Specific Process Knowledge: Difference between revisions
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2nd Level - Process Topic
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!Materials | !Materials | ||
|- | |- | ||
|[[Specific Process Knowledge/Wafer cleaning|Wafer cleaning]] | |rowspan="5" valign="top" |[[Specific Process Knowledge/Wafer cleaning|Wafer cleaning]] | ||
|Soap Sonic | |Soap Sonic | ||
|Removes dust and particles | |Removes dust and particles | ||
|- | |- | ||
|7-up & Piranha | |7-up & Piranha | ||
|Removes traces of organics and alkali ions | |Removes traces of organics and alkali ions | ||
|- | |- | ||
|RCA | |RCA | ||
|Two step process to remove traces of organics and metals | |Two step process to remove traces of organics and metals | ||
|- | |- | ||
|5% HF | |5% HF | ||
|Removes native oxide | |Removes native oxide | ||
|- | |- | ||
|IMEC | |IMEC | ||
|Removing dust, traces of organics and alkali ions and slightly polish the surface. | |Removing dust, traces of organics and alkali ions and slightly polish the surface. |
Revision as of 13:33, 10 November 2014
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