Specific Process Knowledge/Etch/Aluminum Oxide/Al2O3 Etch with ICP Metal: Difference between revisions
Appearance
| (12 intermediate revisions by 3 users not shown) | |||
| Line 7: | Line 7: | ||
|-style="background:Black; color:White" | |-style="background:Black; color:White" | ||
! Parameter | ! Parameter | ||
|Recipe name: ''' | |Recipe name: '''Al2O3 Etch''' | ||
|- | |- | ||
|Coil Power [W] | |Coil Power [W] | ||
| Line 47: | Line 47: | ||
<br clear="all" /> | <br clear="all" /> | ||
==Al2O3 etching by sanvis@nanolab [[ | ==Al2O3 etching by Sanjeev Vishal Kota sanvis@nanolab== | ||
*[[Media:Alumina etch information.pptx|Presentation made by Sanvis @DTU Nanolab, click to view]] | |||
{| border="1" cellspacing="2" cellpadding="2" | {| border="1" cellspacing="2" cellpadding="2" | ||
| Line 90: | Line 91: | ||
|Etch rate | |Etch rate | ||
|'''6.25 nm/min on 6" wafer''', ''Summer sanvis@nanolab'' | |'''6.25 nm/min on 6" wafer''', ''Summer sanvis@nanolab'' | ||
|'''25 nm/min on small samples on Si carrier''', ''Summer sanvis@nanolab'' | |'''25 nm/min on small samples on Si carrier''', ''Summer 2022 sanvis@nanolab'' | ||
|- | |- | ||
| Line 130: | Line 131: | ||
===Results=== | ===Results=== | ||
<gallery caption="Profile view" widths="400px" heights="325px" perrow="3"> | <gallery caption="Profile view, etch time 40 min, started with 380 nm zep resist" widths="400px" heights="325px" perrow="3"> | ||
Image:S038116_01.jpg | Image:S038116_01.jpg | ||
| Line 146: | Line 147: | ||
Image:metalS038116top_04.jpg | Image:metalS038116top_04.jpg | ||
Image:metalS038116top_06.jpg | Image:metalS038116top_06.jpg | ||
</gallery> | </gallery> | ||
Latest revision as of 12:48, 14 May 2024
Feedback to this page: click here
Al2O3 etching with the ICP metal
| Parameter | Recipe name: Al2O3 Etch |
|---|---|
| Coil Power [W] | 1200 |
| Platen Power [W] | 200 |
| Platen temperature [oC] | 0 |
| BCl3 flow [sccm] | 60 |
| Cl2 flow [sccm] | 30 |
| Pressure [mTorr] | 4 |
| Material to be etched | Etch rate using the above parameters |
|---|---|
| Al2O3 |
|
Al2O3 etching by Sanjeev Vishal Kota sanvis@nanolab
| Parameter | Nanoscale Al2O3 etch | Microscale Al2O3 etch |
|---|---|---|
| Coil Power [W] | 300 | 500 |
| Platen Power [W] | 15 | 70 |
| Platen temperature [oC] | 0 | 0 |
| BCl3 flow [sccm] | 20 | 40 |
| Cl2 flow [sccm] | 7 | 15 |
| Pressure [mTorr] | 1.2 | 3.0 |
| Material to be etched | Nanoscale Al2O3 etch | Microscale Al2O3 etch |
|---|---|---|
| Etch rate | 6.25 nm/min on 6" wafer, Summer sanvis@nanolab | 25 nm/min on small samples on Si carrier, Summer 2022 sanvis@nanolab |
Al2O3 etching by bghe@nanolab
Recipes
| Parameter | Recipe 1:Al2O3 etch platen only |
|---|---|
| BCl3 (sccm) | 15 |
| Ar (sccm) | 15 |
| Pressure (mTorr) | 5 |
| Coil power (W) | 0 |
| Platen power (W) | 30 |
| Temperature (oC) | 20 |
| Spacers (mm) | 100 mm |
Results
- Profile view, etch time 40 min, started with 380 nm zep resist
- Top view after resist strip