Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions
| (3 intermediate revisions by 2 users not shown) | |||
| Line 5: | Line 5: | ||
== Studies of Cr deposition processes == | == Studies of Cr deposition processes == | ||
[[/ | [[/Roughness of Chromium|Roughness of Chromium]] - ''Roughness and Uniformity of Cr layers deposited with different methods and settings'' | ||
[[/Sputtering of Cr in Sputter System (Lesker)|Sputtering of Cr in Sputter system (Lesker)]] - ''Settings and deposition rates'' | [[/Sputtering of Cr in Sputter System (Lesker)|Sputtering of Cr in Sputter system (Lesker)]] - ''Settings and deposition rates'' | ||
| Line 104: | Line 104: | ||
|} | |} | ||
'''*''' ''For thicknesses above 300 nm, please request permission from metal@nanolab.dtu.dk to ensure there is enough material | '''*''' ''For thicknesses above 300 nm, please request permission from metal@nanolab.dtu.dk to ensure there is enough material and to prioritize chamber cleaning as Cr tends to be a high-stress layer and thus causes flaking,'' | ||