Specific Process Knowledge/Thin film deposition/Deposition of Tungsten/Evaporation of W in Temescal

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This page is written by Evgeniy Shkondin @DTU Nanolab if nothing else is stated.
All images and photos on this page belongs to DTU Nanolab.
The fabrication and characterization described below were conducted in 2022 by Evgeniy Shkondin, DTU Nanolab.

Deposition of W in Temescal

This page describes deposition of W in Temescal.

During the e-beam deposition of Tungsten, extremely bright light and heat are generated! Lower density film than expected due to porosity. Consider using sputtering instead.

Power 33W, stable rate, tooling 86%. Measured thickness 20 nm (XRR).

Wait for base pressure 3 10-7Torr before start.


Deposition of Tungsten. Dep. rate: 0.5Å/s, Thickness sp.: 20nm
Tooling factor 86% 2022-02-25
Layer name Thickness (nm) Density (g/cm3) Rougness (nm) Delta Beta
Moisture 0.80 0.52 0.52 1.7906e-6 4.1579e-8
WOx

1.01

 5.00 0.72 1.6991e-5 3.9456e-7
W

19.12

 15.66 0.81 3.7045e-5 2.9324e-6
SiO2 (native oxide) 2.09 2.15 0.32 7.0136e-6 1.6287e-7
Si (wafer) 2.33 0.00 7.5860e-6 1.7616e-7


  • XRR analysis of e-beam deposited Ta thin film.
  • X-ray reflectivity. Measurement and Fit. Tooling 86%. Seems that this deposition suffered from a high oxidation level. (low fitted density of the main Ta layer) or poures formation
    X-ray reflectivity. Measurement and Fit. Tooling 86%. Seems that this deposition suffered from a high oxidation level. (low fitted density of the main Ta layer) or poures formation
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