Specific Process Knowledge/Thermal Process/BCB Curing Oven: Difference between revisions

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+'''Feedback to this page''': '''[mailto:thinfilm@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thermal_Process/BCB_Curing_Oven click here]'''
+''This page is written by DTU Nanolab  internal''
+[[Category: Equipment |Thermal BCB]]
+[[Category: Thermal process|BCB]]
 == BCB Curing Oven ==
+[[image:BCB oven.jpeg|350x350px|right|thumb|The BCB Curing Oven. Positioned in room Cx1/ Photo: DTU Nanolab internal]]
+The BCB Curing Oven is mainly used for curing of BCB (bisbenzocyclobutene, cyclotene&reg;) and for alloying of some metals in a nitrogen atmosphere.
+During processing the oven is rapidly heated by use of eight halogen lamps situated below the sample. The maximum allowed temperature is 450 <sup>o</sup>C.
-The BCB Curing Oven is mainly used for curing of BCB (bisbenzocyclobutene) and for alloying of metals in a nitrogen atmosphere.
+The oven is purged with a nitrogen flow (high or low flow). Samples are processed at atmospheric pressure or at vacuum.
-During processing the furnace is rapidly heated by use of five halogen lamps situated below the sample. The furnace is purged with a high or a low nitrogen flow. Samples are processed at atmospheric pressure or at vacuum.
 '''The user manual, user APV, technical information and contact information can be found in LabManager:'''
-[[image:BCB oven.jpeg|350x350px|right|thumb|The BCB Curing Oven. Located in the III-V Lab]]
 [http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=295 BCB Curing Oven]
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 == Process information ==
-There are no standard processes on the furnace.
+Here are some of the standard processes used in the BCB Curing Oven.
+=== BCB curing===
+An example of a curing recipe (BCB250BL.PDF) for a long curing process at 250°C is shown below.
+Content of BCB250BL.PDF:
+<pre>
+;
+; stored 31.08.2011  at 17:55:33
+{P0}
+,00:30,0020,- - - - 3 - - - -,075,250,001,005,028
+,00:10,0020,- - - 2 - - - - -
+,00:30,0020,- - - - 3 - - - -
+,00:10,0020,- - - 2 - - - - -
+,05:00,0050,H - - 2 - - - - -
+,05:00,0050,H C - 2 - - - - -
+,15:00,0100,H - 1 - - - - - -
+,45:00,0100,H C 1 - - - - - -
+,15:00,0150,H - 1 - - - - - -
+,81:00,0150,H C 1 - - - - - -
+,60:00,0250,H - 1 - - - - - -
+,60:00,0250,H C 1 - - - - - -
+,15:00,0020,- C 1 - - - - - -
+,30:00,0020,- C 1 - - - - - -
+,00:00,0010,- C - - - - - - -
+</pre>
+===General processes===
+There are a number of general processes on the oven named DxxxCyyy.PDF.
+The "Dxxx" in the recipe is the set temperature (in °C) and the "Cyyy" is the time (in minutes) at the set temperature.
+The oven heats to the set temperature (xxx) in 5 mins and then stays at the temperature (xxx) for a time (yyy), after which it cools to room temperature as fast as possible.
+The program sequence looks like this for the file D200C060.PDF:
+<pre>;
+; stored 31.08.2011  at 18:15:47
+{P0}
+,05:00,0200,H - - 2 - - - - -,075,250,001,005,028
+,60:00,0200,H C 1 - - - - - -
+,05:00,0002,- C 1 - - - - - -
+,00:00,0000,- C - - - - - - -
+</pre>
 ==Equipment performance and process related parameters==
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 |style="background:LightGrey; color:black"|Temperature
 |style="background:WhiteSmoke; color:black"|
-*0 - 450<sup>o</sup>C
+*Room temperature - 450<sup>o</sup>C
 |-
 |style="background:LightGrey; color:black"|Nitrogen flows
@@ Line 59: / Line 111: @@
 *Quartz
 *Resist (prebaked)
-*Metal (only Al, Ni, Ge and Au)
+*Metals on Material list 1, 2 and 3 (see the cross contamination information in LabManager)
 |-
 |}