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Specific Process Knowledge/Lithography/Resist/UVresist/exposureDoseNaOH

From LabAdviser

Exposure dose when using AZ 351B as developer

The exposure doses listed below are for generic good exposure results, and can be a compromise between getting good lines, as well as good dots, in both clear field and dark field exposures. The optimal dose for any given specific project, could be different from the listed values.

All doses are for standard silicon wafers, unless otherwise stated. Development is done using AZ 351B developer (NaOH) diluted 1:5.


Aligner: MA6-1

The Aligner: MA6-1 has an i-line notch filter installed. This produces an exposure light peak around 365 nm with a FWHM of 7 nm.

Quality control
Please note that the values listed in the table are not routinely tested as part of quality control.

Date Operator Film thickness Exposure mode Dose Resolution Comments
AZ 5214E Long ago ? 1.5 µm ? 70 mJ/cm2 ? µm Not under regular quality control

Development: 60 s submersion
AZ 5214E Long ago ? 2.2 µm ? 72 mJ/cm2 ? µm Not under regular quality control

Development: 70 s submersion
AZ 5214E Long ago ? 4.2 µm ? 160 mJ/cm2 ? µm Not under regular quality control

Development: 180 s submersion
AZ 5214E
Image reversal
Long ago ? 1.5 µm ? 30 mJ/cm2 ? µm Not under regular quality control

Reversal bake: 100 s @ 110°C
Flood exposure: 210 mJ/cm2
Development: 60 s submersion
AZ 5214E
Image reversal
Long ago ? 2.2 µm ? 35 mJ/cm2 ? µm Not under regular quality control

Reversal bake: 100 s @ 110°C
Flood exposure: 210 mJ/cm2
Development: 70 s submersion
AZ 4562 Long ago ? 10 µm ? 320 mJ/cm2 ? µm Not under regular quality control

Priming: HMDS
Rehydration after SB: none
Exposure: Multiple exposures with 15 s pauses is recommended
Degassing after exposure: none
Development: 300 s submersion

New resists version in 2023
As of 2023-03-21 we no longer have any of the old versions of the resists: AZ 5214E, AZ 4562, AZ MiR 701. This table contains only information about the old resist versions.