Specific Process Knowledge/Lithography/Coaters/GammaDUV
Spin coater: Süss stepper
This spinner is dedicated for spinning DUV resists. The spinner is fully automatic and can run up to 25 substrates in a batch 4", 6", and 8" size (8" requires tool change). The machine is equipped with the 3 resist lines (DUV42S-6, KRF M230Y, and KRF M35G), as well as a syringe dispense system.
The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager:
Equipment info in LabManager - requires login
DUV resist overview
The spinning process will be performed by the customer together with the Photolith group of Nanolab. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers together with you.
Bottom Anti Reflection Coating (BARC):
Positive DUV resist for spin coating in 600-300nm thickness range:
Positive DUV resist for spin coating in 1600-800nm thickness range:
Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range:
- Manufacturers website: UVN2300-0.8
- Datasheet: UVN2300-0.8 - requires login
Process information
Purpose |
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Resist |
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Performance | Coating thickness |
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Process parameters | Spin speed |
10 - 5000 rpm | |
Spin acceleration |
100 - 10000 rpm/s | ||
Hotplate temperature |
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Substrates | Substrate size |
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Allowed materials |
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Batch |
1 - 25 |