Specific Process Knowledge/Etch/ICP Metal Etcher/Barc Etch
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Barc Etch
Etching barc with a CF4 recipe for barc etching is a good idea if you are on the limit of having enough DUV resist mask to reach etch depth you need. Here is an example of a barc etch I have started testing. I have also tried with and O2 descum process for comparison.
Parameter | Barc etch with CF4 | Barc etch with O2 |
---|---|---|
Coil power | 800W | 120w |
Platen power | 100W | 15W |
Pressure | 3 mTorr | 5mTorr |
Flow rate CF4 | 4 sccm | |
Flow rate H2 | 20sccm | |
Flow rate O2 | 10sccm | |
T | 0 degrees | 0 degrees |
Parameter | Results with 'Barc etch with CF' | Results with 'Barc etch with O2' |
---|---|---|
Etch rate in barc | 52 nm in 30s [bghe 20150519] | 62 nm in 50s [bghe 20150521] |
Etch rate in KRF resist | 27 nm in 30s [bghe 20150519] | 73 nm in 50s [bghe 20150521] |
Selectivity KRF:Barc | 1:2 | 1:0.8 |
Etch 65nm barc | Use 40-45s | Use 55-60s |