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Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Thermal evaporation of Cr in Thermal evaporator: Difference between revisions

Eves (talk | contribs)
Eves (talk | contribs)
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=== '''Deposition of 100 nm''' ===
=== '''Deposition of 100 nm''' ===


The adjusted tooling factor 173% was fine. Full 6" wafer is loaded for film characterisation. Measured base pressure before start 4.4 10<sup>-6</sup> Torr. Waited 1 hour before start. Deposition thickness setpoint is set to 100 nm.
The adjusted tooling factor 173% was fine. Full 6" wafer is loaded for film characterization. Measured base pressure before start 4.4 10<sup>-6</sup> Torr. Waited 1 hour before start. Deposition thickness setpoint is set to 100 nm.


Pressure fluctuations:
Pressure fluctuations: