Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions
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<!-- give the link to the equipment info page in LabManager: --> | <!-- give the link to the equipment info page in LabManager: --> | ||
[http://labmanager | [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=167 Wordentec in LabManager] | ||
==Process information== | ==Process information== | ||
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[http://labadviser. | [http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Gold#Studies_of_Au_deposition_processes_in_the_Wordentec| Temperature and roughness studies of Au deposition processes in the Wordentec] | ||
E-beam evaporation of some materials like Au and Al can affect the underlying layers and thin resists such as E-beam sensitive resists can get exposed or their topography may change. Cases of releasing bubbles of the solvent will create a crater-like surface on some materials. In most cases this only affects the areas containing resist, hence liftoff is often easier and the areas without resist will have good adhesion. | E-beam evaporation of some materials like Au and Al can affect the underlying layers and thin resists such as E-beam sensitive resists can get exposed or their topography may change. Cases of releasing bubbles of the solvent will create a crater-like surface on some materials. In most cases this only affects the areas containing resist, hence liftoff is often easier and the areas without resist will have good adhesion. | ||
[[ | [[Media:WaferAfterWordentec.JPG|Delaminating Au film on thin E-beam resist]] | ||
===Thermal evaporation materials=== | ===Thermal evaporation materials=== | ||