Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Thermal evaporation of Cr in Thermal evaporator: Difference between revisions
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The adjusted tooling factor 173%. Full 6" wafer is loaded with shadow-mask. Deposition thickness setpoint is set to 100 nm. | The adjusted tooling factor 173%. Full 6" wafer is loaded with shadow-mask. Deposition thickness setpoint is set to 100 nm. | ||
Pressure fluctuations: | Pressure fluctuations during the ramp-up: | ||
* Rise 1 phase @ 0-15W: 4.4 10<sup>-6</sup> Torr → 6.2 10<sup>-6</sup> Torr | * Rise 1 phase @ 0-15W: 4.4 10<sup>-6</sup> Torr → 6.2 10<sup>-6</sup> Torr | ||
* Soak 1 phase @ 15W: 6.2 10<sup>-6</sup> Torr → 10<sup>-5</sup> Torr → 6.5 10<sup>-6</sup> Torr | * Soak 1 phase @ 15W: 6.2 10<sup>-6</sup> Torr → 10<sup>-5</sup> Torr → 6.5 10<sup>-6</sup> Torr | ||