Specific Process Knowledge/Etch/ICP Metal Etcher/silicon/nano/Sinan332
The Sinano3.32 recipe
Recipe | Gas | BCl3 5 sccm, HBR 15 sccm |
---|---|---|
Pressure | 2 mTorr, Strike 3 secs @ 5 mTorr | |
Power | 900 W CP, 30 W PP | |
Temperature | 50 degs | |
Hardware | 100 mm Spacers | |
Time | 60, 120 and 180 secs | |
Conditions | Run ID | 465, 466 and 467 |
Conditioning | Sequence: Oxygen clean, MU tests, processes, no oxygen between runs | |
Mask | 211 nm zep |
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The 30 nm trenches etched 60 seconds
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The 60 nm trenches etched 60 seconds
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The 90 nm trenches etched 60 seconds
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The 120 nm trenches etched 60 seconds
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The 150 nm trenches etched 60 seconds
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The 30 nm trenches etched 120 seconds
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The 60 nm trenches etched 120 seconds
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The 90 nm trenches etched 120 seconds
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The 120 nm trenches etched 120 seconds
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The 150 nm trenches etched 120 seconds
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The 30 nm trenches etched 180 seconds
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The 60 nm trenches etched 180 seconds
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The 90 nm trenches etched 180 seconds
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The 120 nm trenches etched 180 seconds
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The 150 nm trenches etched 180 seconds
Nominal trench line width | ' | 30 | 60 | 90 | 120 | 150 | Average | Std. dev. |
Etch rate | nm/min | 44 | 57 | 59 | 64 | 63 | 57 | 8 |
Sidewall angle | degs | 73 | 74 | 76 | 78 | 73 | 75 | 2 |
CD loss | nm/edge | -4 | -15 | -14 | -12 | -32 | -15 | 10 |
CD loss foot | nm/edge | 1 | -1 | 0 | -1 | -4 | -1 | 2 |
Bowing | 4 | 6 | 1 | 6 | 1 | 4 | 2 | |
Bottom curvature | -14 | -9 | -5 | -1 | -1 | -6 | 5 | |
Zep etch rate | nm/min | 33 | ||||||
Nominal trench line width | ' | 30 | 60 | 90 | 120 | 150 | Average | Std. dev. |
Etch rate | nm/min | 48 | 60 | 67 | 69 | 71 | 63 | 9 |
Sidewall angle | degs | 78 | 78 | 76 | 75 | 75 | 76 | 1 |
CD loss | nm/edge | -1 | -12 | -15 | -13 | -30 | -14 | 10 |
CD loss foot | nm/edge | 5 | 1 | -1 | -1 | -3 | 0 | 3 |
Bowing | 7 | 8 | 16 | 20 | 19 | 14 | 6 | |
Bottom curvature | -22 | -12 | 6 | 8 | 5 | -3 | 13 | |
Zep etch rate | nm/min | 22 | ||||||
Nominal trench line width | ' | 30 | 60 | 90 | 150 | Average | Std. dev. |
Etch rate | nm/min | 43 | 59 | 65 | 70 | 59 | 12 |
Sidewall angle | degs | 82 | 80 | 79 | 77 | 79 | 2 |
CD loss | nm/edge | -5 | -16 | -18 | -30 | -17 | 10 |
CD loss foot | nm/edge | 1 | -3 | -4 | -3 | -2 | 2 |
Bowing | 9 | 19 | 24 | 31 | 21 | 9 | |
Bottom curvature | -30 | -16 | -8 | 13 | -10 | 18 | |
Zep etch rate | nm/min | 19 | |||||