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[[Category: Etch (Wet) bath|Aluminium]]
[[Category: Etch (Wet) bath|Aluminium]]


Wet etching of aluminium can be done using many different acids and bases. Using dilute phosphoric acid gives reasonably good control and compatibility with photoresists. Etching with dilute phosphoric acid is suitable for etching pure aluminium. If the aluminium is alloyed with other metals, other etchants may be better suited. Previously, aluminium with 1,5% silicon was used at DTU Nanolab. This alloy is no longer in use at DTU Nanolab but a suitable etchant (PES 77-19-04) for this alloy is included below.
Wet etching of aluminium can be done using many different acids and bases. Using dilute phosphoric acid gives reasonably good control and compatibility with photoresists. Etching with dilute phosphoric acid is suitable for etching pure aluminium. If the aluminium is alloyed with other metals, other etchants may be better suited. Previously, aluminium with 1,5% silicon was used at DTU Nanolab. This alloy is no longer in use at DTU Nanolab but a suitable etchant (Aluminum etch 80-15-3-2) for this alloy is included below.


=Wet Aluminium Etch=
=Wet Aluminium Etch=
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<br>
<br>
The first solution is always available ready made in the Aluminium Etch bath. The second solution can be mixed manually or bought pre-mixed and ready for use. Please contact DTU Nanolab if you need to use the Aluminum etch 80-15-3-2 etch mixture. Since it is used only very rarely it will probably have to be ordered when needed. The table below summarizes possibilities and parameter for the two etch mixtures.
The first solution is always available ready made in the Aluminium Etch bath. The second solution can be mixed manually or bought pre-mixed and ready for use. Please contact DTU Nanolab if you need to use the Aluminum etch 80-15-3-2 etch mixture. Since it is used only very rarely it will probably have to be ordered when needed. The table below summarizes possibilities and parameter for the two etch mixtures.
contact Wetchem if change off bath or want to use it in a beaker.




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!Location
!Location
|Bath inside Wet Bench 05 in D-3
|Bath inside Wet Bench 05 in D-3
|Beaker in Fumehood 1 or 2 in D-3
|Bath inside Wet Bench 05 in D-3
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[https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhES0xFTEZMVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K Kemibrug SDS: Phosphoric acid >25%]  
[https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhES0xFTEZMVGQlYzIlODclN2N2JWMyJTgzJTdlJWMyJTg4diVjMiU4OSU3ZSVjMiU4NCVjMiU4MyVjMiU4OCU1ZVlSSQ==#K Kemibrug SDS: Phosphoric acid >25%]  
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https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhETkZLR0tOS1RkJWMyJTg3JTdjdiVjMiU4MyU3ZSVjMiU4OHYlYzIlODklN2UlYzIlODQlYzIlODMlYzIlODglNWVZUkk=#K Kemibrug SDS: Phosphoric acid etch slution]  
[https://kemibrug.dk/Kemikalier/Action?id=RCU2MHolYzIlODIlN2UlYzIlODB2JWMyJTgxJTdleiVjMiU4N0RZeiVjMiU4OXYlN2UlYzIlODElYzIlODhETkZLR0tOS1RkJWMyJTg3JTdjdiVjMiU4MyU3ZSVjMiU4OHYlYzIlODklN2UlYzIlODQlYzIlODMlYzIlODglNWVZUkk=#K Kemibrug SDS: Phosphoric acid etch slution]  
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!Batch size
!Batch size
|1-25 wafers at a time
|1-25 wafers at a time
|Flexible
|1-25 wafers at a time
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|4" wafers
|4" wafers
6" wafers
6" wafers
|Any size that fits in beaker
|4" wafers
6" wafers
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See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=381 Cross Contamination Sheet] for Aluminium Etch bath
See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=381 Cross Contamination Sheet] for Aluminium Etch bath
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Any material allowed in cleanroom
See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=381 Cross Contamination Sheet] for Aluminium Etch bath
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