Specific Process Knowledge/Back-end processing/Laser Micromachining Tool: Difference between revisions
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==Laser Micromachining Tool == | ==Laser Micromachining Tool == | ||
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The page will be updated very soon. | The page will be updated very soon. | ||
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager | '''The user manual(s), user APV(s), technical information and contact information can be found in [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=309 LabManager]'''. | ||
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* a 50W picosecond laser that can emit light at 3 wavelengths: 355nm, 532nm and 1064nm (Time-Bandwidth Products, Fuego/Duetto. See some details in this | It is equipped with 2 high power lasers: | ||
* a 50W picosecond laser that can emit light at 3 wavelengths: 355nm, 532nm and 1064nm (Time-Bandwidth Products, Fuego/Duetto. See some details in this [http://www.time-bandwidth.com/upload/press/weingartenlasertechnikjournalvol6issue3p51.pdf article]) with a pulse repetition rate from 200kHz up to 8000kHz. | |||
* a 100W nanosecond laser with a wavelength of 1064nm (IPG Laser YLP-HP series) with a pulse repetition rate of 100kHz (currently out of use). | * a 100W nanosecond laser with a wavelength of 1064nm (IPG Laser YLP-HP series) with a pulse repetition rate of 100kHz (currently out of use). | ||
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The laser can use Autocad DXF files for the pattern design. To create these files we recommend to use Clewin 5. See more info [[Specific_Process_Knowledge/Pattern_Design| here]]. | The laser can use Autocad DXF files for the pattern design. To create these files we recommend to use Clewin 5. See more info [[Specific_Process_Knowledge/Pattern_Design| here]]. | ||
==Process Examples== | |||
A process example for cutting silicon grooves can be found [[/Silicon cutting and milling| <b>here</b>]]. | |||
== Technical specifications == | == Technical specifications == | ||