Specific Process Knowledge/Lithography/LiftOff: Difference between revisions
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NMP (Remover 1165) | Lift-off bath with NMP (Remover 1165) | ||
Rinse bath with diluted IPA | |||
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User defined | User defined | ||
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*NMP (Remover 1165) | *NMP (Remover 1165) | ||
*Rinse in IPA | *Rinse in diluted IPA | ||
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!style="background:silver; color:black" valign="center" rowspan="2"|Process parameters | !style="background:silver; color:black" valign="center" rowspan="2"|Process parameters | ||
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==Poor metal adhesion/ Metal delaminating after lift-off== | ==Poor metal (TiPt) adhesion/ Metal delaminating after lift-off== | ||
''This experiment was done by Gustav E. Skands(ges@sbtinstruments.com) in May 2024'' | ''This experiment was done by Gustav E. Skands(ges@sbtinstruments.com) in May 2024'' | ||
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Process temperature considerations | Process temperature considerations | ||
The process incorporated a deposition temperature of 50°C, which was maintained without further comparative analysis against room temperature deposition due to the successful outcomes achieved and considerations of operational cost efficiency. | The process incorporated a deposition temperature of 50°C, which was maintained without further comparative analysis against room temperature deposition due to the successful outcomes achieved and considerations of operational cost efficiency. | ||
==Poor metal (TiAu) adhesion/ Metal delaminating after lift-off== | |||
''This experiment was done by Mathias Zambach (zambach@fysik.dtu.dk) in June 2024'' | |||
'''Problem:''' Mathias experienced the delamination of TiAu after the lift-off process, see the image. | |||
'''Solution:''' Adding a descum step (70 ml/min O2, 70 ml/min N2, 150W, 5 min (Plasma Asher 1)) right before metal depositions. | |||
[[File:Delamination of TiAu.jpg|thumb]] | |||
The process flow: | |||
1.) 2 um nLOF coating | |||
2.) Exposure | |||
3.) Development of nLOF | |||
'''4.) 5 min descum (70 ml/min O2, 70 ml/min N2, 150W, 5 min in Plasma Asher 1) was done right before TiAu deposition''' | |||
5.) 10 nm Ti depositing with 2 A/s by Temescal | |||
6.) 200 nm Au depositing with 2 A/s by Temescal | |||
7.) Lift-off (approx. 45 min) | |||
By adding step 4.) 5 min Descum, the problem with the delamination of metals was solved. | |||