Specific Process Knowledge/Lithography/Development/UV developer
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Developer: TMAH UV-lithography
Tool description
The Developer TMAH UV-lithography is a fully automatic and programmable cassette-to-cassette system, which can be used for post-exposure baking and development of UV resists on 100 mm and 150 mm substrates. The development is done using AZ 726 MIF, which is a 2.38% TMAH solution with wetting agent.
The developer dispense, puddle time, agitation, rinse and drying is controlled by the tool.
| Product: | Süss MicroTec Gamma 2M developer |
|---|---|
| Year of purchase: | 2014 |
| Location: | Cleanroom E-4 |
Chuck size and lift pins
Link to information about developer chuck size and hotplate pin positions.
User manual
The user manual and contact information can be found in LabManager - requires login
Tool training
Training on the tool requires users to complete the lithography TPT followed by the online tool training and a hands-on authorization training.
The tool training video is part of the online tool training, but can also be viewed here.
| Tool purpose |
Development of:
Development of DUV resists:
|
|---|---|
| Developer | AZ 726 MIF (2.38% TMAH) |
| Development method | Puddle |
| Handling method |
|
| Process temperature | Room temperature |
| Process agitaion | 1 cycles per 30 seconds |
| Process rinse | DI water |
| Substrate sizes |
|
| Substrate materials |
|
| Substrate batch size | 1-25 |
| Media flow rates |
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Process information