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Specific Process Knowledge/Lithography/Development/manualEbeam developer

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Developer: E-beam 02

 
Developer: E-beam 02 is located in E-4.

Developer: E-beam 02 is a manually operated, single substrate puddle developer. It uses the ZED-N50 or AR 600-50 developers and IPA for rinsing. The substrates are loaded manually one by one into the developer. Developer dispense, puddle time, IPA rinse, and drying is then performed automatically by the equipment.

Training video (for Developer: TMAH Manual, but it is the same model)

The user manual, user APV, and contact information can be found in LabManager - requires login

Process information

All recipes use the following structure:

  1. Pressurize the developer canister
  2. Dispense puddle while rotating substrate slowly
  3. Puddle development while not rotating
  4. Agitate substrate once per 15 seconds by rotating slowly for 1 second
  5. Spin off developer
  6. Clean substrate with IPA
  7. Dry substrate and chamber with nitrogen

Multi-puddle recipes repeat steps 2-5 for the given number of puddles.


Process recipes
N50 recipes have the letter "N" in them. AR-600-50 recipes have the letter "A" in them. The number is the development time in seconds:

  • 01 Rinse
  • 02 N 15
  • 03 N 30
  • 04 N 60
  • 05 N 90
  • 06 N 120
  • 07 N 180
  • 08 N 300
  • 09 N 600
  • 10 N 2x60
  • 11 N 5x60
  • 12 A 15
  • 13 A 30
  • 14 A 60
  • 15 A 90
  • 16 A 120
  • 17 A 180
  • 18 A 300
  • 19 A 600
  • 20 A 2x60
  • 21 A 5x60

Equipment performance and process related parameters

Purpose

Development of:

  • CSAR
  • ZEP520A
Developer
  • AR 600-50
  • ZED N-50
Method Development

Puddle

Handling
  • Chip chuck for chips
  • Non-vacuum chuck for 2" wafers
  • Non-vacuum chuck for 100 mm and 150 mm wafers
  • Non-vacuum chuck for 200 mm wafers
Process parameters Temperature

Room temperature

Agitation

1 second rotational agitation at 30 rpm every 15 seconds

Rinse

IPA

Substrates Substrate size
  • Chips
  • 2" wafers
  • 100 mm wafers
  • 150 mm wafers
  • 200 mm wafers
Allowed materials
  • All cleanroom approved materials
  • Film, or pattern, of all materials except Type IV
Batch size

1