Specific Process Knowledge/Thin film deposition/Deposition of TiW

From LabAdviser

Feedback to this page: click here

Unless otherwise stated, this page is written by DTU Nanolab internal

Sputtering of TiW

Deposition of TiW alloy can be done in the Wordentec. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).


Sputter deposition (Wordentec)
General description Sputter deposition of TiW
Pre-clean RF Ar clean (not working at the moment (sept 2022))
Layer thickness .
Deposition rate Depending on process parameters, see here.
Batch size
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
Allowed substrates
  • Silicon wafers
  • Quartz wafers
  • Pyrex wafers
Allowed materials
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
Comments TiW alloy: 10%/90% by weight
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW&oldid=46457"