab.dtu.dk/index.php/Main_Page/Process_Logs/bghe/Pegasus4]
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-4"