Specific Process Knowledge/Lithography/Resist/UVresist/exposureDoseMaskAligners
Exposure dose for mask aligners
The exposure doses listed below are for generic good exposure results, and can be a compromise between getting good lines, as well as good dots, in both clear field and dark field exposures. The optimal dose for any given specific project, could be different from the listed values.
All doses are for standard silicon wafers, unless otherwise stated. Development is done using 2.38% TMAH (AZ 726 MIF).
Aligner: MA6-1
The Aligner: MA6-1 has an i-line notch filter installed. This produces an exposure light peak around 365 nm with a FWHM of 7 nm.
Quality control
Please note that the values listed in the table are not routinely tested as part of quality control.
| Date | Operator | Film thickness | Exposure mode | Dose | Resolution | Comments | |
|---|---|---|---|---|---|---|---|
| AZ MIR 701 | Long ago | ? | 1.5 µm | ? | 180 mJ/cm2 | ? µm | Not under regular quality control Post exposure bake: 60 s @ 110°C Development: 60 s puddle |
| AZ MIR 701 | Long ago | ? | 2.0 µm | ? | 200 mJ/cm2 | ? µm | Not under regular quality control Post exposure bake: 60 s @ 110°C Development: 60 s puddle |
| AZ MIR 701 | Long ago | ? | 4.0 µm | ? | 400 mJ/cm2 | ? µm | Not under regular quality control Post exposure bake: 60 s @ 110°C Development: 60 s puddle |
| AZ 5214E | Long ago | ? | 1.5 µm | ? | 72 mJ/cm2 | ? µm | Not under regular quality control Development: 60 s puddle |
| AZ 5214E | Long ago | ? | 2.2 µm | ? | 80 mJ/cm2 | ? µm | Not under regular quality control Development: 60 s puddle |
| AZ 5214E | Long ago | ? | 4.2 µm | ? | 160 mJ/cm2 | ? µm | Not under regular quality control Development: 60 s puddle |
| AZ 5214E Image reversal |
Long ago | ? | 2.2 µm | ? | ? mJ/cm2 | ? µm | Not under regular quality control Reversal bake: 60 s @ 110°C Flood exposure: 500 mJ/cm2 Development: 60 s puddle |
| AZ nLOF 2020 | Long ago | ? | 2.0 µm | ? | 121 mJ/cm2 | ? µm | Not under regular quality control Post exposure bake: 60 s @ 110°C Development: 60 s puddle Side wall angle: ~15° For smaller angle (~5°): develop 30 seconds instead |
| AZ 4562 | Long ago | ? | 10 µm | ? | 510 mJ/cm2 | ≤5 µm | Not under regular quality control Priming: HMDS Rehydration after SB: none Exposure: Multiple exposures with 15 s pauses is recommended Degassing after exposure: none Development: 5 x 60 s multi puddle |
New resists version in 2023
As of 2023-03-21 we no longer have any of the old versions of the resists: AZ 5214E, AZ 4562, AZ MiR 701. This table contains only information about the old resist versions.
Aligner: MA6-2
The Aligner: MA6-2 has an i-line notch filter installed. This produces an exposure light peak around 365 nm with a FWHM of 7 nm.
Quality control
Please note that the values listed in the table are not routinely tested as part of quality control.
| Date | Operator | Film thickness | Exposure mode | Dose | Resolution | Comments | |
|---|---|---|---|---|---|---|---|
| AZ MIR 701 | 2023-09-26 | taran | 1.5 µm | Hard contact | 150 mJ/cm2 | ? µm | Not under regular quality control Post exposure bake: 60 s @ 110°C Development: 60 s puddle |
| AZ 5214E | 2025-09-30 | jehem | 1.5 µm | Hard contact | 90 mJ/cm2 | 1.5 µm | Not under regular quality control Development: 60 s puddle |
| AZ 5214E Image reversal |
2023-01-11 | jehem | 2.2 µm | Hard contact | 22 mJ/cm2 | 2.0 µm | Not under regular quality control Reversal bake: 60 s @ 110°C Flood exposure: 500 mJ/cm2 Development: 60 s puddle |
| AZ nLOF 2020 | 2023-09-26 | taran | 2.0 µm | Hard contact | 121 mJ/cm2 | ? µm | Not under regular quality control Post exposure bake: 60 s @ 110°C Development: 60 s puddle |
| AZ 4562 | 2021-12-08 | jehem | 10 µm | Soft contact | 550 mJ/cm2 | ≤5 µm | Not under regular quality control Priming: HMDS Rehydration after SB: none Exposure: Single exposure Degassing after exposure: none Development: 5 x 60 s multi puddle |
New resists version in 2023
As of 2023-03-21 we no longer have any of the old versions of the resists: AZ 5214E, AZ 4562, AZ MiR 701. This table contains only information about the new resist versions.