Specific Process Knowledge: Difference between revisions
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2nd Level - Process Topic
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|Thermal SiO2 | |Thermal SiO2 | ||
|- | |- | ||
|[[Specific Process Knowledge/Thin film deposition| Thin film deposition]] | |rowspan="7" valign="top"|[[Specific Process Knowledge/Thin film deposition| Thin film deposition]] | ||
|Sputter deposition | |Sputter deposition | ||
|Metals: Ti, Cu, Al, Cr, Ag, Au, Pd, Ta, Cu, Ta, W, Mo, Co, Fe, Pt, Mg, Nb, Ni, Ru <br> | |Metals: Ti, Cu, Al, Cr, Ag, Au, Pd, Ta, Cu, Ta, W, Mo, Co, Fe, Pt, Mg, Nb, Ni, Ru <br> | ||
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Alloys: NiV, MnIr, NiFe, AlCu, CoFe, CuTi, FeMn, NiCo, TiW <br> | Alloys: NiV, MnIr, NiFe, AlCu, CoFe, CuTi, FeMn, NiCo, TiW <br> | ||
|- | |- | ||
|Thermal evaporation | |Thermal evaporation | ||
|Al, Ge, Ag | |Al, Ge, Ag | ||
|- | |- | ||
|E-beam evaporation | |E-beam evaporation | ||
|Metals: Ti, Cr, Al, Ni, Pt, Au, Mo, Pd, Ag, Cu, W, Ta <br> | |Metals: Ti, Cr, Al, Ni, Pt, Au, Mo, Pd, Ag, Cu, W, Ta <br> | ||
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Alloys: NiCr, TiAl | Alloys: NiCr, TiAl | ||
|- | |- | ||
|LPCVD | |LPCVD | ||
|Si3N4, SRN, SiO2, Si (poly and amorph) | |Si3N4, SRN, SiO2, Si (poly and amorph) | ||
|- | |- | ||
|PECVD | |PECVD | ||
|Si3N4, SiO2, PBSG | |Si3N4, SiO2, PBSG | ||
|- | |- | ||
|Electroplating | |Electroplating | ||
|Ni | |Ni | ||
|- | |- | ||
|Epitaxial growth /MOCVD | |Epitaxial growth /MOCVD | ||
|? | |? |
Revision as of 13:36, 10 November 2014
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