Specific Process Knowledge/Etch/RIE (Reactive Ion Etch): Difference between revisions
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[[Category: Equipment |Etch RIE]] | [[Category: Equipment |Etch RIE]] | ||
[[Category: Etch (Dry) Equipment |RIE]] | [[Category: Etch (Dry) Equipment |RIE]] | ||
<span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned. </span> | <span style="color:#FF0000"> Both RIE's (RIE1 and RIE2) for silicon based etching has been decommissioned. </span> | ||
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*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|Etch of silicon oxide using RIE]] | *[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|Etch of silicon oxide using RIE]] | ||
*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of silicon nitride using RIE]] | *[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of silicon nitride using RIE]] | ||
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