Specific Process Knowledge/Back-end processing: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]''' | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Back-end_processing click here]''' | ||
=Back-end processing= | |||
Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it. | Back-end (or Post-fab) Processing are typical processes used to finish up your wafer/chip. This includes thinning and cutting out the wafer in chips that can be put on a carrier, a board or in a package, attaching the chip to the carrier and connecting it with wires to get electrical access to it. | ||
These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346. | These processes are usually carried out a number of different places. We also have a laboratory called PackLab located in building 347 1st floor. It is a class 1000 cleanroom and in here we have equipment commonly used for back-end processing. Some equipment is further placed in the basement of building 346 and some on the 1st floor in building 346. | ||
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! '''Note! The SupportLab (former Packlab) has been established and tools are currently relocated.''' | |||
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Please note that the training on machines requires the "Introduction course for Nanolab facilities (not cleanroom)" with specialization to "Access to building 347". Please ask our staff for more information. | |||
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Below you can see a list of equipment for back-end processing that is available at DTU Nanolab. | Below you can see a list of equipment for back-end processing that is available at DTU Nanolab. | ||
== Choose an equipment == | == Choose an equipment == | ||
* Chip/die mounting | * Chip/die mounting | ||
**[[/Die Bonder|Die Bonder (eutectic metal)]] | **[[/Die Bonder|Die Bonder (eutectic metal)]] | ||
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*Wire bonding | *Wire bonding | ||
**[[/Wire Bonder|TPT Wire Bonder]] | **[[/Wire Bonder|TPT Wire Bonder]] | ||
**[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | **[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | ||
*Wafer | <br> | ||
*Wafer Dicing and Machining | |||
**[[/Polisher CMP|Polisher CMP - located in the cleanroom]] | **[[/Polisher CMP|Polisher CMP - located in the cleanroom]] | ||
**[[/Polishing machine|Polisher/Lapper machine]] | **[[/Polishing machine|Polisher/Lapper machine]] | ||
**[[/LatticeAxe|LatticeAxe]] | **[[/LatticeAxe|LatticeAxe]] | ||
**[[/FlipScribe|FlipScribe]] | **[[/FlipScribe|FlipScribe]] | ||
**[[/FlexScribe|FlexScribe]] | **[[/FlexScribe|FlexScribe]] | ||
** | **Wafer Scriber | ||
**[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]] | **[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]] | ||
**[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]] | **[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]] | ||
**[[/Disco Saw|Wafer cleaner DCS 1441 (post dicing)]] | **[[/Disco Saw|Wafer cleaner DCS 1441 (post dicing)]] | ||
**[[/Laser Micromachining Tool|Laser Micromachining Tool]] | **[[/Laser Micromachining Tool|Laser Micromachining Tool]] | ||
* | <br> | ||
**[[/ | *Pick & place | ||
**[[/Micro transfer printer|Micro transfer printer]] | |||
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* X-ray inspection system | * X-ray inspection system | ||
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{| {{table}} | {| {{table}} | ||
| align="left" valign="top" style="background:LightGray"|''' Lapping/polishing''' | | align="left" valign="top" style="background:LightGray"|''' Lapping/polishing''' | ||
| align="left" valign="top" style="background:LightGray"|''' Cutting''' | | align="left" valign="top" style="background:LightGray"|''' Cutting/cleaving''' | ||
| align="left" valign="top" style="background:#DCDCDC;"|''' Milling''' | | align="left" valign="top" style="background:#DCDCDC;"|''' Milling''' | ||
| align="left" valign="top" style="background:LightGray"|''' Die bonding''' | | align="left" valign="top" style="background:LightGray"|''' Die bonding''' | ||
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*[[/Polishing machine|Polisher/Lapper machine]] | *[[/Polishing machine|Polisher/Lapper machine]] | ||
|style="background: LightGray"| | |style="background: LightGray"| | ||
* | *Diamond Pen (Wafer Scriber) | ||
*[[/LatticeAxe|LatticeAxe]] | *[[/LatticeAxe|LatticeAxe]] | ||
*[[/FlipScribe|FlipScribe]] | *[[/FlipScribe|FlipScribe]] | ||
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|style="background: LightGray"| | |style="background: LightGray"| | ||
*[[/Die Bonder|Die Bonder (eutectic metal)]] | *[[/Die Bonder|Die Bonder (eutectic metal)]] | ||
*[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]] | <!-- *[[/Die Bonder#Flip-chip bonder (glue attachment)|Flip-chip Bonder (glue)]] --> | ||
|style="background: LightGray"| | |style="background: LightGray"| | ||
*[[/Wire Bonder|TPT Wire Bonder]] | *[[/Wire Bonder|TPT Wire Bonder]] | ||