Specific Process Knowledge/Lithography/LiftOff: Difference between revisions
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NMP (Remover 1165) | Lift-off bath with NMP (Remover 1165) | ||
Rinse bath with diluted IPA | |||
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User defined | User defined | ||
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*NMP (Remover 1165) | *NMP (Remover 1165) | ||
*Rinse in IPA | *Rinse in diluted IPA | ||
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!style="background:silver; color:black" valign="center" rowspan="2"|Process parameters | !style="background:silver; color:black" valign="center" rowspan="2"|Process parameters | ||
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==Poor metal adhesion/ Metal delaminating after lift-off== | ==Poor metal (TiPt) adhesion/ Metal delaminating after lift-off== | ||
''This experiment was done by Gustav E. Skands(ges@sbtinstruments.com)'' | |||
''This experiment was done by Gustav E. Skands(ges@sbtinstruments.com) in May 2024'' | |||
This entry details an observed issue with metal adhesion during a Ti/Pt deposition (10/160 nm) and lift-off process within DTU Nanolab. The employed photoresist was TI Spray from MicroChemicals, which is believed (but not confirmed) to share many properties with AZ5214E. The thickness of the resist was approximately 5 µm, and it was spray coated onto the substrate using the Spray Coater. | This entry details an observed issue with metal adhesion during a Ti/Pt deposition (10/160 nm) and lift-off process within DTU Nanolab. The employed photoresist was TI Spray from MicroChemicals, which is believed (but not confirmed) to share many properties with AZ5214E. The thickness of the resist was approximately 5 µm, and it was spray coated onto the substrate using the Spray Coater. | ||
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Process temperature considerations | Process temperature considerations | ||
The process incorporated a deposition temperature of 50°C, which was maintained without further comparative analysis against room temperature deposition due to the successful outcomes achieved and considerations of operational cost efficiency. | The process incorporated a deposition temperature of 50°C, which was maintained without further comparative analysis against room temperature deposition due to the successful outcomes achieved and considerations of operational cost efficiency. | ||
==Poor metal (TiAu) adhesion/ Metal delaminating after lift-off== | |||
''This experiment was done by Mathias Zambach (zambach@fysik.dtu.dk) in June 2024'' | |||
'''Problem:''' Mathias experienced the delamination of TiAu after the lift-off process, see the image. | |||
'''Solution:''' Adding a descum step (70 ml/min O2, 70 ml/min N2, 150W, 5 min (Plasma Asher 1)) right before metal depositions. | |||
[[File:Delamination of TiAu.jpg|thumb]] | |||
The process flow: | |||
1.) 2 um nLOF coating | |||
2.) Exposure | |||
3.) Development of nLOF | |||
'''4.) 5 min descum (70 ml/min O2, 70 ml/min N2, 150W, 5 min in Plasma Asher 1) was done right before TiAu deposition''' | |||
5.) 10 nm Ti depositing with 2 A/s by Temescal | |||
6.) 200 nm Au depositing with 2 A/s by Temescal | |||
7.) Lift-off (approx. 45 min) | |||
By adding step 4.) 5 min Descum, the problem with the delamination of metals was solved. | |||